# US 12,009,321 B2 · Package system and package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,321 B2 - Document ID: US12009321B2 - Status: Granted - Kind: B2 - Application number: 17/131,863 - Filed: 2020-12-23 - Published: 2022-06-23 - Granted: 2024-06-11 - Earliest claimed: 2020-12-23 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Zhen Zhou; Tae Young Yang; Tolga Acikalin; Johanny Escobar Pelaez; Kenneth P. Foust; Chia-Pin Chiu; Renzhi Liu; Cheng-Yuan Chin - Web page: https://patentgrep.com/patent/US12009321B2 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/422: {comprising two or more layers of dielectric material (H01Q1/425 takes precedence)} - H01Q 15/002: {said selective devices being reconfigurable or tunable, e.g. using switches or diodes} - H01Q 15/0026: {said selective devices having a stacked geometry or having multiple layers} - H01Q 15/147: {provided with means for controlling or monitoring the shape of the reflecting surface (for scanning H01Q3/01; aerials or aerial systems providing multiple beamwidths H01Q25/002)} - H01Q 15/148: {with means for varying the reflecting properties (H01Q15/147 takes precedence)} - H10D 1/64: Variable-capacitance diodes, e.g. varactors - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 70/69: Insulating materials thereof - H10W 90/293: {characterised by non-galvanic coupling between the chips, e.g. capacitive coupling} - H10W 44/216: {Waveguides, e.g. strip lines} - H10W 44/248: {for antennas} - H10W 70/63: Vias, e.g. via plugs - H10W 72/07254: {changes in dispositions} - H10W 72/247: {Dispositions of multiple bumps} - H10W 90/00: Package configurations - H10W 90/26: the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape - H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element. ## Claims ### Claim 1 A package system, comprising: at least a first package and a second package on a package carrier, wherein the first package and the second package are arranged on a same side of the package carrier, wherein each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals; a cover arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package, wherein the cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package, wherein the predefined pattern is configured as a frequency selective surface; and a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package, wherein the radio frequency signal interface comprises the at least one conductive element. ### Claim 2 (depends on 1) The package system of claim 1, wherein the at least one conductive element is configured as electrically floating. ### Claim 3 (depends on 1) The package system of claim 1, wherein the frequency selective surface is configured selective for the frequencies of radio frequency signal interface. ### Claim 4 (depends on 1) The package system of claim 1, wherein the at least one conductive element comprises a plurality of metal structures. ### Claim 5 (depends on 4) The package system of claim 4, wherein the plurality of metal structures are electrically isolated from each other. ### Claim 6 (depends on 1) The package system of claim 1, wherein the predefined pattern is configured as a reflector array. ### Claim 7 (depends on 1) The package system of claim 1, wherein the cover comprises a multilayer structure, and wherein the multilayer structure comprises the frequency selective surface. ### Claim 8 (depends on 7) The package system of claim 7, wherein cover incudes a flexible carrier, and wherein the multilayer structure is arranged on the flexible carrier. ### Claim 9 (depends on 8) The package system of claim 8, wherein the flexible carrier comprises at least one dielectric layer. ### Claim 10 (depends on 7) The package system of claim 7, wherein the cover comprises a metallic cover, and wherein the multilayer structure is conformably attached to the metallic cover. ### Claim 11 (depends on 8) The package system of claim 8, wherein the flexible carrier comprises an electronic switch, and wherein the electronic switch is at least one of a switch embedded in the flexible carrier, a switch integrated in the flexible carrier or a switch printed out on the flexible carrier. ### Claim 12 (depends on 8) The package system of claim 8, wherein the flexible carrier has a thickness in a range of about 0.5 mm to 5.0 mm, and wherein the flexible carrier comprises or is formed of a material having a relative dielectric permittivity in a range of about 3 to 6. ### Claim 13 (depends on 1) The package system of claim 1, wherein at least one of the first package or the second package comprises an edge antenna, wherein the edge antenna is configured to be coupled to the reflector array in a near field. ### Claim 14 (depends on 1) The package system of claim 1, wherein the predefined pattern comprises a plurality of unit cells, wherein the plurality of unit cells is part of the reflector array. ### Claim 15 (depends on 14) The package system of claim 14, wherein the plurality of unit cells are embedded in the flexible carrier. ### Claim 16 (depends on 14) The package system of claim 14, wherein each of the unit cells comprises a 1-bit phase shifter. ### Claim 17 (depends on 16) The package system of claim 16, wherein the 1-bit phase shifter comprises a first NMOS transistor switch and a second NMOS transistor switch, and wherein a slot line is arranged on a ground plane of the multilayer structure. ### Claim 18 (depends on 7) The package system of claim 7, wherein the multilayer structure comprises a microstrip patch array, and wherein the microstrip patch array is the predefined pattern configured as the frequency selective surface. ### Claim 19 (depends on 18) The package system of claim 18, wherein at least one of the size of the patch or the period of the patch is configured regarding a predefined resonant frequency of the frequency selective surface. ### Claim 20 (depends on 1) The package system of claim 1, wherein the predefined pattern comprises a first varactor diode and a second varactor diode. ### Claim 21 (depends on 14) The package system of claim 14, wherein the cover comprises a bias network based on rows and columns, wherein a unit cell is arranged at each crossing point of the rows and columns, and wherein each unit cells of the least one of the same row or the same column are coupled to a common control line. ### Claim 22 (depends on 14) The package system of claim 14, wherein each of the unit cells is configured to accept a first input voltage and a second input voltage to drive a first varactor or a second varactor. ### Claim 23 (depends on 1) The package system of claim 1, wherein the predefined pattern is configured as a holographic pattern comprising a plurality of unit cells. ### Claim 24 A package, comprising: at least a first die and a second die on a carrier, wherein the first die and the second die are arranged on a same side of the carrier, wherein each of the first die and the second die comprises an antenna to transmit and/or receive radio frequency signals; a cover arranged at a distance over the first die and the second die at the same side of the carrier as the first die and the second die, wherein the cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first die and the second die, wherein the predefined pattern is configured as a frequency selective surface; and a radio frequency signal interface wirelessly connecting the antennas of the first die and the second die, wherein the radio frequency signal interface comprises the at least one conductive element.