# US 12,009,320 B2 · Interconnect loss of high density package with magnetic material

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- Number: US 12,009,320 B2
- Document ID: US12009320B2
- Status: Granted
- Kind: B2
- Application number: 16/596,383
- Filed: 2019-10-08
- Published: 2021-04-08
- Granted: 2024-06-11
- Earliest claimed: 2019-10-08
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Zhiguo Qian; Cemil Geyik; Jiwei Sun; Gang Duan; Kemal Aygün
- Web page: https://patentgrep.com/patent/US12009320B2

## CPC

- H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/66: Conductive materials thereof
- H10W 70/685: comprising multiple insulating layers
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 44/223: {Differential pair signal lines}
- H10W 44/248: {for antennas}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments include package substrates and a semiconductor package with such package substrates. A package substrate includes a first conductive layer in a first magnetic layer, and a second magnetic layer over the first magnetic layer, where the first and second magnetic layers include magnetic materials. The package substrate also includes a second conductive layer in the second magnetic layer. The second conductive layer includes a plurality of first traces fully surrounded by the first and second magnetic layers. The package substrate includes a third conductive layer over the second magnetic layer. The magnetic materials may include manganese Mn ferrite materials, Zn/Mn ferrite materials, or Ni/Zn ferrite materials. The magnetic materials include material properties with a low constant value, a magnetic tangent value, a frequency, a base filler chemistry, a filler shape, a filler orientation, a filler percentage, a loading fraction value, a permeability, an insertion loss, and a resin formulation.

## Claims

### Claim 1

A package substrate, comprising:
a first conductive layer in a first magnetic layer;
a second magnetic layer over the first magnetic layer, wherein the first and second magnetic layers include a plurality of magnetic materials;
a second conductive layer in the second magnetic layer, wherein the second conductive layer includes a plurality of first traces, and wherein the plurality of first traces are fully surrounded by the first and second magnetic layers, wherein the second conductive layer further includes a plurality of second traces, wherein the plurality of first traces are a plurality of single-ended routing traces, wherein the plurality of second traces are a plurality of differential routing traces, wherein the plurality of single-ended routing traces have a width and a line spacing that is lower than a width and a line spacing of the plurality of differential routing traces, and wherein the plurality of single-ended routing traces and the plurality of differential routing traces are fully surrounded by the plurality of magnetic materials; and
a third conductive layer over the second magnetic layer, wherein the plurality of magnetic materials include manganese (Mn) ferrite materials, zinc (Zn) and Mn (Zn/Mn) ferrite materials, or nickel (Ni) and Zn (Ni/Zn) ferrite materials.

### Claim 2 (depends on 1)

The package substrate of claim 1, wherein the plurality of second traces are fully surrounded by the first and second magnetic layers.

### Claim 3 (depends on 1)

The package substrate of claim 1, further comprising a plurality of build-up layers that extend from a bottommost surface to a topmost surface.

### Claim 4 (depends on 3)

The package substrate of claim 3, wherein each of the plurality of build-up layers includes the plurality of magnetic materials.

### Claim 5 (depends on 1)

The package substrate of claim 1, wherein the plurality of magnetic materials include a plurality of material properties, and wherein the plurality of material properties include a low constant value, a magnetic tangent value, a frequency, a base filler chemistry, a filler shape, a filler orientation, a filler percentage, a loading fraction value, a permeability, an insertion loss, and a resin formulation.

### Claim 6 (depends on 5)

The package substrate of claim 5, wherein the low constant value is approximately 2, wherein the base filler chemistry includes Mn ferrite, Zn/Mn ferrite, or Ni/Zn ferrite, wherein the filler percentage of the base filler chemistry is approximately 5% to 95%, wherein the magnetic tangent value is approximately 0.00 to 0.03, wherein the frequency is approximately 10 MHz to 50 MHz, wherein the filler shape includes a spherical type, a crushed type, or one or more types of specified shapes, and wherein the permeability is approximately 5 to 20.

### Claim 7

A package substrate, comprising:
a first conductive layer in a first magnetic layer;
a second magnetic layer over the first magnetic layer, wherein the first and second magnetic layers include a plurality of magnetic materials;
a second conductive layer in the second magnetic layer, wherein the second conductive layer includes a plurality of first traces, and wherein the plurality of first traces are fully surrounded by the first and second magnetic layers; and
a third conductive layer over the second magnetic layer, wherein the plurality of magnetic materials include manganese (Mn) ferrite materials, zinc (Zn) and Mn (Zn/Mn) ferrite materials, or nickel (Ni) and Zn (Ni/Zn) ferrite materials, wherein the plurality of magnetic materials include a plurality of material properties, and wherein the plurality of material properties include a low constant value, a magnetic tangent value, a frequency, a base filler chemistry, a filler shape, a filler orientation, a filler percentage, a loading fraction value, a permeability, an insertion loss, and a resin formulation, wherein the low constant value is approximately 2, wherein the base filler chemistry includes Mn ferrite, Zn/Mn ferrite, or Ni/Zn ferrite, wherein the filler percentage of the base filler chemistry is approximately 5% to 95%, wherein the magnetic tangent value is approximately 0.00 to 0.03, wherein the frequency is approximately 10 MHz to 50 MHz, wherein the filler shape includes a spherical type, a crushed type, or one or more types of specified shapes, and wherein the permeability is approximately 5 to 20.

### Claim 8 (depends on 7)

The package substrate of claim 7, wherein the second conductive layer further includes a plurality of second traces.

### Claim 9 (depends on 8)

The package substrate of claim 8, wherein the plurality of second traces are fully surrounded by the first and second magnetic layers.

### Claim 10 (depends on 7)

The package substrate of claim 7, further comprising a plurality of build-up layers that extend from a bottommost surface to a topmost surface.

### Claim 11 (depends on 10)

The package substrate of claim 10, wherein each of the plurality of build-up layers includes the plurality of magnetic materials.

### Claim 12 (depends on 8)

The package substrate of claim 8, wherein the plurality of first traces are a plurality of single-ended routing traces, and wherein the plurality of second traces are a plurality of differential routing traces.