# US 12,009,291 B2 · Electronic device including semiconductor layer with width variation design

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,009,291 B2
- Document ID: US12009291B2
- Status: Granted
- Kind: B2
- Application number: 18/122,133
- Filed: 2023-03-16
- Published: 2023-07-20
- Granted: 2024-06-11
- Earliest claimed: 2019-09-10
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: Chiu-Yuan Huang; Pei-Chieh Chen; Yu-Ting Liu; Tsung-Yeh Ho
- Web page: https://patentgrep.com/patent/US12009291B2

## CPC

- H05K 1/0259: {Electrostatic discharge [ESD] protection}
- G02F 1/133305: {Flexible substrates, e.g. plastics, organic film}
- G02F 1/13458: {Terminal pads}
- G02F 1/136204: {Arrangements to prevent high voltage or static electricity failures}
- H01R 12/7076: {for connection between PCB and component, e.g. display}
- H01R 12/77: for flexible printed circuits, flat or ribbon cables or like structures
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H10K 77/111: {Flexible substrates}
- H10W 70/688: {Flexible insulating substrates}
- H05K 1/162: {incorporating printed capacitors}
- H05K 1/167: {incorporating printed resistors}
- H05K 2201/09009: Substrate related
- H05K 2201/09263: Meander
- H05K 2201/09727: Varying width along a single conductor; Conductors or pads having different widths
- H05K 2201/10128: Display
- H10W 70/65: Shapes or dispositions of interconnections
- Y02E 10/549: Organic PV cells
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.

## Claims

### Claim 1

An electronic device, comprising:
a substrate, comprising an edge;
a conductive element disposed on the substrate;
a first insulating layer disposed on the conductive element; and
a semiconductor layer disposed on the first insulating layer,
wherein in a top view, the semiconductor layer has a first portion extending to the edge of the substrate along a first direction, and the semiconductor layer has a second portion connecting the first portion and disposed between the first portion and the conductive element, the first portion has a first minimum width in a second direction perpendicular to the first direction, the second portion has a second minimum width in the second direction, and the first minimum width is less than the second minimum width.

### Claim 2 (depends on 1)

The electronic device as claimed in claim 1, wherein a combination of the first portion and the second portion of the semiconductor layer has a T shape.

### Claim 3 (depends on 2)

The electronic device as claimed in claim 2, wherein a length of the second portion in the first direction is less than a length of the first portion in the first direction.

### Claim 4 (depends on 1)

The electronic device as claimed in claim 1, wherein an edge of the second portion is adjacent to an edge of the conductive element.

### Claim 5 (depends on 1)

The electronic device as claimed in claim 1, further comprising another conductive element connected to the conductive element.

### Claim 6 (depends on 5)

The electronic device as claimed in claim 5, wherein a distance is included between the conductive element and the another conductive element in the second direction, and the distance is different from the first minimum width of the first portion or the second minimum width of the second portion.

### Claim 7 (depends on 1)

The electronic device as claimed in claim 1, further comprising a conductive layer disposed on the semiconductor layer and the conductive element.

### Claim 8 (depends on 7)

The electronic device as claimed in claim 7, further comprising a second insulating layer disposed between the conductive layer and the semiconductor layer.