# US 12,009,285 B2 · Substrate having a recessed portion for an electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,285 B2 - Document ID: US12009285B2 - Status: Granted - Kind: B2 - Application number: 17/604,779 - Filed: 2020-04-22 - Published: 2022-06-23 - Granted: 2024-06-11 - Earliest claimed: 2019-04-22 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Yoshitomo Onitsuka; Tomoyuki Iwata - Web page: https://patentgrep.com/patent/US12009285B2 ## CPC - H10W 70/451: {Multilayered leadframes} - H10W 70/692: Ceramics or glasses - H10W 20/083: {the openings being via holes penetrating underlying conductors} - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 20/42: Vias, e.g. via plugs - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 70/095: {of vias therein} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/685: comprising multiple insulating layers - H10W 70/69: Insulating materials thereof - H10W 72/073: {of die-attach connectors} - H10W 72/30: Die-attach connectors - H10W 76/12: characterised by their shape - H10W 76/153: having interconnections in passages through the insulating or insulated base - H10W 46/301: {for alignment} - H10W 46/607: {Located on parts of packages, e.g. on encapsulations or on package substrates} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A package for housing an electronic component includes: a base portion including a first surface including a recessed portion in which an electronic component is mounted and also including a second surface located on an opposite side to the first surface; an external connection conductor located on the second surface; internal wiring located inside the base portion; first wiring located on the second surface and connected to the internal wiring; and second wiring located between the first wiring and the external connection conductor and connected to the external connection conductor, in which the first wiring and the second wiring are covered with an insulating layer. ## Claims ### Claim 1 A package for housing an electronic component comprising: an insulating substrate comprising: a first surface comprising a recessed portion in which an electronic component is mounted; and a second surface located on an opposite side to the first surface; an external connection conductor located on the second surface; internal wiring located inside the insulating substrate; first wiring located on the second surface and connected to the internal wiring; and second wiring located between the first wiring and the external connection conductor and connected to the external connection conductor, wherein the insulating substrate includes: a base portion having the second surface; and a frame portion having the first surface and located on the base portion, the first wiring, the second wiring, and the external connection conductor are a continuous conductor, the first wiring and the second wiring are covered with an insulating layer, the second wiring is located so as to overlap the frame portion in a perspective plan view and is configured to be electrically independent of the first wiring by being partially cut. ### Claim 2 (depends on 1) The package for housing an electronic component according to claim 1, wherein the second wiring is located on an inner side of the base portion relative to the external connection conductor in a perspective plan view. ### Claim 3 (depends on 2) The package for housing an electronic component according to claim 2, wherein the second wiring has a portion located between an outer edge of the base portion and the recessed portion in a perspective plan view. ### Claim 4 (depends on 3) The package for housing an electronic component according to claim 3, wherein the second wiring comprises a narrow portion having a narrow width. ### Claim 5 (depends on 3) The package for housing an electronic component according to claim 3, further comprising: an electrode located in the recessed portion, wherein the first wiring is electrically connected to the electrode through the internal wiring. ### Claim 6 (depends on 2) The package for housing an electronic component according to claim 2, wherein the second wiring comprises a narrow portion having a narrow width. ### Claim 7 (depends on 2) The package for housing an electronic component according to claim 2, further comprising: an electrode located in the recessed portion, wherein the first wiring is electrically connected to the electrode through the internal wiring. ### Claim 8 (depends on 2) The package for housing an electronic component according to claim 2, further comprising: a frame-shaped metallization layer disposed at the first surface, wherein the first wiring is electrically connected to the frame-shaped metallization layer through the internal wiring. ### Claim 9 (depends on 1) The package for housing an electronic component according to claim 1, wherein the second wiring has a portion located between an outer edge of the base portion and the recessed portion in a perspective plan view. ### Claim 10 (depends on 9) The package for housing an electronic component according to claim 9, wherein the second wiring comprises a narrow portion having a narrow width. ### Claim 11 (depends on 9) The package for housing an electronic component according to claim 9, further comprising: an electrode located in the recessed portion, wherein the first wiring is electrically connected to the electrode through the internal wiring. ### Claim 12 (depends on 9) The package for housing an electronic component according to claim 9, further comprising: a frame-shaped metallization layer disposed at the first surface, wherein the first wiring is electrically connected to the frame-shaped metallization layer through the internal wiring. ### Claim 13 (depends on 1) The package for housing an electronic component according to claim 1, wherein the second wiring comprises a narrow portion having a narrow width. ### Claim 14 (depends on 13) The package for housing an electronic component according to claim 13, further comprising: an electrode located in the recessed portion, wherein the first wiring is electrically connected to the electrode through the internal wiring. ### Claim 15 (depends on 13) The package for housing an electronic component according to claim 13, further comprising: a frame-shaped metallization layer disposed at the first surface, wherein the first wiring is electrically connected to the frame-shaped metallization layer through the internal wiring. ### Claim 16 (depends on 1) The package for housing an electronic component according to claim 1, further comprising: an electrode located in the recessed portion, wherein the first wiring is electrically connected to the electrode through the internal wiring. ### Claim 17 (depends on 16) The package for housing an electronic component according to claim 16, further comprising: a frame-shaped metallization layer disposed at the first surface, wherein the first wiring is electrically connected to the frame-shaped metallization layer through the internal wiring. ### Claim 18 (depends on 1) The package for housing an electronic component according to claim 1, further comprising: a frame-shaped metallization layer disposed at the first surface, wherein the first wiring is electrically connected to the frame-shaped metallization layer through the internal wiring. ### Claim 19 (depends on 1) An electronic device comprising an electronic component in a mounting portion of the package for housing an electronic component according to claim 1. ### Claim 20 (depends on 19) An electronic module comprising: a module board; and the electronic device according to claim 19 connected to the module board.