# US 12,009,280 B2 · IC package with heat spreader

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- Number: US 12,009,280 B2
- Document ID: US12009280B2
- Status: Granted
- Kind: B2
- Application number: 17/547,698
- Filed: 2021-12-10
- Published: 2023-06-15
- Granted: 2024-06-11
- Earliest claimed: 2021-12-10
- Assignees: Texas Instruments Incorporated
- Applicants: Texas Instruments Incorporated
- Inventors: Rongwei Zhang; Woochan Kim; Patrick Francis Thompson
- Web page: https://patentgrep.com/patent/US12009280B2

## CPC

- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- H10W 40/778: {in encapsulations}
- H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H10W 40/037: {Assembling together parts thereof}
- H10W 40/10: Arrangements for heating
- H10W 70/427: {Bent parts}
- H10W 74/014: {using batch processing}
- H10W 90/00: Package configurations
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/50: Bond wires
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/753: {between laterally-adjacent chips}
- H10W 90/755: {between a chip and a laterally-adjacent insulating package substrate, interpose or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)

## Abstract

An integrated circuit (IC) package includes a molding having a first surface and a second surface, the first surface opposing the second surface. An interconnect is encased in the molding. The interconnect includes pads situated at a periphery of a side of the IC package. A portion of the pads are exposed at the first surface of the molding. A die pad is situated proximal to the second surface of the molding. The die pad has a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding. A die is mounted on the first surface of the die pad. A heat spreader is mounted on the second surface of the molding and the second surface of the die pad. The heat spreader extends between edges of the second surface of the molding.

## Claims

### Claim 1

An integrated circuit (IC) package comprising:
a molding having a first surface and a second surface, the first surface opposing the second surface;
an interconnect encased in the molding, the interconnect comprising:
pads situated at a periphery of a first surface of the IC package, wherein a portion of the pads are exposed at the first surface of the molding; and
a die pad situated proximal to the second surface of the molding, the die pad having a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding;
a die mounted on the first surface of the die pad; and
a heat spreader mounted on the second surface of the molding and the second surface of the die pad, wherein the heat spreader extends between edges of the second surface of the molding, and the heat spreader provides a second surface of the IC package.

### Claim 2 (depends on 1)

The IC package of claim 1, wherein the die is a first die, and the IC package comprises a second die mounted on the first surface of the die pad.

### Claim 3 (depends on 2)

The IC package of claim 2, wherein the first die and the second die are spaced apart.

### Claim 4 (depends on 2)

The IC package of claim 2, wherein the first die has a first supply voltage, and the second die has a second supply voltage, greater than the first supply voltage.

### Claim 5 (depends on 4)

The IC package of claim 4, wherein wire bonds electrically couple the first die to the second die.

### Claim 6 (depends on 5)

The IC package of claim 5, wherein the wire bonds electrically couple the first die and the second die to the pads of the interconnect.

### Claim 7 (depends on 1)

The IC package of claim 1, wherein a plane perpendicular to the second surface and the first surface of the molding crosses the heat spreader and a pad of the pads of the interconnect.

### Claim 8 (depends on 7)

The IC package of claim 7, wherein a heat sink is mountable on the heat spreader.

### Claim 9 (depends on 1)

The IC package of claim 1, wherein the IC package is a quad flat no leads (QFN) package.

### Claim 10 (depends on 1)

The IC package of claim 1, wherein the heat spreader extends to the edges of the second surface of the molding.

### Claim 11 (depends on 1)

The IC package of claim 1, further including a heat sink mounted on the heat spreader.

### Claim 12 (depends on 11)

The IC package of claim 11, wherein the heat sink is a castellated structure.

### Claim 13 (depends on 1)

The IC package of claim 1, further including traces of a printed circuit board electrically connected to the pads situated at the periphery of the first surface of the IC package.

### Claim 14

An apparatus comprising:
an integrated circuit (IC) package comprising:
a molding having a first surface and a second surface, the first surface opposing the second surface;
an interconnect encased in the molding, the interconnect comprising:
pads situated at a periphery of a first surface of the IC package, wherein a portion of the pads are exposed at the first surface of the molding; and
a die pad situated proximal to the second surface of the molding, the die pad having a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding;
a die mounted on the first surface of the die pad;
a heat spreader mounted on the second surface of the molding and the second surface of the die pad, wherein the heat spreader extends between edges of the second surface of the molding, and the heat spreader provides a second surface of the IC package; and
a printed circuit board (PCB) having traces on a surface of the PCB, at least some of the pads being electrically connected to at least some of the traces.

### Claim 15 (depends on 14)

The apparatus of claim 14, wherein the IC package is a quad flat no leads (QFN) package.

### Claim 16 (depends on 14)

The apparatus of claim 14, wherein the heat spreader extends to the edges of the second surface of the molding.

### Claim 17 (depends on 14)

The apparatus of claim 14, further including a heat sink mounted on the heat spreader.

### Claim 18 (depends on 14)

The apparatus of claim 14, wherein a plane perpendicular to the second surface and the first surface of the molding crosses the heat spreader and a pad of the pads of the interconnect.

### Claim 19 (depends on 18)

The apparatus of claim 18, wherein a heat sink is mountable on the heat spreader.

### Claim 20 (depends on 14)

The apparatus of claim 14, wherein the die is a first die, and the IC package comprises a second die mounted on the first surface of the die pad.

### Claim 21 (depends on 20)

The apparatus of claim 20, wherein the first die and the second die are spaced apart.

### Claim 22 (depends on 20)

The apparatus of claim 20, wherein the first die has a first supply voltage, and the second die has a second supply voltage, greater than the first supply voltage.

### Claim 23 (depends on 22)

The apparatus of claim 22, wherein wire bonds electrically couple the first die to the second die.

### Claim 24 (depends on 23)

The apparatus of claim 23, wherein the wire bonds electrically couple the first die and the second die to the pads of the interconnect.