# US 12,009,278 B2 · Package structure with buffer layer embedded in lid layer

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,009,278 B2
- Document ID: US12009278B2
- Status: Granted
- Kind: B2
- Application number: 17/984,259
- Filed: 2022-11-10
- Published: 2023-03-16
- Granted: 2024-06-11
- Earliest claimed: 2021-02-26
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Shu-Shen Yeh; Yu-Sheng Lin; Ming-Chih Yew; Po-Yao Lin; Shin-Puu Jeng
- Web page: https://patentgrep.com/patent/US12009278B2

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 76/60: Seals
- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 76/47: Solid or gel fillings
- H10W 90/00: Package configurations
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 78/00: Detachable holders for supporting packaged chips in operation
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a package structure including a substrate, a stiffener ring, an eccentric die, a lid layer, and a buffer layer. The stiffener ring is disposed on the substrate. The stiffener ring has an inner perimeter to enclose an accommodation area. The eccentric die is disposed within the accommodation area on the substrate. The eccentric die is offset from a center of the accommodation area to close to a first side of the stiffener ring. The lid layer is disposed on the stiffener ring and overlays the eccentric die. The buffer layer is embedded in the lid layer between the first side of the stiffener ring and the eccentric die. The buffer layer has a thickness less than a thickness of the lid layer.

## Claims

### Claim 1

A package structure, comprising:
a substrate;
an eccentric die, disposed on the substrate;
a stiffener ring, disposed on the substrate to laterally surround the eccentric die, wherein a first sidewall of the eccentric die is close to a first side of the stiffener ring, and encloses a space with the first side of the stiffener ring; and
a lid layer, disposed on the stiffener ring and overlying the eccentric die, wherein the lid layer has an opening penetrating through a top surface of the lid layer and a bottom surface of the lid layer, and the opening corresponds and exposes the space enclosed by the first sidewall of the eccentric die and the first side of the stiffener ring.

### Claim 2 (depends on 1)

The package structure of claim 1, further comprising: a buffer layer disposed in the opening and overlying the space, wherein the buffer layer has a thickness less than a thickness of the lid layer.

### Claim 3 (depends on 2)

The package structure of claim 2, wherein the opening has an upper opening and a lower opening, the upper opening has an area greater than an area of the lower opening, the buffer layer is disposed in the upper opening, and a bottom surface of the buffer layer is exposed by the lower opening.

### Claim 4 (depends on 2)

The package structure of claim 2, wherein the buffer layer and the lid layer have the same material.

### Claim 5 (depends on 2)

The package structure of claim 2, further comprising:
a plurality of package dies, side by side disposed on the substrate, wherein the eccentric die is disposed between the plurality of package dies;
a thermal interface material (TIM) disposed between the eccentric die and the lid layer
a first adhesive layer, disposed between the stiffener ring and the substrate; and
a second adhesive layer, disposed on the stiffener ring, wherein the lid layer is adhered on the stiffener ring by the second adhesive layer, and overlays the eccentric die and the plurality of package dies.

### Claim 6 (depends on 5)

The package structure of claim 5, wherein the buffer layer comprises a plurality of sub-layers to respectively cover corners of the plurality of package dies adjacent to the first side of the stiffener ring and corners of the eccentric die.

### Claim 7 (depends on 2)

The package structure of claim 2, wherein the buffer layer further extends to cover a top surface of the stiffener ring.

### Claim 8 (depends on 2)

The package structure of claim 2, wherein the buffer layer has a width greater than or equal to a width of the eccentric die.

### Claim 9 (depends on 2)

The package structure of claim 2, wherein the buffer layer further extends to cover at least two corners of the eccentric die.

### Claim 10

A package structure, comprising:
a package substrate;
a first die, disposed on the package substrate and having a first sidewall and a second sidewall opposite to each other;
a stiffener ring, disposed on the package substrate to laterally surround the first die, wherein the stiffener ring has an inner sidewall facing the first die, the inner sidewall at least has a slant sidewall facing the first sidewall of the first die, and the first sidewall and the slant sidewall enclose a space; and
a lid layer, disposed on the stiffener ring and overlying the first die, wherein the lid layer has an opening penetrating through a top surface of the lid layer and a bottom surface of the lid layer, and the opening corresponds and exposes the space enclosed by the first sidewall of the first die and the slant sidewall of the stiffener ring.

### Claim 11 (depends on 10)

The package structure of claim 10, further comprising: an embedded buffer disposed in the opening, wherein the embedded buffer has a bottom surface higher than the bottom surface of the lid layer.

### Claim 12 (depends on 10)

The package structure of claim 10, wherein the inner sidewall of the stiffener ring has a vertical sidewall facing the second sidewall of the first die.

### Claim 13 (depends on 12)

The package structure of claim 12, wherein a first distance between the first sidewall of the first die and the slant sidewall of the stiffener ring is less than or equal to a second distance between the second sidewall of the first die and the vertical sidewall of the stiffener ring.

### Claim 14 (depends on 10)

The package structure of claim 10, further comprising:
a plurality of second dies, side by side disposed on the package substrate, wherein the first die is disposed between the plurality of second dies;
a thermal interface material (TIM) disposed between the first die and the lid layer
a first adhesive layer, disposed between the stiffener ring and the package substrate; and
a second adhesive layer, disposed on the stiffener ring, wherein the lid layer is adhered on the stiffener ring by the second adhesive layer, and overlays the first die and the plurality of second dies.

### Claim 15 (depends on 14)

The package structure of claim 14, wherein the first die has a coefficient of thermal expansion (CTE) less than a CTE of the plurality of second dies.

### Claim 16 (depends on 10)

The package structure of claim 10, wherein the stiffener ring has an outer sidewall opposite to the inner sidewall, and the outer sidewall protrudes from a sidewall of the package substrate.

### Claim 17 (depends on 10)

The package structure of claim 10, wherein the slant sidewall comprises a flat surface, a curved surface, or a staircase surface.

### Claim 18

A method of forming a package structure, comprising:
forming a first die on a package substrate, wherein the first die has a first sidewall and a second sidewall opposite to each other;
forming a plurality of second dies side by side on the package substrate, wherein the first die is formed between the plurality of second dies;
forming a stiffener ring on the package substrate to surround the first die and the plurality of second dies, wherein a first sidewall of the first die is close to a first side of the stiffener ring, and encloses a space with the first side of the stiffener ring;
forming a lid layer on the stiffener ring to overlay the first die and the plurality of second dies; and
forming an opening to penetrate through a top surface and a bottom surface of the lid layer, wherein the opening corresponds and exposes the space enclosed by the first sidewall of the first die and the first side of the stiffener ring.

### Claim 19 (depends on 18)

The method of claim 18, further comprising: widening an upper portion of the opening to form a narrower lower opening and a wider upper opening.

### Claim 20 (depends on 18)

The method of claim 18, further comprising: forming a buffer layer in the opening to overlay the space, wherein the buffer layer has a thickness less than a thickness of the lid layer.