# US 12,009,276 B2 · Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,276 B2 - Document ID: US12009276B2 - Status: Granted - Kind: B2 - Application number: 17/407,224 - Filed: 2021-08-20 - Published: 2023-02-23 - Granted: 2024-06-11 - Earliest claimed: 2021-08-20 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company Limited - Inventors: Yu-Sheng Lin; Shu-Shen Yeh; Chin-Hua Wang; Po-Yao Lin; Shin-Puu Jeng - Web page: https://patentgrep.com/patent/US12009276B2 ## CPC - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - H10W 40/10: Arrangements for heating - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 40/73: for cooling by change of state - H10W 72/071: {Connecting or disconnecting} - H10W 76/12: characterised by their shape - H10W 76/15: Containers comprising an insulating or insulated base - H10W 90/00: Package configurations - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 90/288: {characterised by arrangements for thermal management of the stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package including a lid having one or more heat pipes located on and/or within the lid to provide improved thermal management. A lid for a semiconductor package having one or more heat pipes thermally integrated with the lid may provide more uniform heat loss from the semiconductor package, reduce the risk of damage to the package due to excessive heat accumulation, and may enable the lid to be fabricated using less expensive materials, thereby reducing the costs of a semiconductor package. ## Claims ### Claim 1 A semiconductor package, comprising: a package substrate; at least one semiconductor device mounted to the package substrate; and a lid attached to the package substrate and extending over the at least one semiconductor device, the lid comprising at least one heat pipe located on or in the lid and extending between a central region of the semiconductor package including a relatively higher density of semiconductor devices and a peripheral region of the semiconductor package including a relatively lower density of semiconductor devices, wherein the at least one heat pipe comprises: an outer wall enclosing a central fluid conduit; a working fluid enclosed within the outer wall, wherein a first portion of the working fluid is in a liquid phase and a second portion of the working fluid is in a gas phase at an operating temperature of the semiconductor package; and a wick structure enclosed within the outer wall and configured to exert a capillary action on the working fluid that is in a liquid phase. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the lid comprises a material having a thermal conductivity that is less than 398 W/m·K. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the lid comprises aluminum. ### Claim 4 (depends on 1) The semiconductor package of claim 1, wherein the lid comprises at least one sidewall portion that laterally surrounds the at least one semiconductor device and an upper portion located over the at least one semiconductor device, and wherein the at least one heat pipe includes a height dimension that is at least 10% of a thickness of the upper portion of the lid. ### Claim 5 (depends on 1) The semiconductor package of claim 1, wherein the at least one semiconductor device comprises a plurality of die stacks. ### Claim 6 (depends on 5) The semiconductor package of claim 5, wherein the plurality of die stacks comprises at least one System on Chip (SOC) device and at least one heat pipe located on or in the lid extends over each SOC device of the semiconductor package. ### Claim 7 (depends on 6) The semiconductor package of claim 6, wherein at least two heat pipes located on or in the lid extend over each SOC device of the semiconductor package. ### Claim 8 (depends on 6) The semiconductor package of claim 6, wherein a width dimension of each heat pipe overlying a respective SOC device is greater than or equal to, and is up to five (5) times as great, as an offset distance between a peripheral edge of the SOC device and a peripheral edge of the heat pipe overlying the SOC device that is most proximate to the peripheral edge of the SOC device. ### Claim 9 (depends on 6) The semiconductor package of claim 6, wherein the plurality of die stacks further comprises at least one High Bandwidth Memory (HBM) device. ### Claim 10 (depends on 1) The semiconductor package of claim 1, wherein the lid includes a plurality of heat pipes located on or in the lid, wherein each heat pipe of the plurality of heat pipes includes a first straight segment extending in the central region of the semiconductor package along a first direction, a second straight segment extending in the peripheral region of the semiconductor package along a second direction that is orthogonal to the first direction, and a curved portion between the first straight segment and the second straight segment. ### Claim 11 (depends on 1) The semiconductor package of claim 1, wherein the lid includes a plurality of heat pipes located on or in the lid extending parallel to one another along a first direction, wherein each heat pipe of the plurality of heat pipes extends from the peripheral region on a first side of the semiconductor package through the central region of the semiconductor package and into the peripheral region on an opposite side of the semiconductor package. ### Claim 12 (depends on 11) The semiconductor package of claim 11, wherein the lid includes one or more additional heat pipes that extend along the first direction continuously within the peripheral region of the semiconductor package. ### Claim 13 (depends on 11) The semiconductor package of claim 11, wherein the lid includes one or more additional heat pipes that extend along the first direction, wherein each of the additional heat pipes has a curved shape that bends towards a center of the semiconductor package as the additional heat pipe extends from the peripheral region on the first side of the semiconductor package into the central region of the semiconductor package, and bends away from the center of the semiconductor package as the additional heat pipe extends from the central region of the semiconductor package into the peripheral region on an opposite side of the semiconductor package. ### Claim 14 (depends on 1) The semiconductor package of claim 1, wherein the lid includes a first plurality of heat pipes located on or in the lid extending parallel to one another along a first direction, and a second plurality of heat pipes located on or in the lid that extend at an oblique angle with respect to the first direction, wherein each of the first plurality of heat pipes and the second plurality of heat pipes includes a first end located in the central region of the semiconductor package and a second end located in the peripheral region of the semiconductor package. ### Claim 15 (depends on 1) The semiconductor package of claim 1, further comprising: an interposer mounted to the package substrate, the at least one semiconductor device mounted to the interposer; a first thermal interface material layer located between an upper surface of the at least one semiconductor device and a bottom surface of the lid; a heat sink located over an upper surface of the lid and the at least one heat pipe; and a second thermal interface layer located between the upper surface of the lid and the at least one heat pipe and a bottom surface of the heat sink. ### Claim 16 A semiconductor package, comprising: a package substrate; at least one semiconductor device mounted to the package substrate; and a lid attached to the package substrate and including an upper portion extending over the at least one semiconductor device, the lid comprising at least one heat pipe located on or in the lid and including a height dimension that is at least 10% of a thickness of the upper portion of the lid, wherein the at least one heat pipe comprises: an outer wall enclosing a central fluid conduit; a working fluid enclosed within the outer wall, wherein a first portion of the working fluid is in a liquid phase and a second portion of the working fluid is in a gas phase at an operating temperature of the semiconductor package; and a wick structure enclosed within the outer wall and configured to exert a capillary action on the working fluid that is in a liquid phase. ### Claim 17 (depends on 16) The semiconductor package of claim 16, wherein the lid comprises a material having a thermal conductivity that is less than 398 W/m·K. ### Claim 18 A semiconductor package, comprising: a package substrate; at least one semiconductor device mounted to the package substrate; and a lid comprising: at least one sidewall portion laterally surrounding the at least one semiconductor device that is mounted to the package substrate; an upper portion extending from the at least one sidewall portion over an upper surface of the at least one semiconductor device; and a plurality of heat pipes contacting and thermally-integrated with the upper portion of the lid and configured to spread heat within the upper portion of the lid, wherein each of the heat pipes comprises: an outer wall enclosing a central fluid conduit; a working fluid enclosed within the outer wall, wherein a first portion of the working fluid is in a liquid phase and a second portion of the working fluid is in a gas phase at an operating temperature of the semiconductor package; and a wick structure enclosed within the outer wall and configured to exert a capillary action on the working fluid that is in a liquid phase. ### Claim 19 (depends on 18) The semiconductor package of claim 18, wherein the outer wall of each of the plurality of heat pipes comprises copper, and the upper portion of the lid comprises a material having a thermal conductivity that is less than 398 W/m·K. ### Claim 20 (depends on 19) The semiconductor package of claim 19, wherein the upper portion of the lid comprises aluminum.