# US 12,009,245 B2 · Member for semiconductor manufacturing apparatus and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,245 B2 - Document ID: US12009245B2 - Status: Granted - Kind: B2 - Application number: 17/457,092 - Filed: 2021-12-01 - Published: 2022-07-07 - Granted: 2024-06-11 - Earliest claimed: 2021-01-06 - Assignees: NGK Insulators, Ltd. - Applicants: Ngk Insulators, Ltd. - Inventors: Masaki Ishikawa; Yuji Akatsuka; Kenji Yonemoto - Web page: https://patentgrep.com/patent/US12009245B2 ## CPC - H10P 72/722: {Details of electrostatic chucks} - B23Q 3/15: Devices for holding work using magnetic or electric force acting directly on the work - C09J 5/06: involving heating of the applied adhesive - H01J 37/32697: {Electrostatic control} - H01J 37/32715: {Workpiece holder} - H02N 13/00: Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect - H10P 72/0434: {mainly by convection} - C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors - H01J 2237/2007: Holding mechanisms - H10P 72/0432: {mainly by conduction} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B23Q: DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING (tools of the kind used in lathes or boring machines B23B27/00); MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - H02N: ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ## Abstract A member for semiconductor manufacturing apparatus, includes: a ceramic plate having a wafer placement surface; a plug receiving hole formed in a surface of the ceramic plate opposite to the wafer placement surface; a gas outlet port extending through a bottom wall of the plug receiving hole; a plug received in the plug receiving hole; and a gas flow path disposed inside the plug to be continuous with the gas outlet port, wherein a stepped portion is disposed on a side surface of the plug or an inner surface of the plug receiving hole, the plug receiving hole and the plug are in contact with each other in an area deeper than the stepped portion, a gap is formed between the plug receiving hole and the plug in an area shallower than the stepped portion, and a plug support member made of an adhesive material is formed in the gap. ## Claims ### Claim 1 A member for semiconductor manufacturing apparatus, comprising: a ceramic plate having a wafer placement surface and including a built-in electrode; a plug receiving hole formed in a surface of the ceramic plate opposite to the wafer placement surface; a gas outlet port that extends through a bottom wall of the plug receiving hole in the ceramic plate in a thickness direction of the ceramic plate; a plug received in the plug receiving hole; and a gas flow path disposed inside the plug to be continuous with the gas outlet port and allow gas flow in a thickness direction of the plug, wherein a stepped portion is disposed on a side surface of the plug or an inner surface of the plug receiving hole, the plug receiving hole and the plug are in contact with each other in an area deeper than the stepped portion, a gap is formed between the plug receiving hole and the plug in an area shallower than the stepped portion, and a plug support member made of an adhesive material is formed in the gap. ### Claim 2 (depends on 1) The member for semiconductor manufacturing apparatus according to claim 1, wherein the plug includes a first taper portion with a diameter gradually decreasing toward an opening of the plug receiving hole. ### Claim 3 (depends on 1) The member for semiconductor manufacturing apparatus according to claim 1, wherein the plug includes a second taper portion with a diameter gradually decreasing toward a bottom surface of the plug receiving hole, an outer surface of the second taper portion is in contact with the inner surface of the plug receiving hole, and the electrode is disposed in a plane inside the ceramic plate crossing the second taper portion, and has a through-hole that allows the plug to pass therethrough. ### Claim 4 (depends on 1) The member for semiconductor manufacturing apparatus according to claim 1, wherein the plug is made of a dense ceramic material, and the gas flow path is helical. ### Claim 5 (depends on 1) A method for manufacturing the member for semiconductor manufacturing apparatus according to claim 1, comprising: (a) a step of preparing the ceramic plate and the plug; (b) a step of inserting the plug into the plug receiving hole to bring the plug into contact with the plug receiving hole in the area deeper than the stepped portion disposed on the side surface of the plug or on the inner surface of the plug receiving hole and to form the gap between the plug receiving hole and the plug in the area shallower than the stepped portion; and (c) a step of injecting an adhesive into the gap and then curing the adhesive to form the plug support member.