# US 12,009,156 B2 · Method of manufacturing multilayer ceramic capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,156 B2 - Document ID: US12009156B2 - Status: Granted - Kind: B2 - Application number: 18/133,570 - Filed: 2023-04-12 - Published: 2023-08-03 - Granted: 2024-06-11 - Earliest claimed: 2020-10-07 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Satoshi Yokomizo; Shinobu Chikuma; Yohei Mukobata - Web page: https://patentgrep.com/patent/US12009156B2 ## CPC - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H01G 4/008: Selection of materials - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/2325: {characterised by the material of the terminals} - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via a plate-shaped member, connecting the two interposers and the external electrode, and removing the plate-shape member. ## Claims ### Claim 1 A method of manufacturing a multilayer ceramic capacitor, the method comprising: alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body; forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body; connecting two interposers via a plate-shaped member; connecting the two interposers and the external electrode; and removing the plate-shape member. ### Claim 2 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, further comprising tin-plating the two interposers and the external electrodes, after the connecting the two interposers via the plate-shaped member. ### Claim 3 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, further comprising nickel-plating two metal interposers connected via the plate-shaped member, between the connecting the two interposers and the connecting the two interposers and the external electrode. ### Claim 4 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, further comprising providing, on the two interposers, a connecting material to connect the interposers and the external electrodes, between the connecting the two interposers via the plate-shaped member and the connecting the two interposers and the external electrode. ### Claim 5 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, wherein, in the alternately laminating the dielectric layers and the internal electrode layers, the internal electrode layers are shifted by about a half pitch in a length direction between adjacent internal electrode layers. ### Claim 6 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, wherein, in the alternately laminating the dielectric layers and the internal electrode layers, the dielectric layers are thermocompression bonded. ### Claim 7 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, wherein the external electrode is formed of copper. ### Claim 8 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, wherein, in the forming the external electrode, a copper electrode layer, a conductive resin layer, and a nickel-plated layer are sequentially formed. ### Claim 9 (depends on 8) The method of manufacturing the multilayer ceramic capacitor according to claim 8, wherein, in the forming the external electrode, the copper electrode layer is formed by applying and firing a conductive paste including a conductive metal and glass. ### Claim 10 (depends on 8) The method of manufacturing the multilayer ceramic capacitor according to claim 8, wherein, in the forming the external electrode, the conductive resin layer is formed to cover the copper electrode layer. ### Claim 11 (depends on 8) The method of manufacturing the multilayer ceramic capacitor according to claim 8, wherein, in the forming the external electrode, a gap is formed between the copper electrode layer and the conductive resin layer. ### Claim 12 (depends on 8) The method of manufacturing the multilayer ceramic capacitor according to claim 8, wherein, in the forming the external electrode, the nickel-plated layer is formed to cover the conductive resin layer. ### Claim 13 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, wherein the forming the external electrode includes heating the external electrode at a firing temperature in a nitrogen atmosphere. ### Claim 14 (depends on 1) The method of manufacturing the multilayer ceramic capacitor according to claim 1, wherein the plate-shaped member includes a glass epoxy.