# US 12,009,150 B2 · Multilayer electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,150 B2 - Document ID: US12009150B2 - Status: Granted - Kind: B2 - Application number: 18/144,390 - Filed: 2023-05-08 - Published: 2023-08-31 - Granted: 2024-06-11 - Earliest claimed: 2019-07-29 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Kyoung Jin Cha; Woo Chul Shin; Seung Heui Lee; Beom Seock Oh - Web page: https://patentgrep.com/patent/US12009150B2 ## CPC - H01G 4/005: Electrodes - H01G 4/0085: {Fried electrodes} - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/08: Inorganic dielectrics - H01G 4/1218: {based on titanium oxides or titanates (H01G4/1245 takes precedence)} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less. ## Claims ### Claim 1 A multilayer electronic component comprising: a body including dielectric layers and internal electrodes alternately disposed in a first direction; and external electrodes disposed on the body, wherein at least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode, a disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other, at least one of the plurality of disconnected portions includes both the pore and the dielectric substance and has a length greater than an average thickness of the at least one internal electrode on a cross section of the body taken in the first direction, and at least one disconnected portion of the plurality of disconnected portions includes a dielectric substance which is not connected to at least one of the dielectric layers adjacent to the at least one disconnected portion. ### Claim 2 (depends on 1) The multilayer electronic component of claim 1, wherein at least one disconnected portion of the plurality of disconnected portions includes a dielectric substance which is not connected to both dielectric layers adjacent to the at least one disconnected portion. ### Claim 3 (depends on 1) The multilayer electronic component of claim 1, wherein the body has first and second surfaces disposed to oppose each other in the first direction, third and fourth surfaces connected to the first and second surfaces and disposed to oppose each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and disposed to oppose each other in a third direction, and the cross section of the body taken in the first direction refers to a cross section in the second and first directions or a cross section in third and first directions. ### Claim 4 (depends on 1) The multilayer electronic component of claim 1, wherein a dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section of the body taken in the first direction, is more than 20% to less than 80%. ### Claim 5 (depends on 1) The multilayer electronic component of claim 1, wherein an internal electrode connectivity, defined as a ratio of a length of the at least one internal electrode excluding the disconnected portion to a length of the at least one internal electrode on a cross section of the body taken in the first direction, is 70% or more. ### Claim 6 (depends on 1) The multilayer electronic component of claim 1, wherein at least one of the dielectric layers has an average thickness of 0.41 μm or less. ### Claim 7 (depends on 1) The multilayer electronic component of claim 1, wherein at least one of the internal electrodes has an average thickness of 0.41 μm or less. ### Claim 8 (depends on 1) The multilayer electronic component of claim 1, wherein at least one of the plurality of disconnected portions is composed of the dielectric substance. ### Claim 9 (depends on 1) The multilayer electronic component of claim 1, wherein the body has first and second surfaces disposed to oppose each other in the first direction, third and fourth surfaces connected to the first and second surfaces and disposed to oppose each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and disposed to oppose each other in a third direction, and L is 0.4 mm or less and W is 0.2 mm or less, where a distance between the third and fourth surfaces of the body is denoted as “L” and a distance between the fifth and sixth surface is denoted as “W”. ### Claim 10 (depends on 1) The multilayer electronic component of claim 1, wherein at least one of the internal electrodes has an average thickness of 0.41 μm or less and at least one of the dielectric layers has an average thickness of 0.41 μm or less. ### Claim 11 (depends on 1) The multilayer electronic component of claim 1, wherein the internal electrodes or the dielectric substance includes at least one of silicon (Si), magnesium (Mg), or aluminum (Al).