# US 12,009,124 B2 · Fixing structure of wiring member, and wiring member with heat generation layer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,124 B2 - Document ID: US12009124B2 - Status: Granted - Kind: B2 - Application number: 17/768,350 - Filed: 2020-08-21 - Published: 2023-01-26 - Granted: 2024-06-11 - Earliest claimed: 2019-10-28 - Assignees: Autonetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd. - Applicants: AutoNetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd. - Inventors: Hirotaka Kato; Hiroki Hirai; Makoto Higashikozono; Kosuke Sone - Web page: https://patentgrep.com/patent/US12009124B2 ## CPC - H01B 7/40: with arrangements for facilitating mounting or securing - B60R 16/0215: {Protecting, fastening and routing means therefor} - C09J 7/35: Heat-activated - H02G 3/305: {Mounting by adhesive material} - H05B 6/10: Induction heating apparatus, other than furnaces, for specific applications - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - B60R: VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H02G: INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL ## Abstract A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties by heat transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member. ## Claims ### Claim 1 A fixing structure of a wiring member, comprising: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member, the joint layer includes an adherend side joint layer provided between the heat generation layer and the adherend to be joined to the heat generation layer and the adherend, and a fixation surface of the adherend is a planar surface, and the adherend side joint layer is provided to extend along the fixation surface. ### Claim 2 (depends on 1) The fixing structure of the wiring member according to claim 1, wherein the joint layer includes a wiring member side joint layer provided between the heat generation layer and the wiring member to be joined to the heat generation layer and the wiring member. ### Claim 3 (depends on 1) The fixing structure of the wiring member according to claim 1, wherein the heat generation layer is partially provided along a longitudinal direction of the wiring member. ### Claim 4 A wiring member with a heat generation layer, comprising: a wiring member including at least one wire-like transmission member; and a heat generation layer provided to surround a periphery of the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, and is an outermost layer in a periphery of the wiring member. ### Claim 5 A fixing structure of a wiring member, comprising: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member, the joint layer includes an adherend side joint layer provided between the heat generation layer and the adherend to be joined to the heat generation layer and the adherend, and a part of the heat generation layer along a circumferential direction of the wiring member is joined to the adherend side joint layer, and another part of the heat generation layer which is not joined to the adherend side joint layer along the circumferential direction of the wiring member is exposed. ### Claim 6 A fixing structure of a wiring member, comprising: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member, the joint layer includes an adherend side joint layer provided between the heat generation layer and the adherend to be joined to the heat generation layer and the adherend, a fixation surface of the adherend is a planar surface, and the adherend side joint layer is provided to extend along the fixation surface, and a part of the heat generation layer along a circumferential direction of the wiring member is joined to the adherend side joint layer, and another part of the heat generation layer which is not joined to the adherend side joint layer along the circumferential direction of the wiring member is exposed.