# US 12,008,202 B2 · Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,008,202 B2 - Document ID: US12008202B2 - Status: Granted - Kind: B2 - Application number: 18/315,944 - Filed: 2023-05-11 - Published: 2023-11-16 - Granted: 2024-06-11 - Earliest claimed: 2022-05-12 - Assignees: Ligitek Electronics Co., Ltd. - Applicants: Ligitek Electronics Co., Ltd. - Inventors: Yi-Wen Chen; Wen-Chung Chou; I-Hsin Tung - Web page: https://patentgrep.com/patent/US12008202B2 ## CPC - G06F 3/0421: {by interrupting or reflecting a light beam, e.g. optical touch-screen} - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F 2203/04108: Touchless 2D- digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface without distance measurement in the Z direction - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A touch light-emitting module and a manufacturing method thereof are disclosed. The touch light-emitting module includes a printed circuit board and a touch-control conductor. The printed circuit board has a top surface on which a touch-control IC and a luminous unit that is electrically connected are disposed. The touch-control conductor includes a hollowed portion. The touch-control conductor is coated, on the bottom thereof, with a conductive material to combine with the top surface of the printed circuit board, so that the touch-control IC and the luminous unit are located in the hollowed portion. An encapsulation resin is then injected into a space between the printed circuit board and the hollowed portion to complete encapsulation. As such, the present invention offers a simplified structure to achieve an effect of minimization, and also simplifies the manufacturing process and reduces the working time to thereby enhance the yield. ## Claims ### Claim 1 A touch light-emitting module, comprising: a printed circuit board, the printed circuit board having a top surface on which a touch-control integrated circuit (IC) and at least one luminous unit in electrical connection with the touch-control IC are disposed; and a touch-control conductor combined with the printed circuit board through a conductive material, the touch-control conductor being formed with a hollowed portion in which the touch-control IC and the luminous unit are located, the hollowed portion receiving an encapsulation resin to inject therein to form encapsulation of the touch light-emitting module; wherein the touch-control conductor is formed of a plurality of copper-foil layers and at least one insulator layer that are alternately stacked on each other, and the touch-control conductor comprises an electrically conductive body, the electrically conductive body being arranged to connect, in a direction of the stacking, at least two of the copper-foil layers and the insulator layer between the copper-foil layers to establish electrical connection between the copper-foil layers. ### Claim 2 (depends on 1) The touch light-emitting module according to claim 1, wherein the top surface of the printed circuit board is formed with a recessed portion that corresponds, in shape, to the hollowed portion, and the touch-control IC and the luminous unit are disposed in the recessed portion. ### Claim 3 (depends on 2) The touch light-emitting module according to claim 2, wherein the recessed portion comprises a function zone on which the touch-control IC and the luminous unit are disposed and a circumferential groove that surrounds an outer circumference of the function zone. ### Claim 4 (depends on 3) The touch light-emitting module according to claim 3, wherein a raised rib is arranged between the function zone and the circumferential groove. ### Claim 5 (depends on 2) The touch light-emitting module according to claim 2, wherein the touch-control conductor and the printed circuit board are arranged coaxial with each other, and a spacing distance of around 0.05-0.5 mm is formed between a sidewall of the recessed portion and a sidewall of the hollowed portion. ### Claim 6 (depends on 1) The touch light-emitting module according to claim 1, wherein the touch-control conductor comprises a plurality of electrically conductive zones, and the electrically conductive zones are combined with the printed circuit board by the conductive material, the electrically conductive zones being in a state of non-contacting with each other. ### Claim 7 (depends on 6) The touch light-emitting module according to claim 6, wherein the electrically conductive zones are formed of the plurality of copper-foil layers and at least one insulator layer that are alternately stacked on each other, and the electrically conductive zones comprise the electrically conductive body. ### Claim 8 (depends on 1) The touch light-emitting module according to claim 1, wherein the touch-control conductor has a width of around 0.3-2 cm. ### Claim 9 (depends on 1) The touch light-emitting module according to claim 1, wherein the printed circuit board comprises an outer flange that is formed as a stepped structure. ### Claim 10 (depends on 1) The touch light-emitting module according to claim 1, wherein the top surface of the printed circuit board further comprises a logic control IC disposed thereon, and the logic control IC is in electrical connection with the touch-control IC and the luminous unit. ### Claim 11 (depends on 1) The touch light-emitting module according to claim 1, wherein a metallic pad is arranged on the touch-control conductor. ### Claim 12 (depends on 1) The touch light-emitting module according to claim 1, further comprising an upper cover, the upper cover being mounted at a top of the touch-control conductor and electrically connected with the touch-control conductor, edges of the upper cover extending beyond a perimeter of the touch-control conductor and a perimeter of the printed circuit board, the upper cover being formed with a through-hole, the through-hole communicating with the hollowed portion of the touch-control conductor, wherein in a top view of the touch light-emitting module, a perimeter of the through-hole enclosing a perimeter of the hollowed portion. ### Claim 13 (depends on 12) The touch light-emitting module according to claim 12, wherein an area of a bottom surface of the upper cover where the upper cover is not in contact with the touch conductor is provided with a plural of support members. ### Claim 14 (depends on 1) The touch light-emitting module according to claim 1, further comprising a reflector case and a sensing electrode, the reflector case being mounted on the printed circuit board and cover the touch-control conductor, the sensing electrode being mounted on the reflector case and having a connection portion, the reflector case and the sensing electrode respectively having a through-hole, the through-hole on the reflector case and the through-hole on the sensing electrode communicating with each other and being arranged such that the light from the luminous unit passes therethrough and emits out from a top of the touch light-emitting module. ### Claim 15 A touch light-emitting module manufacturing method, comprising: disposing a touch-control integrated circuit (IC) and at least one luminous unit on a top surface of a printed circuit board; coating a conductive material on a bottom surface of a touch-control conductor that is formed with a hollowed portion for combination with the top surface of the printed circuit board such that the touch-control IC and the luminous unit are located in the hollowed portion; and injecting an encapsulation resin into a space between the printed circuit board and the hollowed portion to complete encapsulation; wherein the touch-control conductor is formed by alternately stacking a plurality of copper-foil layers and at least one insulator layer, and drilling is applied to at least two of the copper-foil layers and the insulator layer between the copper-foil layers to form an electrical conduction hole, which is then filled up with electroplating to form an electrically conductive body to electrically connect the copper-foil layers. ### Claim 16 (depends on 15) The touch light-emitting module manufacturing method according to claim 15, wherein the touch-control IC and the luminous unit are mounted on the top surface of the printed circuit board through a soldering operation, and the touch-control conductor and the printed circuit board are combined through an operation of reflow. ### Claim 17 (depends on 16) The touch light-emitting module manufacturing method according to claim 16, wherein the printed circuit board has a width of around 0.3-2 cm. ### Claim 18 (depends on 15) The touch light-emitting module manufacturing method according to claim 15, wherein the touch-control conductor comprises a plurality of electrically conductive zones, and the conductive material is coated on a bottom of the electrically conductive zones to have the electrically conductive zones combined with the printed circuit board in a state of non-contacting with each other.