# US 12,007,816 B2 · Heat dissipation module and electronic device having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,007,816 B2 - Document ID: US12007816B2 - Status: Granted - Kind: B2 - Application number: 17/852,372 - Filed: 2022-06-29 - Published: 2023-06-29 - Granted: 2024-06-11 - Earliest claimed: 2021-12-27 - Assignees: ASUSTeK COMPUTER INC. - Applicants: ASUSTeK COMPUTER INC. - Inventors: Dun-Hao Yang; Kuang-Yu Chang; Ming-Fang Tsai - Web page: https://patentgrep.com/patent/US12007816B2 ## CPC - G06F 1/185: Mounting of expansion boards - G06F 1/20: Cooling means - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board. ## Claims ### Claim 1 A heat dissipation module, adapted for a circuit board, wherein the circuit board has an M.2 bonding hole, the heat dissipation module, comprising: a supporting bracket, having a first side and a second side opposite to each other, and an accommodating space located between the first side and the second side and adapted for installing an SSD interface card, wherein the first side has a first mounting hole and a second mounting hole; and a heat dissipation element, coupled to the first side through the first mounting hole; wherein, when the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board, wherein the supporting bracket has two through grooves, both of the two through grooves are adapted to the SSD interface card to pass through so as to enter the accommodating space, wherein each of the two through grooves is located between the first side and the second side, the two through grooves is connected to the accommodating space, and the two through grooves are located on opposite two sides of the accommodating space. ### Claim 2 (depends on 1) The heat dissipation module according to claim 1, wherein the first side has a first opening, and the heat dissipation element is located on the first side and covers the first opening. ### Claim 3 (depends on 1) The heat dissipation module according to claim 1, wherein the second side has a second opening. ### Claim 4 (depends on 3) The heat dissipation module according to claim 3, further comprising a first heat conductive element disposed on the circuit board corresponding to the second opening. ### Claim 5 (depends on 1) The heat dissipation module according to claim 1, further comprising a plurality of buffer elements disposed in the accommodating space. ### Claim 6 (depends on 1) The heat dissipation module according to claim 1, wherein the supporting bracket further comprises two side walls, and two ends of the two side walls are connected to the first side and the second side, respectively, and the two side walls, the first side, and the second side surround the accommodating space. ### Claim 7 (depends on 1) The heat dissipation module according to claim 1, further comprising a second heat conductive element disposed between the SSD interface card and the heat dissipation element. ### Claim 8 (depends on 1) The heat dissipation module according to claim 1, wherein the heat dissipation element has a plurality of heat dissipation fins. ### Claim 9 An electronic device, comprising: a housing; a circuit board, disposed in the housing and having an M.2 bonding hole; an SSD interface card; and a heat dissipation module, comprising: a supporting bracket, having a first side and a second side opposite to each other, and an accommodating space located between the first side and the second side and adapted for installing the SSD interface card, wherein the first side has a first mounting hole and a second mounting hole; and a heat dissipation element, combined to the first side through the first mounting hole; wherein, when the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board, wherein the supporting bracket has two through grooves, both of the two through grooves are adapted to the SSD interface card to pass through so as to enter the accommodating space, wherein each of the two through grooves is located between the first side and the second side, the two through grooves is connected to the accommodating space, and the two through grooves are located on opposite two sides of the accommodating space.