# US 12,007,611 B2 · Package structure having grating coupler and manufacturing method thereof

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- Number: US 12,007,611 B2
- Document ID: US12007611B2
- Status: Granted
- Kind: B2
- Application number: 17/896,089
- Filed: 2022-08-26
- Published: 2024-02-29
- Granted: 2024-06-11
- Earliest claimed: 2022-08-26
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Feng-Wei Kuo; Chewn-Pu Jou; Hsing-Kuo Hsia; Chih-Wei Tseng
- Web page: https://patentgrep.com/patent/US12007611B2

## CPC

- G02B 6/4215: {the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers (G02B6/4246 takes precedence)}
- G02B 6/43: Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
- G02B 6/29328: {Diffractive elements operating in reflection}
- G02B 6/30: for use between fibre and thin-film device
- G02B 6/34: utilising prism or grating {(G02B6/293 takes precedence)}
- G02B 6/4206: {Optical features (G02B6/4207, G02B6/421 take precedence)}
- G02B 6/4274: {Electrical aspects (G02B6/4263 and G02B6/4265 take precedence)}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.

## Claims

### Claim 1

A package structure, comprising:
photonic dies, each photonic die including a dielectric layer and a first grating coupler embedded in the dielectric layer; and
an interposer structure, disposed below the photonic dies, wherein the interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer,
wherein the photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.

### Claim 2 (depends on 1)

The package structure according to claim 1, wherein each of the photonic dies includes a first reflector structure embedded in the dielectric layer above the first grating coupler, and
the interposer structure further includes a second reflector structure embedded in the oxide layer below the second grating coupler.

### Claim 3 (depends on 1)

The package structure according to claim 1, wherein the first grating coupler includes a first grating region, and the second grating coupler includes a second grating region,
the first grating region includes a first trench pattern with a first depth and a second trench pattern with a second depth, the first trench pattern is different from the second trench pattern, the second grating region includes a third trench pattern with a third depth and a fourth trench pattern with a fourth depth, and the third trench pattern is different from the fourth trench pattern.

### Claim 4 (depends on 3)

The package structure according to claim 3, wherein the first depth of the first trench pattern is less than the second depth of the second trench pattern, and
the third depth of the third trench pattern is less than the fourth depth of the fourth trench pattern.

### Claim 5 (depends on 3)

The package structure according to claim 3, wherein the first trench pattern has a width different from that of the second trench pattern, and
the third trench pattern has a width different from that of the fourth trench pattern.

### Claim 6 (depends on 1)

The package structure according to claim 1, wherein the first grating coupler includes a third grating region,
the third grating region includes through holes penetrating the first grating coupler, and the through holes have different widths.

### Claim 7 (depends on 1)

The package structure according to claim 1, further comprising an electronic die bonded to the photonic die, wherein the electronic die has a lens on a surface of the electronic die, and the lens is configured to focus a light beam onto the first grating coupler of the photonic die.

### Claim 8 (depends on 7)

The package structure according to claim 7, further comprising an optical fiber disposed over the lens, wherein a location of the optical fiber is vertically overlapped with a location of the first grating coupler.

### Claim 9

A package structure, comprising:
a first photonic die including a first grating coupler configured to receive and transmit a light beam;
a second photonic die, disposed beside and adjacent to the first photonic die and including a second grating coupler configured to transmit and emit the light beam;
a first lens disposed over the first photonic die above the first grating coupler;
a second lens disposed over the second photonic die above the second grating coupler; and
an interposer structure, disposed below the first and second photonic dies and including a third grating coupler configured to waveguide the light beam,
wherein the first and second photonic dies are optically coupled through the light beam waveguided between the first, third, and second grating couplers.

### Claim 10 (depends on 9)

The package structure according to claim 9, further comprising:
a first optical fiber disposed over the first photonic die, wherein a location of the first optical fiber is overlapped with a location of the first lens; and
a second optical fiber disposed over the second photonic die, wherein a location of the second optical fiber is overlapped with a location of the second lens,
wherein the light beam emitted from the first optical fiber is focused by the first lens onto the first grating coupler, and the light beam transmitted and emitted from the second grating coupler is focused by the second lens to the second optical fiber.

### Claim 11 (depends on 9)

The package structure according to claim 9, wherein the third grating coupler includes a first grating region configured to waveguide the light beam,
the first grating region includes a first trench pattern with a first depth and a second trench pattern with a second depth, the first trench pattern is different from the second trench pattern.

### Claim 12 (depends on 11)

The package structure according to claim 11, wherein the first depth of the first trench pattern is less than the second depth of the second trench pattern.

### Claim 13 (depends on 9)

The package structure according to claim 9, wherein the first grating coupler includes a second grating region configured to receive and transmit the light beam,
the second grating region includes a third trench pattern with a third depth and a fourth trench pattern with a fourth depth, and the third trench pattern is different from the fourth trench pattern.

### Claim 14 (depends on 13)

The package structure according to claim 13, wherein the third depth of the third trench pattern is less than the fourth depth of the fourth trench pattern.

### Claim 15 (depends on 9)

The package structure according to claim 9, wherein the interposer structure further includes a reflector structure disposed below the third grating coupler and the reflector structure is overlapped with a portion of the third grating coupler in location.

### Claim 16

A method for manufacturing a package structure, comprising:
providing an interposer structure, wherein the interposer structure is provided with a first oxide layer, a first grating coupler on the first oxide layer, and a second oxide layer over the first oxide layer and covering the first grating coupler;
disposing a first photonic die including a second grating coupler on the second oxide layer; and
disposing a second photonic die including a third grating coupler on the second oxide layer,
wherein the first and second photonic dies are optically coupled through the first grating coupler of the interposer structure and the second and third grating couplers.

### Claim 17 (depends on 16)

The method according to claim 16, further comprising:
disposed an electronic die on the first photonic die, wherein the electronic die is electrically connected with the first photonic die; and
etching a portion of the electronic die to form a lens, wherein the lens is overlapped with and focuses a light beam on the second grating coupler.

### Claim 18 (depends on 16)

The method according to claim 16, further comprising:
disposing an optical fiber over the first photonic die, wherein a location of the optical fiber is vertically overlapped with a location of the second grating coupler.

### Claim 19 (depends on 16)

The method according to claim 16, wherein the interposer structure further includes a first reflector structure, the first oxide layer includes oxide sublayers, and the first reflector structure is formed between the oxide sublayers of the first oxide layer, and disposed below the first grating coupler.

### Claim 20 (depends on 16)

The method according to claim 16, wherein the first photonic die includes a second reflector structure, wherein the second reflector structure is disposed above the second grating coupler.