# US 12,006,573 B2 · Film layer curing apparatus

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- Number: US 12,006,573 B2
- Document ID: US12006573B2
- Status: Granted
- Kind: B2
- Application number: 17/593,241
- Filed: 2021-05-08
- Published: 2022-09-29
- Granted: 2024-06-11
- Earliest claimed: 2020-05-21
- Assignees: Changxin Memory Technologies, Inc.
- Applicants: Changxin Memory Technologies, Inc.
- Inventors: Tiancheng Wu
- Web page: https://patentgrep.com/patent/US12006573B2

## CPC

- C23C 16/56: After-treatment
- B05C 11/1005: {responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern}
- B05D 3/06: by exposure to radiation (B05D3/02 takes precedence {; plasma treatment B05D3/141})
- C23C 16/52: Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)}
- H10P 72/0436: {mainly by radiation}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08)
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A film layer curing apparatus includes: a support platform, configured to carry a substrate having a film layer on the substrate surface; and a light source component located above the support platform, the light source component including a light source array being arranged toward the support platform and covering the light outgoing surface of the entire film layer by projection of the light source array, the light source array including multiple point light sources evenly distributed on the light outgoing surface, light emitted by the light source array being able to uniformly irradiate the entire film layer so as to improve the thickness distribution uniformity of the film layer after curing.

## Claims

### Claim 1

A film layer curing apparatus, comprising:
a support platform, configured to carry a substrate having a film layer on a substrate surface; and
a light source component, located above the support platform, the light source component comprising a light source array being arranged toward the support platform and covering a light outgoing surface of the entire film layer by projection of the light source array, the light source array comprising multiple point light sources evenly distributed on the light outgoing surface, light emitted by the light source array being able to uniformly irradiate the entire film layer so as to improve a thickness distribution uniformity of the film layer after curing, the light source component further comprising multiple reflectors located on a side of the light source array away from the support platform to reflect light emitted by the light source array, and the multiple reflectors being in one-to-one correspondence with the multiple point light sources, the light source component further comprising multiple sensors that are in one-to-one correspondence with the multiple point light sources, and each of the multiple sensors being configured to detect an intensity of light emitted by a corresponding one of the multiple point light sources.

### Claim 2 (depends on 1)

The film layer curing apparatus of claim 1, wherein the light outgoing surface is circular; and
the multiple point light sources in the light source array are arranged in multiple circles in the radial direction of the light outgoing surface.

### Claim 3 (depends on 1)

The film layer curing apparatus of claim 1, wherein each of the multiple reflectors has an arc-shaped cross section, and each of the multiple reflectors covers above a corresponding one of the multiple point light sources; and
each of the multiple sensors is mounted on a surface of a corresponding one of the multiple reflectors facing a corresponding one of the point light sources; or, each of the multiple reflectors has an opening in which a corresponding one of the multiple sensors is embedded.

### Claim 4 (depends on 3)

The film layer curing apparatus of claim 3, wherein the light source component further comprises a controller which connects the light source array and the multiple sensors, to adjust the intensity of light emitted by each of the point light sources in the light source array according to intensities of light detected by the multiple sensors.

### Claim 5 (depends on 4)

The film layer curing apparatus of claim 4, further comprising a feedback component connected to the controller, configured to obtain a thickness distribution of the film layer after curing, and to adjust the intensity of light emitted by each of the point light sources according to the thickness distribution of the film layer.

### Claim 6 (depends on 5)

The film layer curing apparatus of claim 5, wherein the feedback component calculates an input power adjustment intensity of the point light sources by a following formula:
input power adjustment intensity=influence coefficient×(actual film layer thickness−target film layer thickness);
wherein the influence coefficient is a constant related to a curing performance of the point light sources; the actual film layer thickness is a thickness of a region of the film layer corresponding to the point light source to be adjusted, which is obtained by the feedback component; and the target film layer thickness is a preset thickness for the film layer after curing.

### Claim 7 (depends on 1)

The film layer curing apparatus of claim 1, wherein a main peak wavelength of light emitted by the point light sources is 380 nm to 400 nm.
