# US 12,006,568 B2 · Vapor deposition device

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- Number: US 12,006,568 B2
- Document ID: US12006568B2
- Status: Granted
- Kind: B2
- Application number: 17/596,571
- Filed: 2020-03-18
- Published: 2022-07-21
- Granted: 2024-06-11
- Earliest claimed: 2020-03-18
- Assignees: Thermalytica, Inc.
- Applicants: Thermalytica, Inc.
- Inventors: Kazuhide Matsumoto; Hsin-Tsai Wang
- Web page: https://patentgrep.com/patent/US12006568B2

## CPC

- C23C 14/30: by electron bombardment
- C23C 14/505: {for rotation of the substrates}
- C23C 14/022: {by means of bombardment with energetic particles or radiation}
- C23C 14/024: {Deposition of sublayers, e.g. to promote adhesion of the coating (C23C14/027 takes precedence)}
- C23C 14/243: {Crucibles for source material (C23C14/28, C23C14/30 take precedence)}
- C23C 14/246: {Replenishment of source material}
- C23C 14/35: by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)}
- C23C 14/543: {using measurement on the vapor source}
- C23C 14/564: {Means for minimising impurities in the coating chamber such as dust, moisture, residual gases}
- C23C 14/566: {using a load-lock chamber}
- C23C 14/568: {Transferring the substrates through a series of coating stations (C23C14/562 takes precedence)}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

A vapor deposition device for forming a ceramic coating on a substrate, the device including a coating chamber, loading chambers, substrate support mechanisms, horizontal moving mechanisms, and reversing mechanisms, and configured as follows. The coating chamber and each loading chambers are connected individually to a vacuumizer and are connected to each other at their openings. In the coating chamber, an electron gun is provided that emits an electron beam with which the held ceramic raw material is irradiated. Each of the substrate support mechanisms includes left and right partition walls, a left substrate support plate on the left side of the left partition wall, and a right substrate support plate on the right side of the right partition wall. Each of the substrate support plates has multiple substrate mounting portions for mounting substrates thereon. The left and right substrate support plates are capable of revolving in a plane parallel to the left and right partition walls, and each of the multiple substrate mounting portions is capable of rotating. Each of the horizontal moving mechanisms is configured to cause the substrate support mechanism to move horizontally in the left-right direction between a vapor deposition position where one of the partition walls is in close contact with the opening and a reverse position where the left and right sides of the substrate support mechanism are reversed.

## Claims

### Claim 1

Vapor deposition device for forming a ceramic coating on a substrate, comprising a coating chamber, a loading chamber, and a substrate support, wherein:
the coating chamber and the loading chamber are connected individually to a vacuumizer and are connected to each other at their opening in the left-right direction;
inside the coating chamber are provided a raw material holder that supports a ceramic raw material and an electron gun that irradiates the ceramic raw material with an electron beam;
the substrate support includes a left partition wall and a right partition wall, and also includes a left substrate support plate, multiple substrates being mountable thereon, to the left side of the left partition wall and a right substrate support plate, another set of multiple substrates being mountable thereon, to the right side of the right partition wall, the substrate support is configured to move horizontally in the left-right direction between a vapor deposition position at which one of the left and right partition walls is in close contact with the wall surface around the opening and a reverse position at which none of the left and right partition walls is in contact with the wall surface, is configured to rotate the left substrate support plate in a plane parallel to the left partition wall, is configured to rotate the mounted multiple substrates around a mounting portion, and is configured to rotate the right substrate support plate in a plane parallel to the right partition wall and
the substrate support is further configured to reverse its position such that the other of the left and right partition walls is facing the opening.

### Claim 2 (depends on 1)

The vapor deposition device according to claim 1, wherein the loading chamber further comprises at least one of a sputtering source, a cleaner, and an oxidizer.

### Claim 3 (depends on 1)

The vapor deposition device according to claim 1, wherein the coating chamber further comprises an oxygen plasma generator.

### Claim 4 (depends on 1)

The vapor deposition device according to claim 1, wherein the coating chamber further comprises a scanning mechanism for scanning a position where the ceramic raw material held in the raw material holder is irradiated with the electron beam.

### Claim 5 (depends on 1)

The vapor deposition device according to claim 1, wherein the substrate support comprises gears that define a ratio between rotation speeds of the left and right substrate support plates and rotation speeds of the multiple substrates.

### Claim 6 (depends on 1)

The vapor deposition device according to claim 1, wherein the raw material holder is capable of holding multiple ceramic ingots as the ceramic material and includes a mechanism for sequentially moving the multiple ceramic ingots to the position to be irradiated with the electron beam.

### Claim 7 (depends on 1)

The vapor deposition device according to claim 1, wherein multiple sets of the loading chambers, and the substrate supports are provided at symmetrical positions about the coating chamber.
