# US 12,006,447 B2 · Epoxy conductive paste and preparation method and application thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,006,447 B2 - Document ID: US12006447B2 - Status: Granted - Kind: B2 - Application number: 17/413,564 - Filed: 2020-01-17 - Published: 2022-11-03 - Granted: 2024-06-11 - Earliest claimed: 2020-01-17 - Assignees: Soltrium Advanced Materials Technology, Ltd - Applicants: Soltrium Advanced Materials Technology, Ltd - Inventors: Wen Shi; Fengzhen Sun; Delin Li - Web page: https://patentgrep.com/patent/US12006447B2 ## CPC - C09J 11/04: inorganic - C08K 3/08: Metals - C08K 5/5415: containing at least one Si—O bond - C08K 7/00: Use of ingredients characterised by shape - C08K 9/02: Ingredients treated with inorganic substances - C09J 4/00: Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} - C09J 9/02: Electrically-conducting adhesives - C09J 11/06: organic - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - C08K 2003/0806: {Silver} - C08K 2003/085: {Copper} - C08K 2201/001: Conductive additives - C08K 2201/005: Additives being defined by their particle size in general - C08K 2201/006: Additives being defined by their surface area - C08K 2201/014: Additives containing two or more different additives of the same subgroup in C08K - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature. ## Claims ### Claim 1 An epoxy conductive paste comprising, based on 100 parts by total mass, following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, and 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, 0.4˜5 parts of cationic curing agent; wherein the conductive particles comprise conductive particles with a three-dimensional dendritic microstructure; wherein the conductive particles with the three-dimensional dendritic microstructure are characterized by a specific surface area limited in a range of 0.2˜3.5 m2/g. ### Claim 2 (depends on 1) The epoxy conductive paste of claim 1, wherein the conductive particles with the three-dimensional dendritic microstructure comprise silver particles with the three-dimensional dendritic microstructure or silver-coated copper particles with the three-dimensional dendritic microstructure. ### Claim 3 (depends on 1) The epoxy conductive paste of claim 1, wherein the conductive particles comprise a mixture of spherical silver particles and silver particles with the three-dimensional dendritic microstructure, wherein a mass ratio of the silver particles with the three-dimensional dendritic microstructure to total of the conductive particles is one selected from (0.05 to 0.95):1, and the spherical silver particles are characterized by particle sizes selected from 0.1˜50 μm. ### Claim 4 (depends on 1) The epoxy conductive paste of claim 1, wherein the conductive particles comprise a mixture of spherical silver particles and silver-coated copper particles with the three-dimensional dendritic microstructure, wherein a mass ratio of the silver-coated copper particles with the three-dimensional dendritic microstructure to total of the conductive particles is one selected from (0.05 to 0.95):1, and the spherical silver particles are characterized by particle sizes selected from 0.1˜50 μm. ### Claim 5 (depends on 1) The epoxy conductive paste of claim 1, wherein the conductive particles comprise a mixture of flaky silver particles and silver particles with the three-dimensional dendritic microstructure, wherein a mass ratio of the silver particles with the three-dimensional dendritic microstructure to total of the conductive particles is one selected from (0.05 to 0.95):1, and the flaky silver particles are characterized by particle sizes selected from 0.1˜50 μm. ### Claim 6 (depends on 1) The epoxy conductive paste of claim 1, wherein the conductive particles comprise a mixture of flaky silver particles and silver-coated copper particles with the three-dimensional dendritic microstructure, wherein a mass ratio of the silver-coated copper particles with the three-dimensional dendritic microstructure to total of the conductive particles is one selected from (0.05 to 0.95):1, and the flaky silver particles are characterized by particle sizes selected from 0.1˜50 μm. ### Claim 7 (depends on 1) The epoxy conductive paste of claim 1, wherein the conductive particles comprise a mixture of flaky silver-coated copper particles and silver-coated copper particles with the three-dimensional dendritic microstructure, wherein a mass ratio of the silver-coated copper particles with the three-dimensional dendritic microstructure to total of the conductive particles is one selected from (0.05 to 0.95):1, and the flaky silver-coated copper particles are characterized by particle sizes selected from 0.1˜50 μm. ### Claim 8 (depends on 1) The epoxy conductive paste of claim 1, wherein the conductive particles comprise a mixture of spherical silver particles, flaky silver particles, and silver particles with a three-dimensional dendritic microstructure, and a mass ratio of the flaky silver particles or the spherical silver particles to total of the spherical silver particles and the flaky silver particles is one selected from (0.3 to 0.7):1, a mass ratio of the silver particles with the three-dimensional dendritic microstructure to total of the conductive particles is one selected from (0.05 to 0.95):1, and the spherical silver particles characterized by particle sizes varied in a range of 0.1˜50 μm. ### Claim 9 (depends on 1) The epoxy conductive paste of claim 1, wherein the conductive particles comprise a mixture of spherical silver particles, flaky silver particles, and silver-coated copper particles with a three-dimensional dendritic microstructure, wherein a mass ratio of the flaky silver particles or the spherical silver particles to total of the spherical silver particles and the flaky silver particles is one selected from (0.3˜0.7):1, a mass ratio of the silver-coated copper particles with the three-dimensional dendritic microstructure to total of the conductive particles is one selected from (0.05˜0.95):1, and the spherical silver particles characterized by particle sizes varied in a range of 0.1˜50 μm. ### Claim 10 (depends on 2) The epoxy conductive paste of claim 2, wherein the silver particles with the three-dimensional dendritic microstructure are characterized by sizes varied in a range of 0.1˜50 μm; the silver-coated copper particles with the three-dimensional dendritic microstructure are characterized by sizes varied in a range of 0.1˜50 μm. ### Claim 11 (depends on 1) The epoxy conductive paste of claim 1, wherein a mass ratio of the acrylic to the epoxy is one selected from a range of 0.2:30˜2:20. ### Claim 12 (depends on 1) The epoxy conductive paste of claim 1, wherein the epoxy is at least one of bisphenol A-type epoxy, bisphenol F-type epoxy, naphthalene epoxy, polyurethane modified epoxy, cycloaliphatic epoxy, hydrogenated bisphenol A-type epoxy. ### Claim 13 (depends on 1) The epoxy conductive paste of claim 1, wherein the acrylic is one or a mixture of urethane acrylate and aliphatic urethane acrylate; a mass ratio of the acrylic to the epoxy is one selected from a range of 0.2:30˜2:20. ### Claim 14 (depends on 1) The epoxy conductive paste of claim 1, wherein the silane coupling agent is at least one of 2-(3,4-epoxycyclohexyl) ethanetrimethoxy silane, 3-glycidyl ether oxypropyl methyl dimethoxy silane, 3-glycidyl ether oxypropyl trimethoxy silane, 3-glycidoxy propyl methyl diethoxy silane, and 3-glycidoxy propyl triethoxy silane. ### Claim 15 (depends on 1) The epoxy conductive paste of claim 1, wherein the reactive diluent is at least one of aliphatic glycidyl ether 1,6 hexanediol diglycidyl ether, C12-C14 alkyl glycidyl ether, dipropylene glycol diglycidyl ether, nonylphenol glycidyl ether, o-cresol glycidyl ether, trimethylolpropane triglycidyl ether, castor oil triglycidyl ether, and pentaerythritol tetraglycidyl ether. ### Claim 16 (depends on 1) The epoxy conductive paste of claim 1, wherein the toughening agent is at least one of core-shell rubber epoxy toughening agent, polyester polyol, and fumed silica. ### Claim 17 (depends on 1) The epoxy conductive paste of claim 1, wherein the cationic curing agent is at least one of dicyandiamide epoxy curing agent, substituted urea accelerator, fatty amine epoxy curing agent, and polyamide epoxy. ### Claim 18 (depends on 1) A method of using the epoxy conductive paste according to claim 1 comprising: printing the epoxy conductive paste on a substrate of a semiconductor element; disposing the substrate printed with the epoxy conductive paste in an environment of 80° ° C. to 170° C.; curing the epoxy conductive paste at 150° C. for 5 to 300 seconds; and packaging the semiconductor element via the epoxy conductive paste into a semiconductor device.