# US 12,005,656 B2 · Protective case for electronic device and method for manufacturing the same

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- Number: US 12,005,656 B2
- Document ID: US12005656B2
- Status: Granted
- Kind: B2
- Application number: 18/365,436
- Filed: 2023-08-04
- Published: 2024-02-08
- Granted: 2024-06-11
- Earliest claimed: 2022-08-05
- Assignees: Shenzhen Lingyi Innovation Technology Co., Ltd
- Applicants: Shenzhen Lingyi Innovation Technology Co., Ltd
- Inventors: Yanghui Zheng; Sen Qiu; Yanghong Zheng; Jingyan Zheng; Qiushun Liu; Shaohua Chen
- Web page: https://patentgrep.com/patent/US12005656B2

## CPC

- B29C 70/70: Completely encapsulating inserts {(B29C70/86 takes precedence)}
- A45C 11/00: Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 (specially adapted for toiletry or cosmetic equipment A45D29/20, A45D44/18; travelling sewing kits A45F3/48)
- B29C 51/08: Deep drawing or matched-mould forming, i.e. using mechanical means only
- B29C 51/14: using multilayered preforms or sheets
- B29C 51/264: {Auxiliary operations prior to the thermoforming operation, e.g. cutting (B29C51/42, B29C51/46 take precedence)}
- B29C 70/44: using isostatic pressure, e.g. pressure difference-moulding, vacuum bag-moulding, autoclave-moulding or expanding rubber-moulding
- B29C 70/54: Component parts, details or accessories; Auxiliary operations {, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing}
- B29C 70/88: characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B32B 3/08: characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)}
- B32B 3/266: {characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12}
- B32B 5/02: characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)}
- B32B 5/26: another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)}
- B32B 37/04: characterised by the partial melting of at least one layer
- B32B 37/06: characterised by the heating method
- B32B 37/10: characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B 37/18: involving the assembly of discrete sheets or panels only
- B32B 37/26: with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B 38/0004: {Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence)}
- A45C 11/002: {for storing portable handheld communication devices, e.g. pagers or smart phones}
- A45C 11/003: {for storing portable computing devices, e.g. laptops, tablets or calculators}
- B29K 2105/0097: {Glues or adhesives, e.g. hot melts or thermofusible adhesives}
- B29K 2277/10: {Aromatic polyamides [Polyaramides] or derivatives thereof }
- B29K 2309/08: Glass
- B29K 2995/0008: Magnetic or paramagnetic
- B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements}
- B32B 2037/268: {Release layers}
- B32B 2260/021: Fibrous or filamentary layer
- B32B 2260/046: Synthetic resin
- B32B 2262/0269: Aromatic polyamide fibres
- B32B 2262/101: Glass fibres
- B32B 2305/076: Prepregs
- B32B 2307/208: Magnetic, paramagnetic
- B32B 2307/7376: Thickness
- B32B 2309/02: Temperature
- B32B 2309/04: Time
- B32B 2315/085: Glass fiber cloth or fabric
- B32B 2377/00: Polyamides
- B32B 2457/00: Electrical equipment
- B32B 2571/00: Protective equipment
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- A45C: PURSES; LUGGAGE; HAND CARRIED BAGS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

The present disclosure relates to the technical field of protective case, in particular to a protective case for electronic device and a method for manufacturing the same. The protective case for electronic device includes an inner shell, an outer shell, and a magnetic interlayer that fits and in contact with the inner shell and the outer shell, wherein: the magnetic interlayer includes an interlayer base material and a magnetic part, the magnetic interlayer is provided with a through installation hole, and the magnetic part is fixedly embedded in the installation hole, the thickness of the magnetic part matches with the depth of the installation hole, the interlayer base material includes a hot-melt base material and reinforcing fiber yarn contained in the hot-melt base material, and the hot-melt base material is filled between the magnetic part and the inner side wall of the installation hole.

## Claims

### Claim 1

A protective case for electronic device, comprising:
an inner shell;
an outer shell; and
a magnetic interlayer disposed between and in contact with the inner shell and the outer shell, wherein:
the magnetic interlayer includes an interlayer base material and a magnetic part, the interlayer base material including an inner side wall defining a through-hole, and the magnetic part fixed in the through-hole,
the interlayer base material having a base material thickness defining a depth of the through-hole, and the magnetic part having a magnetic part thickness that is equal to the base material thickness and the depth of the through-hole,
the interlayer base material comprising a hot-melt base material and reinforcing fiber yarn embedded in the hot-melt base material,
the hot-melt base material disposed in contact with the magnetic part along the inner side wall of the through-hole to fix the magnetic part in the through-hole, wherein the magnetic part is fixed in the through-hole and the magnetic interlayer is flattened by applying heat and pressure to the magnetic interlayer to melt the hot-melt base material.

### Claim 2 (depends on 1)

The protective case for electronic device according to claim 1, wherein the inner shell and the outer shell have substantially the same ductility level as the reinforcing fiber yarn.

### Claim 3 (depends on 2)

The protective case for electronic device according to claim 2, wherein the inner shell, the outer shell and the reinforcing fiber yarn have substantially the same degree of compatibility with resin.

### Claim 4 (depends on 1)

The protective case for electronic device according to claim 1, wherein the inner shell and the outer shell are made of aramid fiber, the reinforcing fiber yarn is a glass fiber yarn, and the hot-melt base material is made of resin.

### Claim 5 (depends on 1)

The protective case for electronic device according to claim 1, wherein the magnetic interlayer is produced according to the following steps:
S100: opening the through-hole in the interlayer base material;
S200: laying a first release film on an upper surface of a lower shaping mold;
S300: laying the interlayer base material obtained in step S100 on the first release film;
S400: embedding the magnetic part in the through-hole in the interlayer base material to obtain a magnetic part and interlayer base material subasssembly;
S500: laying a second release film on an upper surface of the magnetic part and interlayer base material subassembly obtained in step S400;
S600: putting covering an upper shaping mold on an upper surface of the second release film to obtain a molding subassembly including the interlayer base material, the magnetic part, the first release film, the lower shaping mold, the second release film, and the upper shaping mold;
S700: putting the molding subassembly obtained in step S600 into a first flexible container;
S800: performing air extraction processing on the first flexible container, and sealing the first flexible container after the air extraction processing is completed;
S900: putting the first flexible container and the molding subassembly inside of the first flexible container into an autoclave, sealing the autoclave, inflating and pressurizing the autoclave, and heating the first flexible container and the molding subassembly inside of the first flexible container assembly obtained in step S800 for a predetermined duration;
S1000: stopping the heating after performing the heating for the predetermined duration, waiting for the first flexible container and the molding subassembly inside of the first flexible container to cool to a preset temperature to obtain a semi-finished magnetic interlayer product between the first release film and the second release film, taking out the semi-finished magnetic interlayer product;
S1100: cutting the semi-finished magnetic interlayer obtained in step S1000 to a preset shape and size to obtain the magnetic interlayer.

### Claim 6 (depends on 5)

The protective case for electronic device according to claim 5, wherein the reinforcing fiber yarn is a glass fiber yarn, and the hot-melt base material is made of resin;
wherein, in the step S900, the heating of the first flexible container and the molding subassembly inside of the first flexible container for a preset duration includes:
heating the first flexible container and the molding subassembly inside of the first flexible container from an initial temperature to 125 degrees Celsius and maintaining the temperature at 125 degrees Celsius for 15 minutes, then heating to 135 degrees Celsius and maintaining the temperature at 135 degrees Celsius for 40 minutes.

### Claim 7 (depends on 5)

The protective case for electronic device according to claim 5, wherein the reinforcing fiber yarn is a glass fiber yarn, and the hot-melt base material is made of resin;
wherein, in the step S900, the heating of the first flexible container and the molding subassembly inside of the first flexible container for a preset duration includes:
heating the assembly obtained in step S800 from the initial temperature to between 100-130 degrees Celsius and maintaining the temperature of between 100-130 degrees Celsius for between 10-20 minutes, then heating to between 130-160 degrees Celsius and maintaining the temperature of between 130-160 degrees Celsius for between 30-50 minutes.

### Claim 8 (depends on 5)

The protective case for electronic device according to claim 5, wherein, in the step S900, inflating and pressurizing the autoclave includes: inflating and pressurizing the autoclave so that a pressure in the autoclave is within a range of 0.4 MPa to 0.8 MPa.

### Claim 9 (depends on 8)

The protective case for electronic device according to claim 8, wherein the lower shaping mold and the upper shaping mold are both plate-shaped.

### Claim 10 (depends on 9)

The protective case for electronic device according to claim 9, wherein the first flexible container is a metal foil bag, and when the first flexible container is in an empty exhaust state, the first flexible container is sheet-shaped.

### Claim 11 (depends on 10)

The protective case for electronic device according to claim 10, wherein the first flexible container is a tin foil bag.

### Claim 12 (depends on 5)

The protective case for electronic device according to claim 5, wherein the interlayer base material comprises a plurality of stacked sheets, the sheets include the hot-melt base material and the reinforcing fiber yarn contained in the hot-melt base material; the through-hole is an annular hole, and the step S100 further includes:
Step S110: stacking the plurality of sheets to form the interlayer base material having a preset thickness;
Step S120: punching through each sheet of the plurality of sheets to form the annular hole.

### Claim 13 (depends on 12)

The protective case for electronic device according to claim 12, wherein the magnetic part comprises a main adsorption part, the main adsorption part includes a plurality of main magnetic attracting parts and an annular film connecting the plurality of main magnetic attracting parts into a ring shape; and
the step S400 includes:
embedding the main adsorption part in the annular hole of the interlayer base material; and
removing the annular film.

### Claim 14 (depends on 1)

The protective case for electronic device according to claim 1, wherein the magnetic interlayer is produced according to the following steps:
S100: opening the through-hole in the interlayer base material;
S200: laying the interlayer base material obtained in step S100 on a lower shaping mold;
S300: embedding the magnetic part in the through-hole of the interlayer base material to obtain a magnetic part and interlayer base material subasssembly;
S400: putting an upper shaping mold on an upper surface of the magnetic part and interlayer base material subasssembly assembly obtained in step S300;
S500: putting the magnetic part and interlayer base material subassembly and upper shaping mold into a first flexible container;
S600: performing air extraction processing on the first flexible container, and sealing the first flexible container after the air extraction processing is completed;
S700: putting the first flexible container including the magnetic part and interlayer base material subassembly and upper shaping mold contents inside the first flexible container into an autoclave, sealing the autoclave, inflating and pressurizing the autoclave, and heating the first flexible container including the magnetic part and interlayer base material subassembly and upper shaping mold inside the first flexible container for a predetermined duration;
S800: stopping the heating after performing the heating for the predetermined duration, waiting for the first flexible container including the magnetic part and interlayer base material subassembly and upper shaping mold inside the first flexible container to cool to a preset temperature to obtain a semi-finished magnetic interlayer product;
S900: cutting the semi-finished magnetic interlayer obtained in step S800 to a preset shape and size to obtain the magnetic interlayer.

### Claim 15 (depends on 1)

The protective case for electronic device according to claim 1, wherein the inner shell, the outer shell and the reinforcing fiber yarn are made of aramid fiber, the hot-melt base material is made of resin.

### Claim 16 (depends on 1)

The protective case for electronic device according to claim 1, wherein a thickness of the inner shell is 0.25 mm-0.5 mm, a thickness of the outer shell is 0.25 mm-0.5 mm, and a thickness of the magnetic interlayer is 0.1 mm-0.5 mm.