# US 12,005,516 B2 · Method for smoothing a component surface region

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- Number: US 12,005,516 B2
- Document ID: US12005516B2
- Status: Granted
- Kind: B2
- Application number: 17/270,614
- Filed: 2019-09-13
- Published: 2021-07-01
- Granted: 2024-06-11
- Earliest claimed: 2018-09-14
- Assignees: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- Applicants: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Inventors: Benjamin Graffel; Falk Winckler; Sven Fritzche; Bernd Kieback; Burghardt Klöden; Thomas Weissgärber
- Web page: https://patentgrep.com/patent/US12005516B2

## CPC

- B23K 15/08: Removing material, e.g. by cutting, by hole drilling
- B23K 15/0013: {Positioning or observing workpieces, e.g. with respect to the impact; Aligning, aiming or focusing electron beams}
- H01J 37/3005: {Observing the objects or the point of impact on the object}
- H01J 37/304: Controlling tubes by information coming from the objects {or from the beam}, e.g. correction signals
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

A method is provided for smoothing a surface region of a component consisting of an electrically conductive material. The surface region of the component is coated inside a vacuum chamber, by focused electron beam(s) with a first surface energy, which brings about melting of the component material within the surface region. Before melting, the surface region is passed over at least twice by the electron beam, each time with a different focal length of the electron beam. A second surface energy is set for the electron beam, such that no melting of the component material is brought about in the surface region. Data is recorded by a number of sensors arranged inside the vacuum chamber. An actual value for the roughness is compared to a set point value. If the actual value has not reached the set point value, a value for the first surface energy is determined via comparison.

## Claims

### Claim 1

A method for smoothing a surface region on a component that consists of an electrically conductive material at least within the surface region, the method comprising:
scanning the surface region of the component within a vacuum chamber by at least one focused electron beam with a first surface energy that causes the component material within the surface region to fuse;
scanning the surface area prior to fusing at least twice by the at least one electron beam, in each case with a different focal length of the at least one electron beam;
setting a second surface energy for the at least one electron beam that does not cause the component material in the surface region to fuse;
recording data by a plurality of sensors arranged within the vacuum chamber, the data characterizing the electrical current caused by backscatter electrons impacting the sensors;
deriving, with an analysis device, an actual value for the roughness within the surface region from the data recorded by the sensors, wherein the actual value for the roughness is compared with a target value for the roughness, and a value for the first surface energy is determined as a function of the comparison result when the actual value for the roughness has not reached the target value for the roughness; and
scanning the surface region thereafter by the at least one electron beam with the first surface energy, whereupon the method is continued with the scanning the surface area prior to fusing.

### Claim 2 (depends on 1)

The method of claim 1, wherein the at least one electron beam is directed toward the surface region of the component at an angle less than 90°.

### Claim 3 (depends on 2)

The method of claim 2, wherein the at least one electron beam is directed toward the surface region of the component at an angle in the range of 45° to 90°.

### Claim 4 (depends on 3)

The method of claim 3, wherein the component is arranged within the vacuum chamber using a holding device that can change the component position within the vacuum chamber in three dimensions.

### Claim 5 (depends on 4)

The method of claim 4, wherein after the component is arranged in the vacuum chamber using the holding device,
the component is scanned by the at least one electron beam;
deriving an assessment of the actual three-dimensional orientation of the component within the vacuum chamber from the data recorded by the sensors within the analysis device, and the actual three-dimensional orientation is compared with a target orientation of the component; and
generating, as a function of the comparison result, a signal with which the holding device guides the component to the target orientation within the vacuum chamber.