# US 12,005,482 B2 · Substrate treatment device

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- Number: US 12,005,482 B2
- Document ID: US12005482B2
- Status: Granted
- Kind: B2
- Application number: 17/195,924
- Filed: 2021-03-09
- Published: 2021-09-30
- Granted: 2024-06-11
- Earliest claimed: 2020-03-31
- Assignees: Shibaura Mechatronics Corporation
- Applicants: Shibaura Mechatronics Corporation
- Inventors: Kensuke Demura; Daisuke Matsushima; Masaya Kamiya
- Web page: https://patentgrep.com/patent/US12005482B2

## CPC

- B08B 7/0092: {by cooling}
- B08B 3/10: with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B 7/0014: {by incorporation in a layer which is removed with the contaminants}
- H10P 72/0434: {mainly by convection}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

According to one embodiment, q substrate treatment device includes a placement stand, a plurality of support portions, a cooling part, a liquid supplier, and at least one protrusion. The placement stand has a plate shape, and is configured to rotate. The support portions are provided on one surface of the placement stand and configured to support a substrate. The cooling part is configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions. The liquid supplier is configured to supply a liquid onto a surface of the substrate. At least one protrusion is provided on the one surface of the placement stand and extends along a boundary line of a region where the substrate is provided in a plan view.

## Claims

### Claim 1

A substrate treatment device, comprising:
a placement stand having a plate shape, and being configured to rotate;
a plurality of support portions provided on one surface of the placement stand and supporting a substrate, a planar shape of the substrate being a substantially quadrangle, each of the plurality of support portions supporting a corner part of the substrate;
a liquid supplier configured to supply a liquid onto a surface of the substrate supported by the support portions, the surface of the substrate being a surface opposite to the placement stand side of the substrate, a film of the liquid being formed by the liquid supplied onto the surface of the substrate;
a cooling part configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions, the film of the liquid becoming supercooled by the supplied cooling gas and then freezing;
a protrusion provided on the one surface of the placement stand, the protrusion provided at a position on or near a boundary line of a region where the substrate supported by the plurality of support portions is provided in a plan view, the protrusion extending along the boundary line, the protrusion being not provided at a position of the corner part of the substrate, a gap being configure to be formed between a top portion of the protrusion and the back surface of the substrate; and
a controller controlling the liquid supplier and the cooling part, the controller being configured to perform following steps;
a liquid film forming step of forming a liquid film by supplying the liquid toward the surface of the substrate,
a supercooling step in which the liquid film on the surface of the substrate being supercooled state by the cooling part.

### Claim 2 (depends on 1)

The device according to claim 1, wherein
a temperature distribution of the substrate cooled is configured to be controlled by at least one of an overflow resistance of the cooling gas flowing out from a space surrounded by the placement stand, the back surface of the substrate and the protrusion through the gap, a size of an opening of the gap, and a position of the gap.

### Claim 3 (depends on 1)

The device according to claim 1, wherein in a plan view, the protrusion is provided inside the region where the substrate is provided.

### Claim 4 (depends on 1)

The device according to claim 1, wherein
in a plan view, a portion of the protrusion is provided inside the region where the substrate is provided, and a remaining portion of the protrusion is provided outside the region where the substrate is provided.

### Claim 5 (depends on 1)

The device according to claim 1, wherein
in a plan view, the protrusion is provided outside the region where the substrate is provided.