Multi-layer curable compositions containing 1,1-di-activated vinyl compound products and related processes

A curable composition configured to be applied in direct contact with a layer comprising a first polymeric resin, the curable composition comprising:

• a second polymeric resin;
• and
• a crosslinking/curing agent for the second polymeric resin, wherein the crosslinking/curing agent comprises a polymerization reaction product of a methylene dicarbonyl compound, a multifunctional form thereof, or a combination of any thereof.