# US 12,004,720 B2 · Packaged image sensor and endoscope > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,004,720 B2 - Document ID: US12004720B2 - Status: Granted - Kind: B2 - Application number: 17/476,808 - Filed: 2021-09-16 - Published: 2022-08-25 - Granted: 2024-06-11 - Earliest claimed: 2021-02-19 - Assignees: Medimaging Integrated Solution, Inc. - Applicants: Medimaging Integrated Solution, Inc. - Inventors: Chu-Ming Cheng; Shangyi Wu; Chia-Jung Lee; Chih-Lu Hsu - Web page: https://patentgrep.com/patent/US12004720B2 ## CPC - A61B 1/051: {Details of CCD assembly} - A61B 1/0011: {Manufacturing of endoscope parts} - A61B 1/00114: {Electrical cables in or with an endoscope} - A61B 1/00124: {electrical, e.g. electrical plug-and-socket connection} - A61B 1/0057: {Constructional details of force transmission elements, e.g. control wires} - A61B 1/0676: {at distal tip of an endoscope} - H10F 39/804: {Containers or encapsulations} - H10F 55/255: formed in, or on, a common substrate - H10F 77/407: {indirectly associated with the devices} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - A61B 1/018: for receiving instruments - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract A packaged image sensor includes a substrate, an image sensor, a light-emitting element, and a first encapsulant. The substrate includes a through-hole. The image sensor and the light-emitting element are disposed on the substrate and are electrically connected to the substrate. The first encapsulant is filled between the image sensor and the light emitting element, and keeps the through-hole of the substrate opened. The through-hole of the substrate of the above-mentioned packaged image sensor can define a relative position between a pipe and the image sensor to facilitate the subsequent packaging process. An endoscope including the above-mentioned packaged image sensor is also disclosed. ## Claims ### Claim 1 A packaged image sensor, comprising: a substrate, including a first surface, a second surface opposite to the first surface, a through-hole, a plurality of first electric-conduction contacts, a plurality of second electric-conduction contacts, and a plurality of third electric-conduction contacts, wherein the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are disposed on the first surface, the plurality of first electric-conduction contacts are disposed on the second surface, and the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts; an image sensor, disposed on the substrate and electrically connected with the plurality of second electric-conduction contacts; a light-emitting element, disposed on the substrate and near the image sensor and electrically connected with the plurality of third electric-conduction contacts; and a first encapsulant, filled into a space between the image sensor and the light-emitting element with the through-hole of the substrate kept opened; wherein a pipe is disposed inside the through-hole of the substrate and protruding from the second surface of the substrate where the first electric-conduction contacts are disposed. ### Claim 2 (depends on 1) The packaged image sensor according to claim 1, further comprising: a secondary optical structure, disposed on a light-output side of the light-emitting element. ### Claim 3 (depends on 1) The packaged image sensor according to claim 1, further comprising: a circuit board, including a third surface, a fourth surface different from the third surface, a plurality of fourth electric-conduction contacts and a plurality of fifth electric-conduction contacts, wherein the plurality of fourth electric-conduction contacts are disposed on the third surface, the plurality of fifth electric-conduction contacts are disposed on the fourth surface, the plurality of fourth electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts of the substrate; and a plurality of conductive wires, electrically connected with the plurality of corresponding fifth electric-conduction contacts. ### Claim 4 (depends on 3) The packaged image sensor according to claim 3, further comprising: a second encapsulant, encapsulating the circuit board and one end of the plurality of conductive wires. ### Claim 5 (depends on 3) The packaged image sensor according to claim 3, further comprising: a pipe, disposed inside the through-hole of the substrate and protruding from a surface of the substrate where the first electric-conduction contacts are disposed; and a second encapsulant, encapsulating the light-emitting element, the circuit board, one end of the plurality of conductive wires, and a portion of the pipe, and keeping two ends of the pipe opened. ### Claim 6 (depends on 5) The packaged image sensor according to claim 5, wherein the second encapsulant includes a secondary optical structure, which is disposed corresponding to the light-emitting element. ### Claim 7 (depends on 5) The packaged image sensor according to claim 5, further comprising: a plurality of steering control wires, which is connected with the substrate or the circuit board, wherein the second encapsulant encapsulates one end of the steering control wires. ### Claim 8 (depends on 7) The packaged image sensor according to claim 7, wherein the second encapsulant is made of a flexible material. ### Claim 9 (depends on 1) The packaged image sensor according to claim 1, wherein the substrate includes a recess; the plurality of second electric-conduction contacts and the image sensor are disposed on a bottom of the recess. ### Claim 10 (depends on 1) The packaged image sensor according to claim 1, wherein an altitude of a light-input surface of the image sensor is equal to or higher than an altitude of a light-output surface of the light-emitting element. ### Claim 11 (depends on 1) The packaged image sensor according to claim 1, wherein the packaged image sensor comprises a plurality of light-emitting elements; the plurality of light-emitting elements emits light beams having an identical wavelength or respectively emits light beams having different wavelengths or spectrums. ### Claim 12 (depends on 1) The packaged image sensor according to claim 1, wherein the first encapsulant is made of a semi-transparent resin or an opaque resin.