# US 12,004,719 B2 · Image sensor package and endoscope > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,004,719 B2 - Document ID: US12004719B2 - Status: Granted - Kind: B2 - Application number: 17/535,867 - Filed: 2021-11-26 - Published: 2022-08-25 - Granted: 2024-06-11 - Earliest claimed: 2021-02-19 - Assignees: Medimaging Integrated Solution, Inc. - Applicants: Medimaging Integrated Solution, Inc. - Inventors: Shangyi Wu; Chu-Ming Cheng - Web page: https://patentgrep.com/patent/US12004719B2 ## CPC - A61B 1/05: characterised by the image sensor, e.g. camera, being in the distal end portion - A61B 1/051: {Details of CCD assembly} - G02B 23/2415: {Stereoscopic endoscopes} - G02B 23/2484: {Arrangements in relation to a camera or imaging device (processing or control of video signals generated by an endoscope H04N23/60, H04N23/70)} - H10F 39/811: {Interconnections} - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract An image sensor package includes a first substrate, an image sensor, a second substrate, a light-emitting element, and a first encapsulant. The image sensor is disposed on and electrically connected with the first substrate. The second substrate is disposed on and electrically connected with the first substrate, wherein the second substrate includes an accommodating portion and the image sensor protrudes from the second substrate via the accommodating portion. The light-emitting element is disposed on the second substrate and close to the image sensor, and is electrically connected to the second substrate. The first encapsulant is filled in a space between the image sensor and the light-emitting element. The abovementioned image sensor package can achieve miniaturization and provide better illumination. An endoscope including the abovementioned image sensor package is also disclosed. ## Claims ### Claim 1 An image sensor package, comprising: a first substrate, including a plurality of first electric-conduction contacts, a plurality of second electric-conduction contacts, and a plurality of third electric-conduction contacts, wherein the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts; an image sensor, disposed on the first substrate and electrically connected with the plurality of second electric-conduction contacts; a second substrate, disposed on the first substrate and includes a plurality of fourth electric-conduction contacts, a plurality of fifth electric-conduction contacts, and an accommodating portion, wherein the plurality of fourth electric-conduction contacts is electrically connected with the plurality of corresponding third electric-conduction contacts, and the image sensor protrudes from the second substrate via the accommodating portion; a light-emitting element, disposed on the second substrate and near the image sensor and electrically connected with the plurality of fifth electric-conduction contacts; and a first encapsulant, filled into a space between the image sensor and the light-emitting element. ### Claim 2 (depends on 1) The image sensor package according to claim 1, wherein the accommodating portion of the second substrate is a through-hole or a notch. ### Claim 3 (depends on 2) The image sensor package according to claim 2, wherein the first substrate further includes a cavity or a step structure, the plurality of second electric-conduction contacts and the image sensor are disposed on a bottom of the cavity or the step structure, and a portion of the second substrate is projected on the bottom of the cavity or the step structure. ### Claim 4 (depends on 3) The image sensor package according to claim 3, wherein the image sensor includes a protrudent portion extending laterally, and a height of the protrudent portion is equal to or smaller than a depth of the cavity or a height of the step structure. ### Claim 5 (depends on 2) The image sensor package according to claim 2, wherein the second substrate further includes a cavity, and the through-hole penetrates a bottom of the cavity. ### Claim 6 (depends on 1) The image sensor package according to claim 1, wherein the image sensor includes a protrudent portion extending laterally, and an inner wall of the accommodating portion of the second substrate includes a step structure so that a portion of the second substrate is projected on the protrudent portion of the image sensor. ### Claim 7 (depends on 1) The image sensor package according to claim 1, wherein the image sensor includes a light incident surface and an electric-connection end, and a section area of the electric-connection end is larger than an area of the light incident surface. ### Claim 8 (depends on 1) The image sensor package according to claim 1, wherein a height of a light incident surface of the image sensor is equal to or higher than a height of a light-emitting surface of the light-emitting element. ### Claim 9 (depends on 1) The image sensor package according to claim 1, wherein a height of a light incident surface of the image sensor is higher than a height of a light-emitting surface of the light-emitting element, and a height difference between the light incident surface of the image sensor and the light-emitting surface of the light-emitting element is equal to or smaller than 0.5 mm. ### Claim 10 (depends on 1) The image sensor package according to claim 1, comprising a plurality of light-emitting elements; and the plurality of light-emitting elements emit light beams respectively having different wavelengths or emits light beams having an identical wavelength. ### Claim 11 (depends on 1) The image sensor package according to claim 1, wherein the second substrate further includes a dam, which is disposed around the light emitting element to form an area where the first encapsulant is filled. ### Claim 12 (depends on 11) The image sensor package according to claim 11, wherein a height of the dam is equal to or smaller than a height of a light-emitting surface of the light-emitting element. ### Claim 13 (depends on 1) The image sensor package according to claim 1, wherein the first encapsulant is made of a semi-transparent resin or an opaque resin. ### Claim 14 (depends on 1) The image sensor package according to claim 1, further comprising a secondary optical structure, disposed on a light-emitting side of the light-emitting element. ### Claim 15 (depends on 1) The image sensor package according to claim 1, further comprising a circuit board, including a plurality of sixth electric-conduction contacts and a plurality of seventh electric-conduction contacts, wherein the plurality of sixth electric-conduction contacts is electrically connected with the plurality of corresponding first electric-conduction contacts of the first substrate; and a plurality of cables, electrically connected with the plurality of corresponding seventh electric-conduction contacts. ### Claim 16 (depends on 15) The image sensor package according to claim 15, further comprising a second encapsulant, encapsulating the circuit board and one end of the plurality of cables. ### Claim 17 (depends on 15) The image sensor package according to claim 15, further comprising a second encapsulant, encapsulating the light-emitting element, the circuit board and one end of the plurality of cables and including a secondary optical structure corresponding to the light-emitting element. ### Claim 18 (depends on 15) The image sensor package according to claim 15, further comprising a pipe, disposed beside the first substrate along a sensing direction of the image sensor; and a second encapsulant, encapsulating the light-emitting element, the circuit board, one end of the plurality of cables, and one end of the pipe. ### Claim 19 (depends on 18) The image sensor package according to claim 18, wherein the second encapsulant includes a secondary optical structure corresponding to the light-emitting element. ### Claim 20 An endoscope, comprising: a tube, including a first opening and a second opening, wherein an end of the first opening of the tube is to be extended to a cavity; an image sensor package, disposed at the end of the first opening of the tube to capture images of the cavity and generate corresponding electronic signals, and including a first substrate, including a plurality of first electric-conduction contacts, a plurality of second electric-conduction contacts, and a plurality of third electric-conduction contacts, wherein the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts; an image sensor, disposed on the first substrate and electrically connected with the plurality of second electric-conduction contacts; a second substrate, disposed on the first substrate and includes a plurality of fourth electric-conduction contacts, a plurality of fifth electric-conduction contacts, and an accommodating portion, wherein the plurality of fourth electric-conduction contacts is electrically connected with the plurality of corresponding third electric-conduction contacts, and the image sensor protrudes from the second substrate via the accommodating portion; a light-emitting element, disposed on the second substrate and near the image sensor and electrically connected with the plurality of fifth electric-conduction contacts; and a first encapsulant, filled into a space between the image sensor and the light-emitting element; a plurality of cables, disposed inside the tube, wherein one end of the plurality of cables is electrically connected with the plurality of corresponding first electric-conduction contacts of the first substrate; and an electric connector, electrically connected with another end of the plurality of cables to enable the endoscope to be electrically connected with an external electronic device in a pluggable way. ### Claim 21 (depends on 20) The endoscope according to claim 20, further comprising: an electronic element, electrically connected with the image sensor package and the electric connector and processing electronic signals generated by the image sensor package. ### Claim 22 (depends on 20) The endoscope according to claim 20, further comprising: a housing, disposed between the image sensor package and the electric connector. ### Claim 23 (depends on 20) The endoscope according to claim 20, wherein the accommodating portion of the second substrate is a through-hole or a notch. ### Claim 24 (depends on 23) The endoscope according to claim 23, wherein the first substrate further includes a cavity or a step structure, the plurality of second electric-conduction contacts and the image sensor are disposed on a bottom of the cavity or the step structure, and a portion of the second substrate is projected on the bottom of the cavity or the step structure. ### Claim 25 (depends on 24) The endoscope according to claim 24, wherein the image sensor includes a protrudent portion extending laterally, and a height of the protrudent portion is equal to or smaller than a depth of the cavity or a height of the step structure. ### Claim 26 (depends on 23) The endoscope according to claim 23, wherein the second substrate further includes a cavity, and the through-hole penetrates a bottom of the cavity. ### Claim 27 (depends on 20) The endoscope according to claim 20, wherein the image sensor includes a protrudent portion extending laterally, and an inner wall of the accommodating portion of the second substrate includes a step structure so that a portion of the second substrate is projected on the protrudent portion of the image sensor. ### Claim 28 (depends on 20) The endoscope according to claim 20, wherein the image sensor includes a light incident surface and an electric-connection end, and a section area of the electric-connection end is larger than an area of the light incident surface. ### Claim 29 (depends on 20) The endoscope according to claim 20, wherein a height of a light incident surface of the image sensor is equal to or higher than a height of a light-emitting surface of the light-emitting element. ### Claim 30 (depends on 20) The endoscope according to claim 20, wherein a height of a light incident surface of the image sensor is higher than a height of a light-emitting surface of the light-emitting element, and a height difference between the light incident surface of the image sensor and the light-emitting surface of the light-emitting element is equal to or smaller than 0.5 mm. ### Claim 31 (depends on 20) The endoscope according to claim 20, wherein the image sensor package comprises a plurality of light-emitting elements, and the plurality of light-emitting elements emits light beams respectively having different wavelengths or emits light beams having an identical wavelength. ### Claim 32 (depends on 20) The endoscope according to claim 20, wherein the second substrate further includes a dam, which is disposed around the light emitting element to limit an area where the first encapsulant is filled. ### Claim 33 (depends on 20) The endoscope according to claim 20, wherein the first encapsulant is made of a semi-transparent resin or an opaque resin. ### Claim 34 (depends on 20) The endoscope according to claim 20, wherein the image sensor package further comprises: a secondary optical structure, disposed on a light-emitting side of the light-emitting element. ### Claim 35 (depends on 20) The endoscope according to claim 20, wherein the image sensor package further comprises: a circuit board, including a plurality of sixth electric-conduction contacts and a plurality of seventh electric-conduction contacts, wherein the plurality of sixth electric-conduction contacts is electrically connected with the plurality of corresponding first electric-conduction contacts of the first substrate, and the plurality of cables is electrically connected with the plurality of corresponding seventh electric-conduction contacts. ### Claim 36 (depends on 35) The endoscope according to claim 35, wherein the image sensor package further comprises: a second encapsulant, encapsulating the circuit board and one end of the plurality of cables. ### Claim 37 (depends on 35) The endoscope according to claim 35, wherein the image sensor package further comprises: a second encapsulant, encapsulating the light-emitting element, the circuit board and one end of the plurality of cables and including a secondary optical structure corresponding to the light-emitting element. ### Claim 38 (depends on 35) The endoscope according to claim 35, wherein the image sensor package further comprises: a pipe, disposed beside the first substrate along a sensing direction of the image sensor; and a second encapsulant, encapsulating the light-emitting element, the circuit board, one end of the plurality of cables, and one end of the pipe. ### Claim 39 (depends on 38) The endoscope according to claim 38, wherein the second encapsulant includes a secondary optical structure corresponding to the light-emitting element. ### Claim 40 (depends on 38) The endoscope according to claim 38, wherein the tube includes a working channel; one end of the working channel is joined with the pipe of the image sensor package.