# US 12,004,428 B2 · Oscillator frequency modulation method and oscillator piezoelectric structure

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- Number: US 12,004,428 B2
- Document ID: US12004428B2
- Status: Granted
- Kind: B2
- Application number: 17/693,459
- Filed: 2022-03-14
- Published: 2023-05-04
- Granted: 2024-06-04
- Earliest claimed: 2021-10-28
- Assignees: National Central University
- Applicants: National Central University
- Inventors: Jeng-Rong Ho; Chih-Kuang Lin; Pi-Cheng Tung
- Web page: https://patentgrep.com/patent/US12004428B2

## CPC

- H10N 30/082: by etching, e.g. lithography
- H03B 5/32: being a piezoelectric resonator (selection of piezoelectric material H10N30/00)
- H10N 30/088: by cutting or dicing
- H10N 30/09: Forming piezoelectric or electrostrictive materials
- H10N 30/20: with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N 30/2047: {Membrane type}
- H10N 30/85: Piezoelectric or electrostrictive active materials
- H10N 30/853: Ceramic compositions
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H03B: GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS (generators adapted for electrophonic musical instruments G10H; masers or lasers H01S; generation of oscillations in plasma H05H)

## Abstract

An oscillator frequency modulation method includes: providing a piezoelectric material having a surface and an interior; and performing a pattern process on the piezoelectric material by a laser. A patterned processing zone is formed on the surface and/or in the interior of the piezoelectric material. The pattern process may be a material removal and/or a material modification. Therefore, without changing the appearance of the piezoelectric material, the pattern process on the piezoelectric material through the laser can accurately adjust the frequency of the oscillator and block unnecessary mode at the same time. An oscillator piezoelectric structure with frequency modulation is also provided.

## Claims

### Claim 1

An oscillator frequency modulation method, comprising:
providing a piezoelectric material, wherein the piezoelectric material has at least one surface and an interior; and
performing a pattern process on the piezoelectric material by a laser to form a plurality of patterned processing zones on the at least one surface and in the interior of the piezoelectric material, wherein the pattern process comprises a material removal and a material modification, wherein the material modification is to change the material lattice structure of the piezoelectric material to change the material properties of the piezoelectric material, and a resonance frequency of oscillation is modulated by the shape and size of the patterned processing zones.

### Claim 2 (depends on 1)

The oscillator frequency modulation method according to claim 1, wherein the patterned processing zones consist of blind holes, through holes, recesses, grooves, or a combination thereof.

### Claim 3 (depends on 1)

The oscillator frequency modulation method according to claim 1, wherein the patterned processing zones are arranged in a peripheral area of the at least one surface and the interior of the piezoelectric material.

### Claim 4 (depends on 1)

The oscillator frequency modulation method according to claim 1, wherein the patterned processing zones are distributed evenly or in a matrix on the at least one surface and in the interior of the piezoelectric material.

### Claim 5 (depends on 1)

The oscillator frequency modulation method according to claim 1, wherein the piezoelectric material comprises quartz, ceramic, or polyvinylidene fluoride.