# US 12,004,333 B2 · Power converter

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- Number: US 12,004,333 B2
- Document ID: US12004333B2
- Status: Granted
- Kind: B2
- Application number: 17/684,469
- Filed: 2022-03-02
- Published: 2022-09-22
- Granted: 2024-06-04
- Earliest claimed: 2021-03-16
- Assignees: Denso Corporation; Toyota Jidosha Kabushiki Kaisha; MIRISE Technologies Corporation
- Applicants: Denso Corporation; Toyota Jidosha Kabushiki Kaisha; MIRISE Technologies Corporation
- Inventors: Shohei Nagai
- Web page: https://patentgrep.com/patent/US12004333B2

## CPC

- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H05K 7/20927: {Liquid coolant without phase change}
- H02M 7/537: using semiconductor devices only, e.g. single switched pulse inverters
- H02M 7/5387: in a bridge configuration
- H05K 7/20918: {the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels}
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/611: {Bolts or screws}
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A power converter includes: a semiconductor module that includes a semiconductor element for power conversion, the semiconductor module having a module surface on which an input terminal electrically connected to the semiconductor element is disposed; a capacitor in which a capacitor terminal is disposed, the capacitor having a capacitor surface facing the module surface; a cooler that is disposed between the semiconductor module and the capacitor; and a connecting member that electrically connects the input terminal and the capacitor terminal.

## Claims

### Claim 1

A power converter, comprising:
a semiconductor module that includes a semiconductor element for power conversion, the semiconductor module having a module surface on which an input terminal electrically connected to the semiconductor element is disposed;
a capacitor in which a capacitor terminal is disposed, the capacitor having a capacitor surface facing the module surface;
a cooler that is disposed between the semiconductor module and the capacitor; and a connecting member that electrically connects the input terminal and the capacitor terminal, wherein
the cooler includes a groove that passes through the cooler from one side facing the semiconductor module to an other side facing the capacitor,
the groove overlaps the input terminal when viewed in a stacking direction of the semiconductor module, the cooler, and the capacitor,
the groove is filled with an insulation member,
the input terminal includes a positive input terminal and a negative input terminal,
the capacitor terminal includes a positive capacitor terminal and a negative capacitor terminal,
the connecting member includes a positive connecting member that electrically connects the positive input terminal and the positive capacitor terminal and a negative connecting member that electrically connects the negative input terminal and the negative capacitor terminal,
the insulation member has a first surface facing the semiconductor module, a second surface facing the capacitor, and a side surface connecting the first surface and the second surface, and
one of the positive connecting member and the negative connecting member is disposed to extend along the first surface, the side surface, and the second surface of the insulation member.

### Claim 2 (depends on 1)

The power converter according to claim 1, wherein
the semiconductor element is positioned around a center area of the semiconductor module when viewed in the stacking direction, and
the groove is disposed outside of the semiconductor element.

### Claim 3 (depends on 1)

The power converter according to claim 1, wherein
the semiconductor module and the capacitor are fixed to the cooler.

### Claim 4 (depends on 1)

The power converter according to claim 1, wherein
the positive connecting member and the negative connecting member overlap each other.

### Claim 5 (depends on 1)

The power converter according to claim 1, wherein
the semiconductor element includes six switching elements that form a three-phase AC inverter,
the three-phase AC inverter includes an output terminal that is disposed on the module surface, and
an output member electrically connected to the output terminal is disposed in the cooler.

### Claim 6 (depends on 1)

The power converter according to claim 1, wherein
a portion of the one of the positive connecting member and the negative connecting member is interposed between the semiconductor module and the first surface of the insulation member to be electrically connected to the input terminal.