# US 12,004,332 B2 · Cooling automotive power electronics > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,004,332 B2 - Document ID: US12004332B2 - Status: Granted - Kind: B2 - Application number: 17/573,445 - Filed: 2022-01-11 - Published: 2022-07-14 - Granted: 2024-06-04 - Earliest claimed: 2021-01-14 - Assignees: Alliance for Sustainable Energy, LLC; BorgWarner Inc. - Applicants: Alliance for Sustainable Energy, LLC; BorgWarner, Inc. - Inventors: Gilberto Moreno; Sreekant Venkat Jagannath Narumanchi; Xuhui Feng; Ammar Osman; Steve Michael Myers; Brian James Kelly; Paul Philip Paret - Web page: https://patentgrep.com/patent/US12004332B2 ## CPC - H05K 7/20927: {Liquid coolant without phase change} - H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - B60K 11/02: with liquid cooling - H01G 2/08: Cooling arrangements; Heating arrangements; Ventilating arrangements - H10W 40/47: by flowing liquids, e.g. forced water cooling - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B60K: ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module. ## Claims ### Claim 1 A system for cooling a power electronics module using a fluid, the system comprising: a housing comprising a thickness and configured to contain the power electronics module; a molding comprising at least one slot and configured to extend through the thickness, creating a first seal with the thickness, and contact at least a portion of the power electronics module; an electrical connection extending through the slot and comprising a planar surface which extends through the molding and a cylindrical extension which extends through the thickness, creating a second seal with the thickness; and a manifold positioned within the housing; wherein: the power electronics module comprises a first side and a second side, the electrical connection is configured to contact at least a portion of the power electronics module, the manifold is configured to direct the fluid to contact the first side and the second side, the first seal comprises interlocking grooves of the molding and the thickness, the second seal comprises interlocking grooves of the cylindrical extension and the thickness, and the fluid is configured to contact the power electronics module and the electrical connection inside the housing. ### Claim 2 (depends on 1) The system of claim 1, further comprising: a first port configured to extend through the thickness; and a second port configured to extend through the thickness; wherein: the fluid is configured to enter the housing through the first port, and the fluid is configured to exit the housing through the second port. ### Claim 3 (depends on 1) The system of claim 1, wherein the fluid comprises a dielectric fluid. ### Claim 4 (depends on 3) The system of claim 3, wherein the dielectric fluid comprises a synthetic hydrocarbon. ### Claim 5 (depends on 1) The system of claim 1, wherein the molding is configured to contact the first side and the second side of the power electronics module. ### Claim 6 (depends on 1) The system of claim 1, wherein: the manifold comprises a first channel and a second channel, the first channel is configured to direct the fluid to the first side of the power electronics module, and the second channel is configured to direct the fluid to the second side of the power electronics module. ### Claim 7 A method for cooling a power electronics module using a fluid, the method comprising: positioning the power electronics module within a housing comprising a thickness; directing, using a manifold positioned within the housing, the fluid to contact a first side and a second side of the power electronics module; and extending an electrical connection to contact at least a portion of the power electronics module; wherein: the positioning comprises extending a molding comprising at least one slot through the thickness, creating a first seal with the thickness, to contact at least a portion of the power electronics module, the extending comprises extending a planar surface of an electrical connection through the molding to contact at least a portion of the power electronics module and extending a cylindrical connection of the electrical connection through the thickness, creating a second seal with the thickness, to contact at least a portion of the power electronics module, the first seal comprises interlocking grooves of the molding and the thickness, and the second seal comprises interlocking grooves of the cylindrical extension and the thickness. ### Claim 8 (depends on 7) The method of claim 7, wherein: the directing comprises: allowing the fluid to enter the housing through a first port, contacting the power electronics module with the fluid, and allowing the fluid to exit the housing through a second port.