# US 12,004,331 B2 · Low inductance power module with vertical power loop structure and insulated baseplates

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- Number: US 12,004,331 B2
- Document ID: US12004331B2
- Status: Granted
- Kind: B2
- Application number: 18/364,538
- Filed: 2023-08-03
- Published: 2024-01-25
- Granted: 2024-06-04
- Earliest claimed: 2019-09-26
- Assignees: Ohio State Innovation Foundation
- Applicants: Ohio State Innovation Foundation
- Inventors: Xintong Lyu; Jin Wang
- Web page: https://patentgrep.com/patent/US12004331B2

## CPC

- H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)}
- H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H05K 7/20472: {Sheet interfaces}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10166: Transistor
- H05K 2203/049: Wire bonding
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A low inductance power module with low power loop inductance and high-power density is provided. The power module may include a vertical power loop structure, a cooling layer, and a thermal dissipation structure. The vertical power loop structure may utilize a substrate bottom conduction layer for electrical conduction. The thermal dissipation structure may be disposed between the substrate bottom conduction layer and the cooling layer. The vertical power loop structure may include integrated decoupling capacitors. Alternatively, the structure may include no integrated decoupling capacitors. The vertical power loop structure may include one or more half-bridge structures connected in parallel, each with its own integrated decoupling capacitors. The vertical power loop structure reduces power loop inductance in the power module, and the thermal dissipation structure provides electrical insulation, mechanical support, and thermal conduction.

## Claims

### Claim 1

A power module assembly, comprising:
an upper cover;
a gate drive board that receives a controller input;
an assembly fixture;
a vertical power loop structure; and
a housing;
wherein the controller input to the gate drive board drives the vertical power loop structure, and
wherein the gate drive board and the vertical power loop structure are contained in the housing by the assembly fixture and the upper cover.

### Claim 2 (depends on 1)

The power module assembly of claim 1, wherein the vertical power loop structure includes a substrate and power stage, a thermal interface material layer, and baseplate.

### Claim 3 (depends on 2)

The power module assembly of claim 2, wherein the vertical power loop structure is formed within the substrate that comprises a substrate bottom negative DC conduction layer for electrical conduction, a substrate top negative DC conduction layer, and vias that provide an electrical interconnection between the substrate bottom negative DC conduction layer and the substrate top negative DC conduction layer.

### Claim 4 (depends on 1)

The power module assembly of claim 1, wherein the housing is configured to receive the vertical power loop structure and provide thermal dissipation.

### Claim 5 (depends on 4)

The power module assembly of claim 4, wherein the housing is made a plastic material.

### Claim 6 (depends on 4)

The power module assembly of claim 4, wherein the housing is formed using a 3D printing process.

### Claim 7 (depends on 4)

The power module assembly of claim 4, wherein the housing includes a plurality of channels or holes through which a baseplate of the vertical power loop structure is cooled when the baseplate is inserted into the housing.

### Claim 8 (depends on 1)

The power module assembly of claim 1, wherein the vertical power loop structure is a half-bridge structure with integrated decoupling capacitors.

### Claim 9 (depends on 1)

The power module assembly of claim 1, wherein the vertical power loop structure is a half-bridge structure without integrated decoupling capacitors.

### Claim 10 (depends on 1)

The power module assembly of claim 1, wherein the vertical power loop structure comprises a plurality of half-bridge structures each with one or more integrated decoupling capacitors.

### Claim 11 (depends on 1)

The power module assembly of claim 1, wherein the vertical power loop structure comprises a plurality of half-bridge structures each without an integrated decoupling capacitor.