# US 12,004,323 B2 · Devices of drawing out surface heat of electronic components

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- Number: US 12,004,323 B2
- Document ID: US12004323B2
- Status: Granted
- Kind: B2
- Application number: 17/842,396
- Filed: 2022-06-16
- Published: 2023-09-14
- Granted: 2024-06-04
- Earliest claimed: 2022-03-14
- Applicants: Kuan Hung Chen
- Inventors: Kuan Hung Chen
- Web page: https://patentgrep.com/patent/US12004323B2

## CPC

- H05K 7/20254: {Cold plates transferring heat from heat source to coolant}
- H05K 7/20263: {Heat dissipaters releasing heat from coolant}
- H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds}
- H05K 7/20772: {within server blades for removing heat from heat source}
- H10W 40/28: comprising Peltier coolers
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A device of drawing out surface heat of an electronic component includes a housing, a liquid inlet port, a liquid outlet port, a partition wall and flow guiding walls. The housing includes opposite a contact wall and a heat dissipating wall, and a side wall respectively connected to the contact wall and the heat dissipating wall. The liquid inlet port and the liquid outlet port are formed on the side wall. The partition wall is formed in the housing, and connected to inner surfaces of the contact wall, the heat dissipating wall and the side wall, to divide an interior of the housing into an inflow channel and an outflow channel. The flow guiding walls are respectively formed in the inflow channel and the out flow channel, and connected to the inner surface of the contact wall.

## Claims

### Claim 1

A device of drawing out surface heat of an electronic component, comprising:
a housing, comprising opposite a contact wall and a heat dissipating wall, and a side wall respectively connected to the contact wall and the heat dissipating wall, wherein the contact wall can be disposed on a hot surface of an electronic component, and the heat dissipating wall has fins formed thereon;
a liquid inlet port and a liquid outlet port, formed on the side wall;
a partition wall, formed in the housing, and connected to inner surfaces of the contact wall, the heat dissipating wall and the side wall, to divide interior of the housing into an inflow channel and an outflow channel, wherein the inflow channel communicates with the liquid inlet port, the outflow channel communicates with the liquid outlet port, and a side of the partition wall away from the liquid inlet port has passages communicating with the inflow channel and the outflow channel; and
flow guiding walls, respectively formed in the inflow channel and the outflow channel, and connected to the inner surface of the contact wall.

### Claim 2 (depends on 1)

The device of drawing out surface heat of the electronic component according to claim 1, wherein the housing is made of metal.

### Claim 3 (depends on 1)

The device of drawing out surface heat of the electronic component according to claim 1, wherein the fins are spaced apart from each other.

### Claim 4 (depends on 1)

The device of drawing out surface heat of the electronic component according to claim 1, wherein the liquid inlet port and the liquid outlet port are formed on the same side of the side wall.

### Claim 5 (depends on 1)

The device of drawing out surface heat of the electronic component according to claim 1, wherein a number of the partition wall is plural, the partition walls further divide the interior of the housing into an intermediate flow channel located between the inflow channel and the outflow channel.

### Claim 6 (depends on 5)

The device of drawing out surface heat of the electronic component according to claim 5, wherein the flow guiding walls are further formed in the intermediate flow channel.

### Claim 7 (depends on 1)

The device of drawing out surface heat of the electronic component according to claim 1, wherein the flow guiding walls have protruding strips formed thereon.

### Claim 8 (depends on 7)

The device of drawing out surface heat of the electronic component according to claim 7, wherein the partition wall has the protruding strips formed thereon.

### Claim 9 (depends on 8)

The device of drawing out surface heat of the electronic component according to claim 8, wherein the protruding strips are inclined towards the heat dissipating wall or the contact wall.

### Claim 10 (depends on 1)

The device of drawing out surface heat of the electronic component according to claim 1, further comprising a heat dissipating pad or a heat dissipating paste, sandwiched between the contact wall and the hot surface.