# US 12,004,321 B2 · Rack-mountable immersion cooling system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,004,321 B2 - Document ID: US12004321B2 - Status: Granted - Kind: B2 - Application number: 17/596,624 - Filed: 2020-06-09 - Published: 2022-08-04 - Granted: 2024-06-04 - Earliest claimed: 2019-06-18 - Assignees: 3M Innovative Properties Company - Applicants: 3M Innovative Properties Company - Inventors: Sung Won Moon - Web page: https://patentgrep.com/patent/US12004321B2 ## CPC - H05K 7/20236: {by immersion} - G06F 1/183: Internal mounting support structures, e.g. for supporting printed circuit boards - G06F 1/20: Cooling means - H05K 7/1487: {Blade assemblies, e.g. blade cases or inner arrangements within a blade} - H05K 7/1489: {characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K7/1491 takes precedence)} - H05K 7/20263: {Heat dissipaters releasing heat from coolant} - H05K 7/20781: {within cabinets for removing heat from server blades} - G06F 2200/201: Cooling arrangements using cooling fluid - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract An immersion cooling system includes a plurality of spaced-apart cooling plates defining a plurality of subvolumes therebetween, the cooling plates at least partially immersed in a first liquid coolant, so that the first liquid coolant at least partially fills each subvolume; a second liquid coolant flowing through at least a portion of each cooling plate; and at least one electronic device at least partially immersed in the first liquid coolant within each subvolume. ## Claims ### Claim 1 An immersion cooling system, comprising: a plurality of spaced-apart cooling plates defining a plurality of subvolumes therebetween, the cooling plates at least partially immersed in a first liquid coolant, so that the first liquid coolant at least partially fills each subvolume; a second liquid coolant flowing through at least a portion of each cooling plate; and at least one electronic device at least partially immersed in the first liquid coolant within each subvolume; wherein the immersion cooling system is configured to be mounted on slides in a standard server rack. ### Claim 2 (depends on 1) The immersion cooling system of claim 1, wherein the first liquid coolant is a dielectric fluid. ### Claim 3 (depends on 1) The immersion cooling system of claim 1, wherein the second liquid coolant is selected from the group consisting of water, ethylene glycol and water solution, diethylene glycol and water solution, and propylene glycol and water solution. ### Claim 4 (depends on 1) The immersion cooling system of claim 1, wherein at least one subvolume of the plurality of subvolumes is in fluidic communication with at least one other subvolume of the plurality of subvolumes. ### Claim 5 (depends on 1) The immersion cooling system of claim 1, wherein the at least one electronic device is an electronic server. ### Claim 6 (depends on 5) The immersion cooling system of claim 5, further comprising a heat exchanger in fluidic communication with the cooling plate. ### Claim 7 (depends on 5) The immersion cooling system of claim 5, wherein the first liquid coolant is a dielectric fluid. ### Claim 8 (depends on 5) The immersion cooling system of claim 5, wherein the second liquid coolant is selected from the group consisting of water, ethylene glycol and water solution, diethylene glycol and water solution, and propylene glycol and water solution. ### Claim 9 (depends on 5) The immersion cooling system of claim 5, wherein the at least one wall of the open interior volume is a wall dividing the open interior volume into subvolumes. ### Claim 10 An immersion cooling system, comprising: a tank defining an open interior volume and comprising a cooling plate forming at least one wall of the open interior volume; a first liquid coolant at least partially filling the open interior volume; a second liquid coolant flowing through at least a portion of the cooling plate; and at least one electronic device at least partially immersed in the first liquid coolant within the open interior volume; wherein the immersion cooling system is configured to be mounted on slides in a standard server rack. ### Claim 11 (depends on 10) The immersion cooling system of claim 10, wherein the at least one electronic device is an electronic server. ### Claim 12 A method of cooling electronic devices, comprising: disposing a plurality of cooling plates so as to define a plurality of subvolumes; at least partially filling each subvolume with a first coolant liquid, such that each of the plurality of cooling plates is at least partially immersed in the first coolant liquid; providing a second coolant fluid disposed within the cooling plate; disposing at least one electronic device in at least one subvolume such that it is at least partially immersed in the first coolant fluid; and mounting the plurality of cooling plates including the plurality of subvolumes and electronic devices on slides in a standard server rack. ### Claim 13 (depends on 12) The method of claim 12, further comprising: creating a fluidic circuit comprising a heat exchanger and the plurality of cooling plates; and circulating the second coolant fluid through the fluidic circuit. ### Claim 14 (depends on 12) The method of claim 12, wherein the first liquid coolant is a dielectric fluid. ### Claim 15 (depends on 12) The method of claim 12, wherein the second liquid coolant is selected from the group consisting of water, ethylene glycol and water solution, diethylene glycol and water solution, and propylene glycol and water solution. ### Claim 16 (depends on 12) The method of claim 12, wherein the at least one electronic device is an electronic server.