# US 12,004,308 B2 · Process for laminating graphene-coated printed circuit boards

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- Number: US 12,004,308 B2
- Document ID: US12004308B2
- Status: Granted
- Kind: B2
- Application number: 17/305,205
- Filed: 2021-07-01
- Published: 2022-11-24
- Granted: 2024-06-04
- Earliest claimed: 2021-05-18
- Assignees: Mellanox Technologies, Ltd.; Bar-Ilan University; Pcb Technologies Ltd.
- Applicants: Mellanox Technologies, Ltd.; Bar-Ilan University; PCB Technologies Ltd
- Inventors: Boaz Atias; Elad Mentovich; Yaniv Rotem; Doron Naveh; Adi Levi; Yosi Ben-Naim; Yaad Eliya; Shlomo Danino; Eran Lipp
- Web page: https://patentgrep.com/patent/US12004308B2

## CPC

- H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
- H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)}
- C01B 32/184: Preparation
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 3/388: {by the use of a metallic or inorganic thin film adhesion layer}
- H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H05K 2201/0323: Carbon
- H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
- H05K 2203/085: Using vacuum or low pressure
- H05K 2203/1338: Chemical vapour deposition
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C01B: NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C}

## Abstract

Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.

## Claims

### Claim 1

A lamination stack comprising:
a core;
a first adhesive layer applied to a top surface of the core;
a first graphene-metal structure attached to the top surface of the core via the first adhesive layer, wherein the first graphene-metal structure comprises a first metal layer and a first graphene layer on at least one of a top surface of the first metal layer or a bottom surface of the first metal layer;
a second graphene-metal structure attached to a top surface of the first graphene-metal structure, wherein the second graphene-metal structure comprises a second metal layer and a second graphene layer on at least one of a top surface of the second metal layer or a bottom surface of the second metal layer; and
a second adhesive layer applied to a bottom surface of the core.

### Claim 2 (depends on 1)

The lamination stack of claim 1, further comprising a third graphene-metal structure attached to the bottom surface of the core via the second adhesive layer, wherein the third graphene-metal structure comprises a third metal layer and a third graphene layer on at least one of a top surface of the third metal layer or a bottom surface of the third metal layer.

### Claim 3 (depends on 2)

The lamination stack of claim 2, further comprising a fourth graphene-metal structure attached to a bottom surface of the third graphene-metal structure, wherein the fourth graphene-metal structure comprises a fourth metal layer and a fourth graphene layer on at least one of a top surface of the fourth metal layer or a bottom surface of the fourth metal layer.

### Claim 4 (depends on 1)

The lamination stack of claim 1, further comprising one or more holes, wherein each hole is defined by the metal layer of the first graphene-metal structure, the second metal layer of the second graphene-metal structure, and intervening layers.

### Claim 5 (depends on 4)

The lamination stack of claim 4, wherein the one or more holes are filled with conductive material.

### Claim 6 (depends on 1)

The lamination stack of claim 1, wherein the first graphene-metal structure comprises a first graphene layer on the top surface of the first metal layer and a first graphene layer on the bottom surface of the first metal layer.

### Claim 7 (depends on 6)

The lamination stack of claim 6, wherein the second graphene-metal structure comprises a second metal layer, a second graphene layer on a top surface of the second metal layer, and a second graphene layer on a bottom surface of the second metal layer.

### Claim 8 (depends on 1)

The lamination stack of claim 1, further comprising a third graphene-metal structure attached to the bottom surface of the core via the second adhesive layer, wherein the third graphene-metal structure comprises a third metal layer, a third graphene layer on a top surface of the third metal layer, and a third graphene layer on a bottom surface of the third metal layer.

### Claim 9 (depends on 8)

The lamination stack of claim 8, further comprising a fourth graphene-metal structure attached to a bottom surface of the third graphene-metal structure, wherein the fourth graphene-metal structure comprises a fourth metal layer, a fourth graphene layer on a top surface of the fourth metal layer, and a fourth graphene layer on a bottom surface of the fourth metal layer.

### Claim 10 (depends on 9)

The lamination stack of claim 9, wherein an interface between adjacent graphene layers is a frictionless interface, wherein each frictionless interface is configured to facilitate removal of the lamination stack from at least one pressure pad applied to the lamination stack.

### Claim 11 (depends on 1)

The lamination stack of claim 1, wherein an outermost side of the second graphene-metal structure opposite the first graphene-metal structure is configured to receive a frictionless substrate, wherein the frictionless substrate is configured to facilitate removal of the lamination stack from at least one pressure pad applied to the lamination stack.

### Claim 12 (depends on 1)

The lamination stack of claim 1, wherein at least one of the first graphene layer or the second graphene layer is a monolayer.

### Claim 13

A lamination stack comprising:
a core;
a first adhesive layer applied to a top surface of the core;
a first graphene-metal structure attached to the top surface of the core via the first adhesive layer, wherein the first graphene-metal structure comprises a first metal layer and a first graphene layer on at least one of a top surface of the first metal layer or a bottom surface of the first metal layer; and
a second graphene-metal structure attached to a top surface of the first graphene-metal structure, wherein the second graphene-metal structure comprises a second metal layer and a second graphene layer on at least one of a top surface of the second metal layer or a bottom surface of the second metal layer,
wherein the lamination stack comprises one or more holes, wherein each hole is defined by the first metal layer of the first graphene-metal structure, the second metal layer of the second graphene-metal structure, and intervening layers.

### Claim 14 (depends on 13)

The lamination stack of claim 13, further comprising a second adhesive layer applied to a bottom surface of the core.

### Claim 15 (depends on 14)

The lamination stack of claim 14, further comprising a third graphene-metal structure attached to the bottom surface of the core via the second adhesive layer, wherein the third graphene-metal structure comprises a third metal layer and a third graphene layer on at least one of a top surface of the third metal layer or a bottom surface of the third metal layer.

### Claim 16 (depends on 15)

The lamination stack of claim 15, further comprising a fourth graphene-metal structure attached to a bottom surface of the third graphene-metal structure, wherein the fourth graphene-metal structure comprises a fourth metal layer and a fourth graphene layer on at least one of a top surface of the fourth metal layer or a bottom surface of the fourth metal layer.

### Claim 17 (depends on 13)

The lamination stack of claim 13, wherein the one or more holes are filled with conductive material.

### Claim 18 (depends on 13)

The lamination stack of claim 13, wherein the first graphene-metal structure comprises a first graphene layer on the top surface of the first metal layer and a first graphene layer on the bottom surface of the first metal layer.

### Claim 19 (depends on 18)

The lamination stack of claim 18, wherein the second graphene-metal structure comprises a second metal layer, a second graphene layer on a top surface of the second metal layer, and a second graphene layer on a bottom surface of the second metal layer.

### Claim 20 (depends on 19)

The lamination stack of claim 19, further comprising a second adhesive layer applied to a bottom surface of the core and a third graphene-metal structure attached to the bottom surface of the core via the second adhesive layer, wherein the third graphene-metal structure comprises a third metal layer, a third graphene layer on a top surface of the third metal layer, and a third graphene layer on a bottom surface of the third metal layer.

### Claim 21 (depends on 20)

The lamination stack of claim 20, further comprising a fourth graphene-metal structure attached to a bottom surface of the third graphene-metal structure, wherein the fourth graphene-metal structure comprises a fourth metal layer, a fourth graphene layer on a top surface of the fourth metal layer, and a fourth graphene layer on a bottom surface of the fourth metal layer.

### Claim 22 (depends on 21)

The lamination stack of claim 21, wherein an interface between adjacent graphene layers is a frictionless interface, wherein each frictionless interface is configured to facilitate removal of the lamination stack from at least one pressure pad applied to the lamination stack.

### Claim 23 (depends on 13)

The lamination stack of claim 13, wherein an outermost side of the second graphene-metal structure opposite the first graphene-metal structure is configured to receive a frictionless substrate, wherein the frictionless substrate is configured to facilitate removal of the lamination stack from at least one pressure pad applied to the lamination stack.

### Claim 24 (depends on 13)

The lamination stack of claim 13, wherein at least one of the first graphene layer or the second graphene layer is a monolayer.

### Claim 25

A lamination stack comprising:
a core;
a first adhesive layer applied to a top surface of the core;
a first graphene-metal structure attached to the top surface of the core via the first adhesive layer, wherein the first graphene-metal structure comprises a first metal layer, a first graphene layer on a top surface of the first metal layer, and a first graphene layer on a bottom surface of the first metal layer;
a second graphene-metal structure attached to a top surface of the first graphene-metal structure, wherein the second graphene-metal structure comprises a second metal layer, a second graphene layer on a top surface of the second metal layer, and a second graphene layer on a bottom surface of the second metal layer; and
a second adhesive layer applied to a bottom surface of the core.

### Claim 26 (depends on 25)

The lamination stack of claim 25, further comprising a third graphene-metal structure attached to the bottom surface of the core via the second adhesive layer, wherein the third graphene-metal structure comprises a third metal layer and a third graphene layer on at least one of a top surface of the third metal layer or a bottom surface of the third metal layer.

### Claim 27 (depends on 26)

The lamination stack of claim 26, further comprising a fourth graphene-metal structure attached to a bottom surface of the third graphene-metal structure, wherein the fourth graphene-metal structure comprises a fourth metal layer and a fourth graphene layer on at least one of a top surface of the fourth metal layer or a bottom surface of the fourth metal layer.

### Claim 28 (depends on 25)

The lamination stack of claim 25, further comprising one or more holes, wherein each hole is defined by the first metal layer of the first graphene-metal structure, the second metal layer of the second graphene-metal structure, and intervening layers.

### Claim 29 (depends on 28)

The lamination stack of claim 28, wherein the one or more holes are filled with conductive material.

### Claim 30 (depends on 25)

The lamination stack of claim 25, further comprising a third graphene-metal structure attached to the bottom surface of the core via the second adhesive layer, wherein the third graphene-metal structure comprises a third metal layer, a third graphene layer on a top surface of the third metal layer, and a third graphene layer on a bottom surface of the third metal layer.

### Claim 31 (depends on 30)

The lamination stack of claim 30, further comprising a fourth graphene-metal structure attached to a bottom surface of the third graphene-metal structure, wherein the fourth graphene-metal structure comprises a fourth metal layer, a fourth graphene layer on a top surface of the fourth metal layer, and a fourth graphene layer on a bottom surface of the fourth metal layer.

### Claim 32 (depends on 31)

The lamination stack of claim 31, wherein an interface between adjacent graphene layers is a frictionless interface, wherein each frictionless interface is configured to facilitate removal of the lamination stack from at least one pressure pad applied to the lamination stack.

### Claim 33 (depends on 25)

The lamination stack of claim 25, wherein an outermost side of the second graphene-metal structure opposite the first graphene-metal structure is configured to receive a frictionless substrate, wherein the frictionless substrate is configured to facilitate removal of the lamination stack from at least one pressure pad applied to the lamination stack.

### Claim 34 (depends on 25)

The lamination stack of claim 25, wherein at least one of the first graphene layer or the second graphene layer is a monolayer.