# US 12,004,306 B1 · Method of printed circuit board dielectric molding and electrolytic metallization > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,004,306 B1 - Document ID: US12004306B1 - Status: Granted - Kind: B1 - Application number: 18/127,475 - Filed: 2023-03-28 - Granted: 2024-06-04 - Earliest claimed: 2023-03-28 - Assignees: Infinitum Electric Inc. - Applicants: Infinitum Electric, Inc. - Inventors: Edward C. Carignan; Paulo Guedes-Pinto - Web page: https://patentgrep.com/patent/US12004306B1 ## CPC - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - H05K 3/188: {by direct electroplating} - C25D 5/02: Electroplating of selected surface areas - C25D 5/54: Electroplating of non-metallic surfaces (C25D7/12 takes precedence) - C25D 5/56: of plastics - C25D 7/00: Electroplating characterised by the article coated - H02K 3/26: consisting of printed conductors - H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)} - H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)} - H05K 3/107: {by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence)} - H05K 1/165: {incorporating printed inductors} - H05K 3/4623: {the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence)} - H05K 2201/0376: Flush conductors, i.e. flush with the surface of the printed circuit - H05K 2201/09118: Moulded substrate - H05K 2203/0723: Electroplating, e.g. finish plating - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53}) ## Abstract A method of manufacturing a printed circuit board (PCB) includes forming a tridimensional (3D) dielectric substrate on a fiber-reinforced polymer with opposite sides; forming each side with channels and pockets by molding dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB; forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth; forming side walls of the channels and pockets of the 3D dielectric substrate with a draft angle in a range of greater than 0 degrees to about 5 degrees; depositing by electrolytic metallization the conductive traces and pads into the channels and pockets of the 3D dielectric substrate; and the outer surface of those conductive traces and pads are flush with the sides of the 3D dielectric substrate. ## Claims ### Claim 1 A method of manufacturing a printed circuit board (PCB), the method comprising: forming a tridimensional (3D) dielectric substrate comprising fiber-reinforced polymer that is mechanically rigid and has opposite sides; forming each side with channels and pockets by molding the 3D dielectric substrate, and the channels and pockets define a layout for conductive traces and pads, respectively, of the PCB; forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth that is equal to or greater than 140 μm; forming side walls of the channels and pockets of the 3D dielectric substrate with a draft angle in a range of greater than 0 degrees to about 5 degrees; depositing by electrolytic metallization a material comprising copper to form the conductive traces and pads in the channels and pockets, respectively, of the 3D dielectric substrate; and making outer surfaces of the conductive traces and pads flush with respective sides of the 3D dielectric substrate. ### Claim 2 (depends on 1) The method of claim 1, wherein the channels and pockets of a first side of the sides comprise a first depth, and the channels and pockets of a second side of the sides comprise a second depth. ### Claim 3 (depends on 2) The method of claim 2, wherein the first and second depths are the same or within 25 μm of each other. ### Claim 4 (depends on 3) The method of claim 3, wherein the sides of the 3D dielectric substrate are formed with a same layout. ### Claim 5 (depends on 3) The method of claim 3, wherein each side of the 3D dielectric substrate is formed with a different layout. ### Claim 6 (depends on 2) The method of claim 2, wherein the first depth differs from the second depth. ### Claim 7 (depends on 6) The method of claim 6, wherein the sides of the 3D dielectric substrate are formed with a same layout. ### Claim 8 (depends on 1) The method of claim 1, wherein each side of the 3D dielectric substrate is formed with a different layout. ### Claim 9 A method of manufacturing a printed circuit board (PCB) stator for an axial field rotary energy device, the method comprising: forming a PCB panel as a tridimensional (3D) dielectric substrate comprising fiber-reinforced polymer with opposite sides; forming each side with channels and pockets by molding the 3D dielectric substrate, and the channels and pockets define a layout for conductive traces and pads, respectively, of the PCB panel; forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth that is equal to or greater than 140 μm; forming side walls of the channels and pockets of the 3D dielectric substrate at a draft angle in a range of greater than 0 degrees to about 5 degrees; depositing by electrolytic metallization and forming the conductive traces and pads into the channels and pockets, respectively, of the 3D dielectric substrate; and making outer surfaces of the conductive traces and pads flush with respective sides of the 3D dielectric substrate. ### Claim 10 (depends on 9) The method of claim 9, wherein the channels and pockets of a first side of the sides of the 3D dielectric substrate are formed at a first depth, and the channels and pockets of a second side of the sides of the 3D dielectric substrate are formed at a second depth. ### Claim 11 (depends on 10) The method of claim 10, wherein the first and second depths are the same or within 25 μm of each other. ### Claim 12 (depends on 10) The method of claim 10, wherein the first depth differs from the second depth.