# US 12,004,301 B2 · Circuit board

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- Number: US 12,004,301 B2
- Document ID: US12004301B2
- Status: Granted
- Kind: B2
- Application number: 17/554,144
- Filed: 2021-12-17
- Published: 2022-06-30
- Granted: 2024-06-04
- Earliest claimed: 2020-12-24
- Assignees: Dongwoo Fine-Chem Co., Ltd.
- Applicants: Dongwoo Fine-Chem Co., Ltd.
- Inventors: Ki Joon Park; Sung Jin Noh; Jungu Lee
- Web page: https://patentgrep.com/patent/US12004301B2

## CPC

- H05K 3/0011: {Working of insulating substrates or insulating layers}
- H05K 3/4605: {made from inorganic insulating material}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 3/14: using spraying techniques to apply the conductive material {, e.g. vapour evaporation}
- H05K 3/282: {for inhibiting the corrosion of the circuit, e.g. for preserving the solderability}
- H05K 3/388: {by the use of a metallic or inorganic thin film adhesion layer}
- H05K 3/465: {by applying an insulating layer having channels for the next circuit layer}
- H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
- H05K 2203/1333: Deposition techniques, e.g. coating
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A circuit board includes a base layer, an electrode layer formed on the base layer, a passivation layer formed on the electrode layer while opening a part of the electrode layer, and a surface treatment layer formed on the open surface of the electrode layer. The surface treatment layer may contain 70 to 40% of copper and 30 to 60% of nickel.

## Claims

### Claim 1

A circuit board, comprising:
a base layer;
an electrode layer formed on the base layer;
a passivation layer formed on the electrode layer while opening a part of surface of the electrode layer; and
a surface treatment layer formed on the open surface of the electrode layer,
wherein
the electrode layer includes a first electrode layer and a second electrode layer;
the circuit board further comprises an insulation layer formed between the first electrode layer and the second electrode layer and a via penetrating the insulation layer to connect the first electrode layer and the second electrode layer;
the passivation layer is formed on the second electrode layer, the insulation layer, and the via while opening a part of the second electrode layer; and
the surface treatment layer is formed on the open surface of the second electrode layer.

### Claim 2 (depends on 1)

The circuit board of claim 1, wherein the base layer is made of glass.

### Claim 3 (depends on 2)

The circuit board of claim 2, further comprising:
a seed layer between the base layer and the electrode layer.

### Claim 4 (depends on 1)

The circuit board of claim 1, wherein the surface treatment layer is made of an alloy of copper and nickel.

### Claim 5 (depends on 4)

The circuit board of claim 4, wherein the surface treatment layer contains 70 to 40% of copper and 30 to 60% of nickel.

### Claim 6 (depends on 1)

The circuit board of claim 1, wherein the open surface of the second electrode layer on which the surface treatment layer is formed acts as an LED landing pad on which an LED is mounted.

### Claim 7 (depends on 2)

The circuit board of claim 2, wherein the surface treatment layer is made of an alloy of copper and nickel.

### Claim 8 (depends on 3)

The circuit board of claim 3, wherein the surface treatment layer is made of an alloy of copper and nickel.