# US 12,004,299 B1 · Interface assembly and method for manufacturing interface assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,004,299 B1 - Document ID: US12004299B1 - Status: Granted - Kind: B1 - Application number: 18/104,479 - Filed: 2023-02-01 - Granted: 2024-06-04 - Earliest claimed: 2023-02-01 - Assignees: Tactotek Oy - Applicants: TactoTek Oy - Inventors: Mikko Heikkinen; Jarmo Sääski; Ilpo Hänninen; Antti Keränen; Tomi Simula; Vinski Bräysy; Pälvi Apilo; Pasi Korhonen; Topi Wuori - Web page: https://patentgrep.com/patent/US12004299B1 ## CPC - H03K 17/965: Switches controlled by moving an element forming part of the switch - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - B29C 51/14: using multilayered preforms or sheets - G01P 1/02: Housings - H03K 17/968: using opto-electronic devices - H03K 17/97: using a magnetic movable element - H03K 17/975: using a capacitive movable element - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - H05K 3/306: with lead-in-hole components (H05K3/32 takes precedence) - B29L 2031/3425: {Printed circuits} - H03K 2217/94036: Multiple detection, i.e. where different switching signals are generated after operation of the user is detected at different time instants at different locations during the actuation movement by two or more sensors of the same or different kinds - H03K 2217/960755: Constructional details of capacitive touch and proximity switches - H05K 2201/10151: Sensor - H05K 2201/10265: Metallic coils or springs, e.g. as part of a connection element - H05K 2203/1327: Moulding over PCB locally or completely - H05K 2203/166: Alignment or registration; Control of registration - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G}) - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement. ## Claims ### Claim 1 An interface assembly, comprising a functional multilayer structure comprising: a first substrate, a molded material layer on a first side of the first substrate, wherein the molded material layer defines a groove, a hole, or a through-hole, and a sensor arrangement comprising at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer; and a movable member being movable relative to the functional multilayer structure and at least partly extending into the groove, the hole, or the through-hole, wherein the movable member comprises at least one detection portion; wherein the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement. ### Claim 2 (depends on 1) The interface assembly of claim 1, wherein the movable member and the functional multilayer structure are attached to each other in a movable manner. ### Claim 3 (depends on 2) The interface assembly of claim 2, wherein the attachment in the movable manner includes a magnetic attachment arrangement comprising a first attachment portion on the functional multilayer structure and a second attachment portion on the movable member, wherein the magnetic attachment arrangement is arranged to exert an attractive magnetic force between the first attachment portion and the second attachment portion. ### Claim 4 (depends on 2) The interface assembly of claim 2, wherein the attachment in the movable manner includes a mechanical attachment arrangement, the mechanical attachment arrangement arranged to prevent or at least hinder detachment of the movable member with respect to the functional multilayer structure. ### Claim 5 (depends on 2) The interface assembly of claim 2, wherein the mechanical attachment arrangement comprises a frame adapted to at least partly confine the movable member between the frame and the functional multilayer structure so that the movable member is movable in a space between the frame and the functional multilayer structure. ### Claim 6 (depends on 1) The interface assembly of claim 1, wherein the at least one detection portion is adapted to extend into, and is movable in, the groove, the hole, or the through-hole. ### Claim 7 (depends on 6) The interface assembly of claim 6, further comprising a shape interlocking arrangement between a portion of the groove, the hole, or the through-hole, and the movable member so as to prevent or at least hinder detachment of the movable member with respect to the functional multilayer structure. ### Claim 8 (depends on 1) The interface assembly of claim 1, wherein the movable member is movable in a translational manner, such as linearly or non-linearly, relative to the functional multilayer structure, optionally in the groove, the hole, or the through-hole. ### Claim 9 (depends on 1) The interface assembly of claim 1, wherein the movable member is movable in a rotational manner relative to the functional multilayer structure, optionally in the groove, the hole, or the through-hole. ### Claim 10 (depends on 1) The interface assembly of claim 1, wherein the functional multilayer structure comprises a protrusion, a pin, or other shape which extends outward from a surface of the multilayer structure, and the movable member is movable relative to the protrusion, the pin, or said other shape. ### Claim 11 (depends on 1) The interface assembly of claim 1, wherein the at least one sensor is at least one optical sensor arranged to transmit an optical detection signal for detecting the position or the change of position of the at least one detection portion. ### Claim 12 (depends on 1) The interface assembly of claim 1, wherein the at least one detection portion comprises one or several magnets and/or ferromagnetic elements, and the sensor arrangement comprises a magnetometer, a coil, or a Hall effect sensor for detecting position or change of position of the one or several magnets. ### Claim 13 (depends on 1) The interface assembly of claim 1, wherein the sensor arrangement comprises a capacitive sensing element for detecting the position or the change of position of the at least one detection portion. ### Claim 14 (depends on 1) The interface assembly of claim 1, wherein the movable member is mechanically coupled to the functional multilayer structure via a spring. ### Claim 15 (depends on 14) The interface assembly of claim 14, wherein a center portion of the spring comprises a through-hole through which the movable member extends towards the functional multilayer structure. ### Claim 16 (depends on 14) The interface assembly of claim 14, wherein the spring has a shape of a segmental dome, wherein, when the spring is not completely compressed, an edge portion or portions of the segmental dome are in contact with one of the functional multilayer structure and the movable member, and a center portion of the segmental dome is spaced apart from the other of the functional multilayer structure and the movable member. ### Claim 17 (depends on 14) The interface assembly of claim 14, wherein the spring is a planar spring. ### Claim 18 (depends on 16) The interface assembly of claim 16, wherein the spring is of plastic material. ### Claim 19 (depends on 1) The interface assembly of claim 1 wherein the movable member is attached and arranged to move in a hinged manner relative to the functional multilayer structure. ### Claim 20 (depends on 1) The interface assembly of claim 1, wherein the sensor arrangement comprises a plurality of sensors including at least two types of sensors for detecting the position or the change of position of the at least one detection portion, the types of sensors being selected from the group consisting of: optical, capacitive, inductive, resistive, magnet, galvanic, audio, or any combination thereof. ### Claim 21 (depends on 1) The interface assembly of claim 1, further comprising a second substrate on the opposite side of the molded material layer relative to the first substrate. ### Claim 22 (depends on 21) The interface assembly of claim 21, wherein the sensor arrangement is provided onto a surface of the first substrate and/or the second substrate. ### Claim 23 (depends on 21) The interface assembly of claim 21, wherein one of the first substrate or the second substrate, or both of the first substrate and the second substrate, are thermoformable substrate films, optionally having a non-planar, three-dimensional shape. ### Claim 24 (depends on 22) The interface assembly of claim 22, wherein one of the first substrate or the second substrate, or both of the first substrate and the second substrate, comprise a non-planar, three-dimensional shape. ### Claim 25 (depends on 9) The interface assembly of claim 9, wherein the movable member is movable in the groove, the hole, or the through-hole.