# US 12,004,298 B2 · Sensor device and methods of making and using the same

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- Number: US 12,004,298 B2
- Document ID: US12004298B2
- Status: Granted
- Kind: B2
- Application number: 17/392,817
- Filed: 2021-08-03
- Published: 2021-11-25
- Granted: 2024-06-04
- Earliest claimed: 2019-11-04
- Assignees: Shinkawa Electric Co., Ltd.
- Applicants: Shinkawa Electric Co., Ltd.
- Inventors: Kotaro Matsumoto; Hiroyuki Matsuda; Hiroshi Aoki; Masaru Terada; Ovel Emerson; Paul A. Lowe
- Web page: https://patentgrep.com/patent/US12004298B2

## CPC

- G01D 11/245: {Housings for sensors}
- H05K 1/181: associated with surface mounted components
- G01D 21/02: Measuring two or more variables by means not covered by a single other subclass
- G01K 1/08: Protective devices, e.g. casings
- G01K 13/00: Thermometers specially adapted for specific purposes
- G01M 13/028: Acoustic or vibration analysis
- G01M 13/045: Acoustic or vibration analysis
- G01M 15/12: by monitoring vibrations
- H05K 5/0073: {having specific features for mounting the housing on an external structure}
- H05K 5/03: Covers
- H05K 2201/09827: Tapered, e.g. tapered hole, via or groove
- H05K 2201/10037: Printed or non-printed battery
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H05K 2201/10151: Sensor
- H05K 2201/10159: Memory
- H05K 2201/10583: Cylindrically shaped component; Fixing means therefore
- G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00)
- G01M: TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR

## Abstract

Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

## Claims

### Claim 1

A machinery condition monitoring device comprising:
an enclosure assembly comprising:
a cap;
a base mechanically coupled with the cap; and
a support bracket mechanically coupled with the base;
and
a printed circuit board (PCB) assembly comprising:
a first rigid section electrically coupled to a second rigid section using a first flexible PCB interconnect;
a third rigid section electrically coupled with the second rigid section using a second flexible PCB interconnect, wherein the second rigid section comprises a battery clamp configured to secure a cylindrical shaped battery using a curved surface of the cylindrical shaped battery;
a processor;
a memory electrically coupled with the processor;
a first sensor electrically coupled with the processor;
a second sensor electrically coupled with the processor; and
a communication interface electrically coupled with the processor; wherein:
the first sensor is a wake-up sensor;
a height of the cylindrical shaped battery is greater than a diameter of the cylindrical shaped battery;
the first rigid section is positioned in a PCB arrangement to be perpendicular to the second rigid section and mechanically coupled with the support bracket using a first plurality of fastening devices,
the third rigid section is positioned in the PCB arrangement to be perpendicular to the second rigid section and mechanically coupled with the support bracket using a second plurality of fastening devices;
the first rigid section is positioned in the PCB arrangement to be parallel to the third rigid section; and
the support bracket and battery clamp are configured for allowing a replacement of the cylindrical shaped battery while maintaining the PCB arrangement.

### Claim 2 (depends on 1)

The machinery condition monitoring device of claim 1, wherein the communication interface is a wireless communication interface and at least a portion of the cap is radio frequency (RF) transparent.

### Claim 3 (depends on 2)

The machinery condition monitoring device of claim 2, wherein the machinery condition monitoring device when installed forms a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

### Claim 4 (depends on 3)

The machinery condition monitoring device of claim 3, wherein the wireless communication interface is a Bluetooth® Low Energy (BLE) interface.

### Claim 5 (depends on 1)

The machinery condition monitoring device of claim 1, wherein the first sensor is a vibration sensor.

### Claim 6 (depends on 5)

The machinery condition monitoring device of claim 5, wherein the vibration sensor is an accelerometer sensor.

### Claim 7 (depends on 1)

The machinery condition monitoring device of claim 1, wherein the second sensor is a temperature sensor.

### Claim 8 (depends on 7)

The machinery condition monitoring device of claim 7, wherein the temperature sensor comprises at least one of a thermocouple or a thermistor.

### Claim 9 (depends on 1)

The machinery condition monitoring device of claim 1, wherein the cylindrical shaped battery is a lithium battery.

### Claim 10 (depends on 1)

The machinery condition monitoring device of claim 1, wherein the processor and the memory are embedded in a microcontroller.

### Claim 11 (depends on 1)

The machinery condition monitoring device of claim 1 further comprising a third sensor, wherein:
the first sensor is a low-sensitivity vibration sensor configured to operate in a sleep state of the machinery condition monitoring device and further configured to trigger the machinery condition monitoring device into an active state;
the second sensor is a temperature sensor; and
the third sensor is a high-sensitivity vibration sensor configured to operate in the active state of the machinery condition monitoring device.

### Claim 12 (depends on 11)

The machinery condition monitoring device of claim 11, wherein:
the third sensor is a triaxial accelerometer sensor having an x-axis, a y-axis, and a z-axis; and
the triaxial accelerometer sensor is positioned such that the z-axis is perpendicular to a mounting surface of the base.

### Claim 13 (depends on 12)

The machinery condition monitoring device of claim 12, wherein:
the base is configured to allow the mounting surface to be attached to a machine surface to allow monitoring of machine vibration and machine temperature;
the base is configured to allow the support bracket to be rotated by a user around a perpendicular axis of the mounting surface; and
the PCB assembly and the triaxial accelerometer sensor are stationary relative to the support bracket.

### Claim 14 (depends on 13)

The machinery condition monitoring device of claim 13, wherein the base comprises a threaded mounting stud positioned perpendicular to the mounting surface.

### Claim 15 (depends on 1)

The machinery condition monitoring device of claim 1, wherein the cylindrical shaped battery is a ½AA battery.

### Claim 16 (depends on 1)

The machinery condition monitoring device of claim 1, wherein:
the first rigid section is positioned between the base and the second rigid section; a
the first sensor and the second sensor are positioned on the first rigid section; and
the first sensor is configured to operate in a sleep state of the machinery condition monitoring device and further configured to trigger the machinery condition monitoring device into an active state.

### Claim 17 (depends on 1)

The machinery condition monitoring device of claim 1, wherein:
the base includes a first set of threads in the shape of a helix positioned around a circumference of the base; and
the cap is configured to be secured to the base using the first set of threads.

### Claim 18 (depends on 17)

The machinery condition monitoring device of claim 17, wherein the cap forms a shape of a tapered cylinder.

### Claim 19

A method of manufacturing a machinery condition monitoring device, the method comprising:
mechanically assembling a printed circuit board (PCB) assembly comprising:
a first rigid section electrically coupled to a second rigid section using a first flexible PCB interconnect;
a third rigid section electrically coupled with the second rigid section using a second flexible PCB interconnect, wherein the second rigid section comprises a battery clamp configured to secure a cylindrical shaped battery using a curved surface of the cylindrical shaped battery;
a processor;
a memory electrically coupled with the processor;
a first sensor electrically coupled with the processor;
a second sensor electrically coupled with the processor; and
a communication interface electrically coupled with the processor;
and
mechanically assembling the PCB assembly within an enclosure comprising;
a cap;
a base mechanically coupled with the cap; and
a support bracket mechanically coupled with the base; wherein:
the first sensor is a wake-up sensor;
a height of the cylindrical shaped battery is greater than a diameter of the cylindrical shaped battery;
the first rigid section is positioned in a PCB arrangement to be perpendicular to the second rigid section and mechanically coupled with the support bracket using a first plurality of fastening devices,
the third rigid section is positioned in the PCB arrangement to be perpendicular to the second rigid section and mechanically coupled with the support bracket using a second plurality of fastening devices;
the first rigid section is positioned in the PCB arrangement to be parallel to the third rigid section; and
the support bracket and battery clamp are configured for allowing a replacement of the cylindrical shaped battery while maintaining the PCB arrangement.

### Claim 20

A method comprising:
installing a machinery condition monitoring device on a machine, the machinery condition monitoring device comprising:
a cylindrical shaped battery;
an enclosure assembly comprising:
a cap;
a base mechanically coupled with the cap; and
a support bracket mechanically coupled with the base;
and
a printed circuit board (PCB) assembly comprising:
a first rigid section electrically coupled to a second rigid section using a first flexible PCB interconnect;
a third rigid section electrically coupled with the second rigid section using a second flexible PCB interconnect, wherein the second rigid section comprises a battery clamp configured to secure the cylindrical shaped battery using a curved surface of the cylindrical shaped battery;
a processor;
a memory coupled with the processor;
a first sensor coupled with the processor;
a second sensor coupled with the processor; and
a communication interface coupled with the processor; wherein:
the first sensor is a wake-up sensor;
a height of the cylindrical shaped battery is greater than a diameter of the cylindrical shaped battery;
the first rigid section is positioned in a PCB arrangement to be perpendicular to the second rigid section and mechanically coupled with the support bracket using a first plurality of fastening devices,
the third rigid section is positioned in the PCB arrangement to be perpendicular to the second rigid section and mechanically coupled with the support bracket using a second plurality of fastening devices;
the first rigid section is positioned in the PCB arrangement to be parallel to the third rigid section; and
the support bracket and battery clamp are configured for allowing a replacement of the cylindrical shaped battery while maintaining the PCB arrangement;
and
receiving first sensor data and second sensor data transmitted via the communication interface.
