# US 12,004,295 B2 · Articles including metallized vias

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- Number: US 12,004,295 B2
- Document ID: US12004295B2
- Status: Granted
- Kind: B2
- Application number: 17/111,144
- Filed: 2020-12-03
- Published: 2021-03-25
- Granted: 2024-06-04
- Earliest claimed: 2018-01-29
- Assignees: Corning Incorporated
- Applicants: Corning Incorporated
- Inventors: Shrisudersan Jayaraman
- Web page: https://patentgrep.com/patent/US12004295B2

## CPC

- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 3/16: by cathodic sputtering
- H05K 3/388: {by the use of a metallic or inorganic thin film adhesion layer}
- H05K 3/423: {characterised by electroplating method}
- H10W 70/095: {of vias therein}
- H10W 70/635: {Through-vias}
- H10W 70/692: Ceramics or glasses
- H10W 70/695: Organic materials
- H05K 3/422: {characterised by electroless plating method; pretreatment therefor}
- H05K 2201/10378: Interposers
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An article includes a wafer having a body which defines a first surface and a second surface. The wafer defines a via having a via surface extending between the first and second surfaces through the body. An adhesion layer is positioned on the via surface. At least a portion of the via surface is free of the adhesion layer. A metallic component is positioned within the via and extends from the first surface to the second surface.

## Claims

### Claim 1

A method of forming a metallized article, comprising the steps:
forming a via through a body of a wafer such that the via has a via surface, the wafer comprising a glass, glass-ceramic, ceramic, or silicon material;
applying an adhesion layer to the via surface as a plurality of discrete adhesion layer segments such that a portion of the via surface is free of the adhesion layer,
the plurality of discrete adhesion layer segments comprising a first adhesion layer, a second adhesion layer, and a third adhesion layer that are applied in a discontinuous manner such that the via surface is free of the adhesion layer segments between the first adhesion layer and the second adhesion layer and between the second adhesion layer and the third adhesion layer,
the portion of the via surface that is free of the adhesion layer comprising the glass, glass-ceramic, ceramic, or silicon material, and
at least 10% of the via surface being free of the adhesion layer; and
depositing a metal within the via such that the metal is in direct contact with the adhesion layer and with the portion of the via surface that is free of the adhesion layer.

### Claim 2 (depends on 1)

The method of claim 1, further comprising the steps:
contacting the wafer with a metal substrate; and
filling the via with an electrolyte solution.

### Claim 3 (depends on 1)

The method of claim 1, wherein the step of depositing a metal within the via further comprises the step of:
applying a voltage or current between the substrate and an electrode in electrical communication with the electrolyte to deposit the metal.

### Claim 4 (depends on 1)

The method of claim 1, wherein the step of applying the adhesion layer further comprises:
sputtering at least one of Ta, Ti, Cr, V, Zr, Mn, W, Fe, Sn, Zn, In and Al on the via surface.

### Claim 5 (depends on 1)

The method of claim 1, wherein the step of forming the via further comprises:
forming the via with an aspect ratio of 4:1 or greater.

### Claim 6 (depends on 1)

The method of claim 1, wherein at least 15% of the via surface is free of the adhesion layer.

### Claim 7 (depends on 1)

The method of claim 1, wherein at least 15% of the via surface is free of the adhesion layer.

### Claim 8 (depends on 1)

The method of claim 1, wherein the via is free of an electrically conductive seed layer between the via surface and the metal.

### Claim 9 (depends on 1)

The method of claim 1, further comprising the steps:
applying the adhesion layer to a surface of the wafer; and
removing the adhesion layer present on the surface of the wafer prior to the step of depositing the metal within the vias.

### Claim 10 (depends on 1)

The method of claim 1, wherein the step of depositing a metal within the via further comprises filling the via with the metal.

### Claim 11 (depends on 1)

The method of claim 1, wherein both the wafer and the portion of the via surface that is free of the adhesion layer comprise the glass, glass-ceramic, ceramic, or silicon material.

### Claim 12 (depends on 1)

The method of claim 1, wherein the second adhesion layer is at a central region of the via along a length of the via.