# US 12,004,294 B2 · Circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,004,294 B2 - Document ID: US12004294B2 - Status: Granted - Kind: B2 - Application number: 17/828,295 - Filed: 2022-05-31 - Published: 2022-09-15 - Granted: 2024-06-04 - Earliest claimed: 2020-08-31 - Assignees: Qing Ding Precision Electronics (Huaian) Co., Ltd; Avary Holding (Shenzhen) Co., Limited. - Applicants: Qing Ding Precision Electronics (Huaian) Co., Ltd; Avary Holding (Shenzhen) Co., Limited. - Inventors: Zhi Guo - Web page: https://patentgrep.com/patent/US12004294B2 ## CPC - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 3/421: {Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence)} - H01R 12/71: for rigid printing circuits or like structures - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)} - H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)} - H05K 2201/09563: Metal filled via - H05K 2201/0959: Plated through-holes or plated blind vias filled with insulating material - H05K 2201/096: Vertically aligned vias, holes or stacked vias - H05K 2201/09645: Patterning on via walls; Plural lands around one hole - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins. ## Claims ### Claim 1 A circuit board comprising: a first outer line layer, a second base layer, an inner line layer, a first base layer, and a second outer line layer arranged from top to bottom, the inner line layer comprising a first copper layer and a first electroplated layer, the first copper layer being sandwiched between the first electroplated layer and the first base layer; a first hole extending through the inner line layer and the first base layer; a first connecting portion formed in the first hole and being in contact with a sidewall of the first hole, the first connecting portion defining two second holes to divide the first connecting portion into three second connecting pins, the three second connecting pins being arranged in the first hole along a single direction, and connected to the second outer line layer and the inner line layer, the first electroplated layer being integrally formed with the three second connecting pins, adjacent two of the three second connecting pins being spaced from each other by one of the two second holes; and at least one fourth connecting pin connected between the first outer line layer and the inner line layer. ### Claim 2 (depends on 1) The circuit board of claim 1, wherein the at least one fourth connecting pin is connected to the three second connecting pins, and the second base layer is filled into the inner line layer and the second hole. ### Claim 3 (depends on 1) The circuit board of claim 1, further comprising: a third hole extending through the inner line layer and the first base layer; a third connecting pin formed in the third hole. ### Claim 4 (depends on 3) The circuit board of claim 3, wherein the first base layer comprises a first direction defined along a length direction of the first base layer; the third hole defines a third end and a fourth end opposite to the third end, a projection of the third end and a projection of the fourth end in the first direction are circular. ### Claim 5 (depends on 1) The circuit board of claim 1, wherein the first base layer comprises a first direction defined along a length direction of the first base layer; a cross-section of the first hole in the first direction is trapezoidal, the first hole defines a first end and a second end relative to the first end, a length of the first end on the cross-section of the first hole is larger than a length of the second end on the cross-section of the first hole. ### Claim 6 (depends on 1) The circuit board of claim 1, wherein a projection of ends of the three second connecting pins away from the second outer line layer are rectangular, a length of the projection is in a range of 180 μm to 280 μm, a width of the projection is in a range of 15 μm to 275 μm, a depth of the three second connecting pins is in a range of 8 μm to 250 μm. ### Claim 7 (depends on 1) The circuit board of claim 1, wherein a first direction is a length direction of the first base layer and a second direction is a width direction of the first base layer, the second direction is perpendicular to the first direction; an aspect ratio of the three second connecting pins along the first direction is in a range of 0.03 to 1.40, and the aspect ratio of the three second connecting pins along the second direction is in a range of 0.03 to 16.7. ### Claim 8 (depends on 1) The circuit board of claim 1, wherein a portion of the first base layer is exposed from the inner layer. ### Claim 9 (depends on 1) The circuit board of claim 1, wherein the first base layer comprises at least one of polypropylene (PP), polyimide (PI), benzocyclobutene (BCB), liquid crystal polymer (LCP), and polytetrafluoroethylene (PTEE).