# US 12,004,293 B2 · Substrate for mounting electronic element, electronic device, and electronic module

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- Number: US 12,004,293 B2
- Document ID: US12004293B2
- Status: Granted
- Kind: B2
- Application number: 18/186,548
- Filed: 2023-03-20
- Published: 2023-10-12
- Granted: 2024-06-04
- Earliest claimed: 2018-01-30
- Assignees: KYOCERA Corporation
- Applicants: KYOCERA Corporation
- Inventors: Yukio Morita; Noboru Kitazumi; Yousuke Moriyama
- Web page: https://patentgrep.com/patent/US12004293B2

## CPC

- H05K 1/036: {Multilayers with layers of different types}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting}
- H05K 1/03: Use of materials for the substrate
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H10W 40/25: characterised by their materials
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H05K 2201/0323: Carbon
- H05K 2201/10416: Metallic blocks or heatsinks completely inserted in a PCB
- H10H 20/8581: {characterised by their material}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A first substrate includes a first surface and a second surface opposite to the first surface. A second substrate includes a third surface and a fourth surface opposite to the third surface. A third substrate includes a fifth surface and a sixth surface opposite to the fifth surface. The first substrate is made of an insulator, and includes a mounting portion for mounting an electronic element at the first surface, and the mounting portion is a rectangular shape. The third substrate is made of a carbon material, and the fifth surface is connected to at least the second surface at location overlapped with the mounting portion in plan view. The third substrate has a larger heat conduction in a direction perpendicular to the longitudinal direction of the mounting portion than heat conduction in the longitudinal direction of the mounting portion in plan view.

## Claims

### Claim 1

A substrate comprising:
a first member; and
a second member covered by the first member, wherein
the second member includes a first plate material and a second plate material each of which is a plate-like member comprising a carbon material,
the first plate material and the second plate material are bonded to each other in a state of being laminated in a first direction which is a thickness direction of the second member,
the second member has a first bonding portion between the first plate material and the second plate material on a side surface extending along the first direction,
the second member further includes a third plate material which is bonded to the second plate material in a state of being laminated from a side opposite to the first plate material, and a second bonding portion between the second plate material and the third plate material,
the first member covers the first bonding portion not to be exposed to an outside and covers the second bonding portion not to be exposed to the outside,
one direction intersecting the first direction is a second direction, and another direction intersecting the first direction and the second direction is a third direction,
in the first direction,
thermal conductivities of both the first plate material and the second plate material are greater than a thermal conductivity of the first member, and
a thermal conductivity of the third plate material is greater than the thermal conductivity of the first member,
the thermal conductivity of the first plate material in the first direction is greater than a thermal conductivity of the first plate material in the second direction,
the thermal conductivity of the second plate material in the first direction is greater than a thermal conductivity of the second plate material in the third direction,
a thermal conductivity of the third plate material in the first direction is greater than a thermal conductivity of the third plate material in the second direction,
in the second direction,
the thermal conductivities of the first plate material and the third plate material are smaller than the thermal conductivity of the first member, and
the thermal conductivity of the second plate material is greater than the thermal conductivity of the first member, and
in the third direction:
thermal conductivities of the first plate material and the third plate material are greater than a thermal conductivity of the first member, and
the thermal conductivity of the second plate material is smaller than the thermal conductivity of the first member.

### Claim 2 (depends on 1)

The substrate according to claim 1, wherein
a first joining surface between the first plate material and the second plate material and a second joining surface between the second plate material and the third plate material extend along the second direction and the third direction.

### Claim 3 (depends on 1)

The substrate according to claim 1, wherein
the first member continuously exists from one end to another end of the second member in the first direction.

### Claim 4 (depends on 1)

The substrate according to claim 1, wherein
the first member further includes a protection portion having a two-layer structure that covers a pair of surfaces of the second member intersecting the first direction.