# US 12,004,268 B2 · Transferring unit, substrate treating apparatus including the same, and substrate treating method

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- Number: US 12,004,268 B2
- Document ID: US12004268B2
- Status: Granted
- Kind: B2
- Application number: 17/091,054
- Filed: 2020-11-06
- Published: 2021-05-13
- Granted: 2024-06-04
- Earliest claimed: 2019-11-07
- Assignees: Semes Co., Ltd.
- Applicants: Semes Co., Ltd.
- Inventors: Ji-Hwan Lee
- Web page: https://patentgrep.com/patent/US12004268B2

## CPC

- H05B 1/0233: {for semiconductors manufacturing}
- H10P 72/0431: {Apparatus for thermal treatment}
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A transferring unit, a substrate treating apparatus including the same, and a substrate treating method are provided. The substrate treating apparatus includes a support plate, a plurality of protrusions protruding upward from the support plate to support a substrate, a temperature adjusting member provided in the support plate to heat or cool the substrate, and an ultrasound applying member to apply an ultrasound between the substrate placed on the plurality of protrusions and the support plate.

## Claims

### Claim 1

A substrate treating apparatus comprising:
a support plate;
a plurality of protrusions protruding upward from the support plate to support a substrate;
a temperature adjusting member provided in the support plate to heat or cool the substrate; and
an ultrasound applying member configured to apply an ultrasound between the substrate placed on the plurality of protrusions and the support plate,
wherein the ultrasound applying member applies the ultrasound in a direction parallel to the substrate.

### Claim 2 (depends on 1)

The substrate treating apparatus of claim 1, wherein the temperature adjusting member is a cooling member configured to cool the substrate.

### Claim 3 (depends on 2)

The substrate treating apparatus of claim 2, wherein the temperature adjusting member has a cooling fluid passage provided in the support plate.

### Claim 4 (depends on 1)

The substrate treating apparatus of claim 1, wherein the temperature adjusting member is a heating member configured to heat the substrate.

### Claim 5 (depends on 1)

The substrate treating apparatus of claim 1, wherein the ultrasound applying member is provided at one side portion of the support plate.

### Claim 6

A substrate treating apparatus comprising:
a housing;
a heating unit including a heating plate positioned inside the housing to heat a substrate; and
a transferring unit positioned inside the housing to transfer the substrate from the heating plate,
wherein the transferring unit includes,
a transferring plate configured to place the substrate,
protrusions protruding upward from the transferring plate to support the substrate,
a cooling unit configured to cool the substrate which is heated, and
an ultrasound applying member configured to apply an ultrasound between the substrate and the transferring plate,
wherein the ultrasound applying member applies the ultrasound in a direction parallel to the substrate.

### Claim 7 (depends on 6)

The substrate treating apparatus of claim 6, wherein the cooling unit is provided in the transferring plate.

### Claim 8 (depends on 7)

The substrate treating apparatus of claim 7, wherein the cooling unit is a cooling fluid passage.

### Claim 9 (depends on 6)

The substrate treating apparatus of claim 6, further comprising:
a driver configured to drive the transferring plate,
wherein the ultrasound applying member is provided in the driver.

### Claim 10

A transferring unit comprising:
a transferring plate configured to place a substrate;
protrusions protruding upward from the transferring plate to support the substrate;
a cooling unit provided in the transferring plate to cool the substrate which is heated; and
an ultrasound applying member configured to apply an ultrasound between the substrate and the transferring plate,
wherein the ultrasound applying member is provided to apply the ultrasound in a direction parallel to the substrate.

### Claim 11 (depends on 10)

The transferring unit of claim 10, wherein the cooling unit is provided in the transferring plate.

### Claim 12 (depends on 10)

The transferring unit of claim 10, wherein the cooling unit is a cooling fluid passage.

### Claim 13 (depends on 10)

The transferring unit of claim 10, further comprising:
a driver configured to drive the transferring plate,
wherein the ultrasound applying member is provided in the driver.