Composite substrate, piezoelectric device, and method for manufacturing composite substrate
AssigneeKYOCERA Corporation
InventorsMotohiro Umehara, Kuniaki Mitsuda
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AssigneeKYOCERA Corporation
InventorsMotohiro Umehara, Kuniaki Mitsuda
Estimating the term…
A composite substrate of the present disclosure is a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded, wherein the ratio of the number of oxygen atoms to the number of aluminum atoms in the bonding surface region including the bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5. The piezoelectric device of the present disclosure comprises the composite substrate. A method for manufacturing the composite substrate of the present disclosure comprises a step of preparing a piezoelectric substrate and a sapphire substrate, a step of heat-treating the sapphire substrate in a reducing atmosphere or in a vacuum, and a step of directly bonding the piezoelectric substrate to the sapphire substrate.
A composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded to each other,
A method for manufacturing a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded to each other, comprising:
A method for manufacturing a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded to each other, comprising:
Dependencies are inferred from the claim text.