# US 12,003,226 B2 · Transversely-excited film bulk acoustic resonator with low thermal impedance > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,003,226 B2 - Document ID: US12003226B2 - Status: Granted - Kind: B2 - Application number: 17/318,776 - Filed: 2021-05-12 - Published: 2022-05-12 - Granted: 2024-06-04 - Earliest claimed: 2020-11-11 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd - Inventors: Greg Dyer; Chris O'Brien; Neal O. Fenzi; James R. Costa - Web page: https://patentgrep.com/patent/US12003226B2 ## CPC - H03H 9/02228: {Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer} - H03H 3/02: for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) - H03H 9/02031: {consisting of ceramic} - H03H 9/02102: {of temperature influence (cutting angles H03H9/02015)} - H03H 9/0514: {consisting of mounting pads or bumps} - H03H 9/132: {characterized by a particular shape} - H03H 9/173: {Air-gaps} - H03H 9/174: {Membranes} - H03H 9/176: {consisting of ceramic material (H03H9/177, H03H9/178 take precedence)} - H03H 9/562: {comprising a ceramic piezoelectric layer} - H03H 9/564: {implemented with thin-film techniques} - H03H 9/568: {consisting of a ladder configuration} - H03H 2003/023: {the resonators or networks being of the membrane type} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on a diaphragm of the plate that is formed over a cavity in the substrate. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the substrate to provide lower thermal resistance between the IDT and the substrate. ## Claims ### Claim 1 A method of forming a filter device with low thermal impedance, the method comprising: forming a bonding oxide (BOX) layer on a surface of a substrate; bonding a piezoelectric layer to the BOX layer; removing the piezoelectric layer and the BOX layer from at least a portion of the surface of the substrate; forming a conductor pattern at the piezoelectric layer and that contacts the portion of the surface of the substrate where the piezoelectric layer and BOX layer were removed; and forming a cavity, such that a portion of the piezoelectric layer forms a diaphragm over the cavity and the conductor pattern includes an interdigital transducer (IDT) with interleaved fingers disposed on the diaphragm over the cavity. ### Claim 2 (depends on 1) The method of claim 1, wherein the cavity is formed in the surface of the substrate and before one of: forming the BOX layer on a surface of a substrate; bonding the piezoelectric layer to the BOX layer; removing the piezoelectric layer and the BOX layer from at least the portion of the surface of the substrate; or forming the conductor pattern at the piezoelectric layer. ### Claim 3 (depends on 1) The method of claim 1, wherein the cavity is formed in the surface of the substrate after forming the conductor pattern at the piezoelectric layer. ### Claim 4 (depends on 1) The method of claim 1, wherein removing the piezoelectric layer and the BOX layer includes: patterning the bonded piezoelectric layer; and etching the patterned piezoelectric layer to remove a predetermined area of the BOX layer and the piezoelectric layer from selected locations of the surface of the substrate to provide a predetermined amount in reduction of thermal resistance between the interleaved fingers and the substrate. ### Claim 5 (depends on 4) The method of claim 4, further comprising attaching a second metal layer to: the surface of the substrate where the piezoelectric layer and the BOX layer are removed; a side surface of the BOX layer where the piezoelectric layer and the BOX layer are removed; a side surface of the piezoelectric layer where the piezoelectric layer and the BOX layer are removed and part of a top surface of the piezoelectric layer; and a side surface and part of a top surface of the IDT. ### Claim 6 (depends on 5) The method of claim 5, wherein the interleaved fingers are two sets of fingers and the IDT further comprises a pair of busbars attached to the two sets of fingers, respectively, wherein at least a part of the pair of busbars are over the substrate, and wherein the second metal layer is attached to a top of the pair of busbars and not to a top of the interleaved fingers. ### Claim 7 (depends on 1) The method of claim 1, wherein removing the piezoelectric layer and the BOX layer includes: removing predetermined areas of the BOX layer and piezoelectric layer either before or after the IDT is formed; and using the surface of the substrate as an etch stop. ### Claim 8 (depends on 1) The method of claim 1, wherein the cavity has a perimeter; and wherein the removing includes removing the BOX layer and piezoelectric layer from excess portions that extend a length and width of a perimeter of a piezoelectric material that spans the cavity and that extends between 2 and 25 percent past a length and width of the perimeter of the cavity. ### Claim 9 (depends on 1) The method of claim 1, wherein the piezoelectric layer and the IDT are configured such that radio frequency signals applied to the IDT excite a primary shear acoustic mode in the diaphragm of the piezoelectric layer over the cavity, wherein a thickness of the diaphragm is selected to tune the primary shear acoustic modes in the piezoelectric layer. ### Claim 10 A method of forming a filter device with low thermal impedance, the method comprising: forming a bonding oxide (BOX) layer on a surface of a substrate; thinning the BOX layer over at least a portion of the surface of the substrate to form a thinned BOX layer that provides lower thermal resistance between an interdigital transducer (IDT) and the substrate; bonding a piezoelectric layer to the thinned BOX layer, the piezoelectric layer having a portion that forms a diaphragm over a cavity; forming the IDT at the piezoelectric layer; and forming the cavity through at least one of the BOX layer and the surface of the substrate, wherein the IDT has interleaved fingers disposed on the diaphragm over the cavity. ### Claim 11 (depends on 10) The method of claim 10, wherein the cavity is formed in the surface of the substrate before one of: forming the BOX layer on a surface of the substrate; thinning the BOX layer; bonding the piezoelectric layer to the BOX layer; or forming the IDT at the piezoelectric layer. ### Claim 12 (depends on 10) The method of claim 10, wherein the cavity is formed in the surface of the substrate after forming the IDT at the piezoelectric layer. ### Claim 13 (depends on 10) The method of claim 10, wherein thinning the BOX layer comprises polishing the formed BOX layer to a desired thickness of the thinned BOX layer. ### Claim 14 (depends on 13) The method of claim 13, wherein the desired thickness of the thinned BOX layer is between 200 nm and 400 nm. ### Claim 15 (depends on 10) The method of claim 10, further comprising forming the cavity by etching through openings in a frontside of the piezoelectric layer and the thinned BOX layer to the substrate to remove a portion of the substrate from below the diaphragm and the thinned BOX layer from the diaphragm over the cavity. ### Claim 16 (depends on 15) The method of claim 15, wherein forming the openings includes forming thermal vias prior or during a frontside etching of the openings or etching of the cavity. ### Claim 17 (depends on 10) The method of claim 10, further comprising forming thermal vias through the piezoelectric layer and the thinned BOX layer and into the substrate at selected locations of the surface of the substrate to provide a predetermined amount in reduction of thermal resistance between the IDT and the substrate. ### Claim 18 (depends on 17) The method of claim 17, wherein the thermal vias are formed around a perimeter of and form an island of the BOX layer, the piezoelectric layer and the IDT. ### Claim 19 (depends on 10) The method of claim 10, further comprising attaching a second metal layer to: a top surface of the piezoelectric layer; and a side surface and part of a top surface of the IDT. ### Claim 20 (depends on 19) The method of claim 19, wherein the interleaved fingers are two sets of fingers and the IDT further comprising a pair of busbars attached to the two sets of fingers, respectively, wherein at least a part of each of the pair of busbars are over the substrate, and wherein the second metal layer is attached to a top of the pair of busbars and not to a top of the interleaved fingers. ### Claim 21 (depends on 10) The method of claim 10, wherein the substrate is Si, the BOX layer is SiO2, the IDT is metal, an overlapping distance of the interleaved fingers defines an aperture of the filter device, and the piezoelectric layer comprises one of lithium niobate or lithium tantalate. ### Claim 22 (depends on 10) The method of claim 10, wherein the piezoelectric plate and the IDT are configured such that radio frequency signals applied to the IDT excite a primary shear acoustic mode in the diaphragm over the cavity, wherein a thickness of the diaphragm is selected to tune the primary shear acoustic modes in the piezoelectric layer.