# US 12,003,025 B2 · Selectively shielded radio frequency modules

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,003,025 B2
- Document ID: US12003025B2
- Status: Granted
- Kind: B2
- Application number: 17/154,854
- Filed: 2021-01-21
- Published: 2021-05-13
- Granted: 2024-06-04
- Earliest claimed: 2016-04-19
- Assignees: Skyworks Solutions, Inc.
- Applicants: Skyworks Solutions, Inc.
- Inventors: Hoang Mong Nguyen; Anthony James LoBianco; Gregory Edward Babcock; Darren Roger Frenette; George Khoury
- Web page: https://patentgrep.com/patent/US12003025B2

## CPC

- H01Q 1/526: {Electromagnetic shields}
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/2291: {used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN] (H01Q1/241 takes precedence; WLAN in general H04W)}
- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01Q 9/42: with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
- H10P 14/412: {Deposition of metallic or metal-silicide materials}
- H10P 14/418: {the conductive layers comprising transition metals}
- H10P 14/44: Physical vapour deposition [PVD]
- H10P 34/42: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10P 76/00: Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/50: Bond wires
- H10W 44/206: {Wires}
- H10W 44/226: {for HF amplifiers}
- H10W 44/234: {Arrangements for impedance matching}
- H10W 44/248: {for antennas}
- H10W 74/10: characterised by their shape or disposition
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.

## Claims

### Claim 1

A radio frequency module comprising:
an antenna on a substrate, the antenna configured to wirelessly transmit a radio frequency signal;
a radio frequency component on the substrate; and
a radio frequency shielding structure including a shielding layer and a wire bond, the shielding layer positioned over the radio frequency component, the wire bond positioned between the radio frequency component and the antenna, and the wire bond extending farther vertically from the substrate than all parts of the antenna.

### Claim 2 (depends on 1)

The radio frequency module of claim 1 wherein the radio frequency shielding structure includes wire bond walls around the radio frequency component, one of the wire bond walls including the wire bond.

### Claim 3 (depends on 1)

The radio frequency module of claim 1 wherein the radio frequency shielding structure includes a conformal layer extending substantially perpendicular to a surface of the substrate on which the radio frequency component is positioned.

### Claim 4 (depends on 1)

The radio frequency module of claim 1 wherein the antenna is printed on the substrate.

### Claim 5 (depends on 1)

The radio frequency module of claim 1 wherein the substrate is a laminate substrate that includes at least one routing layer.

### Claim 6 (depends on 1)

The radio frequency module of claim 1 further comprising a protective layer over the shielding layer.

### Claim 7 (depends on 1)

The radio frequency module of claim 1 wherein the antenna is configured to receive a wireless local area network signal.

### Claim 8 (depends on 1)

The radio frequency module of claim 1 wherein the antenna is configured to receive a wireless personal area network signal.

### Claim 9 (depends on 1)

The radio frequency module of claim 1 wherein the radio frequency component includes a front end integrated circuit.

### Claim 10 (depends on 1)

The radio frequency module of claim 1 wherein the radio frequency component includes a semiconductor-on-insulator die that includes a low noise amplifier.

### Claim 11 (depends on 1)

The radio frequency module of claim 1 wherein the antenna is on at least two sides of perimeter of the radio frequency component.

### Claim 12 (depends on 1)

The radio frequency module of claim 1 wherein the antenna is on at least three sides of perimeter of the radio frequency component.

### Claim 13 (depends on 1)

The radio frequency module of claim 1 wherein the antenna is on four sides of perimeter of the radio frequency component.

### Claim 14

A system board assembly comprising:
a packaged radio frequency module including a radio frequency component on a substrate, an antenna on the substrate and configured to wirelessly transmit a radio frequency signal, and a radio frequency shielding structure including a wire bond positioned between the radio frequency component and the antenna, and the wire bond extending farther vertically from the substrate than all parts of the antenna; and
a system board on which the packaged radio frequency module is positioned, the system board including a ground contact electrically connected to the radio frequency shielding structure.

### Claim 15 (depends on 14)

The system board assembly of claim 14 further comprising an electronic component on the system board, the radio frequency shielding structure configured to provide radio frequency shielding between the radio frequency component and the electronic component.

### Claim 16 (depends on 14)

The system board assembly of claim 14 wherein the radio frequency shielding structure includes vias in the substrate.

### Claim 17

A wireless communication device comprising:
a packaged radio frequency module including a radio frequency component on a substrate, an antenna on the substrate and configured to wirelessly transmit a radio frequency signal, and a radio frequency shielding structure including a wire bond positioned between the radio frequency component and the antenna, the wire bond extending farther vertically from the substrate than all parts of the antenna; and
a transceiver in communication with the radio frequency component.

### Claim 18 (depends on 17)

The wireless communication device of claim 17 wherein the wireless communication device is configured to transmit a wireless personal area network signal from the antenna.

### Claim 19 (depends on 17)

The wireless communication device of claim 17 wherein the wireless communication device is configured to transmit a wireless local area network signal from the antenna.

### Claim 20 (depends on 17)

The wireless communication device of claim 17 wherein the wireless communication device is an Internet of Things device.