# US 12,003,014 B2 · Antenna module and communication device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,003,014 B2 - Document ID: US12003014B2 - Status: Granted - Kind: B2 - Application number: 17/141,302 - Filed: 2021-01-05 - Published: 2021-04-29 - Granted: 2024-06-04 - Earliest claimed: 2018-07-06 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Ryuken Mizunuma - Web page: https://patentgrep.com/patent/US12003014B2 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/2266: {disposed inside the computer} - H01Q 1/526: {Electromagnetic shields} - H01Q 9/0421: {with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence)} - H01Q 21/062: {using dipole aerials; (H01Q21/067, H01Q21/068 take precedence)} - H01Q 21/065: {Patch antenna array} - H01Q 25/005: {providing two patterns of opposite direction; back to back antennas (H01Q25/004 takes precedence)} - H10W 70/69: Insulating materials thereof - H01P 1/20345: {Multilayer filters} - H01Q 5/357: using a single feed point - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) ## Abstract An antenna module includes a substrate that includes a first dielectric layer and a second dielectric layer with a dielectric constant different from a dielectric constant of the first dielectric layer, a first antenna that is disposed on or in the first dielectric layer and transmits and receives a signal in a first frequency band, a second antenna that is disposed on or in the second dielectric layer and transmits and receives a signal in a second frequency band which is a lower frequency band than the first frequency band, and a radio frequency circuit that is disposed on or in the substrate and is electrically connected to the first antenna. ## Claims ### Claim 1 An antenna module comprising: a substrate that includes a first dielectric layer with a first dielectric constant and a second dielectric layer with a second dielectric constant, wherein the second dielectric constant is different from the first dielectric constant; a first antenna that is disposed on or in the first dielectric layer and that transmits and receives a signal in a first frequency band; a second antenna that is disposed on or in the second dielectric layer and that transmits and receives a signal in a second frequency band which is a lower frequency band than the first frequency band; a radio frequency circuit that is disposed on or in the substrate, and that is electrically connected to the first antenna; and a ground layer that is disposed between the first antenna and the second antenna, the first antenna and the second antenna opposing to each other, at least part of the first antenna is disposed in a region overlapping with the second antenna in a plan view. ### Claim 2 (depends on 1) The antenna module according to claim 1, wherein the second dielectric constant is higher than the first dielectric constant. ### Claim 3 (depends on 2) The antenna module according to claim 2, wherein the first dielectric layer has a larger area than the second dielectric layer in the plan view. ### Claim 4 (depends on 2) The antenna module according to claim 2, wherein a connector electrically connected to the second antenna is disposed on or in the first dielectric layer. ### Claim 5 (depends on 2) The antenna module according to claim 2, wherein the radio frequency circuit is encapsulated within a resin. ### Claim 6 (depends on 2) The antenna module according to claim 2, further comprising a filter circuit configured to allow at least the signal in the first frequency band to pass therethrough, the filter circuit being disposed on or in the second dielectric layer. ### Claim 7 (depends on 1) The antenna module according to claim 1, wherein the first dielectric layer has a larger area than the second dielectric layer in the plan view. ### Claim 8 (depends on 7) The antenna module according to claim 7, wherein a connector electrically connected to the second antenna is disposed on or in the first dielectric layer. ### Claim 9 (depends on 7) The antenna module according to claim 7, wherein the radio frequency circuit is encapsulated within a resin. ### Claim 10 (depends on 7) The antenna module according to claim 7, further comprising a filter circuit configured to allow at least the signal in the first frequency band to pass therethrough, the filter circuit being disposed on or in the second dielectric layer. ### Claim 11 (depends on 1) The antenna module according to claim 1, wherein a connector electrically connected to the second antenna is disposed on or in the first dielectric layer. ### Claim 12 (depends on 1) The antenna module according to claim 1, wherein the radio frequency circuit is encapsulated within a resin. ### Claim 13 (depends on 12) The antenna module according to claim 12, wherein a shield layer covers the radio frequency circuit encapsulated within the resin. ### Claim 14 (depends on 1) The antenna module according to claim 1, further comprising a filter circuit configured to allow at least the signal in the first frequency band to pass therethrough, the filter circuit being disposed on or in the second dielectric layer. ### Claim 15 (depends on 14) The antenna module according to claim 14, wherein the second dielectric layer and the radio frequency circuit are disposed adjacent to each other on the surface of the first dielectric layer, and the antenna module includes a signal path that is disposed on or in the first dielectric layer and the second dielectric layer and that connects the first antenna, the filter circuit, and the radio frequency circuit. ### Claim 16 (depends on 1) A communication device comprising: the antenna module according to claim 1, a mother board; a millimeter wave circuit that is disposed on or in the mother board and is connected to the antenna module; and a microwave circuit that is disposed on or in the mother board and is connected to the antenna module. ### Claim 17 (depends on 2) A communication device comprising: the antenna module according to claim 2, a mother board; a millimeter wave circuit that is disposed on or in the mother board and is connected to the antenna module; and a microwave circuit that is disposed on or in the mother board and is connected to the antenna module.