# US 12,002,917 B2 · Light-emitting device

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- Number: US 12,002,917 B2
- Document ID: US12002917B2
- Status: Granted
- Kind: B2
- Application number: 18/323,544
- Filed: 2023-05-25
- Published: 2023-09-21
- Granted: 2024-06-04
- Earliest claimed: 2020-04-28
- Assignees: Nichia Corporation
- Applicants: Nichia Corporation
- Inventors: Hiroaki Kageyama
- Web page: https://patentgrep.com/patent/US12002917B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/858: Means for heat extraction or cooling
- H10W 90/00: Package configurations
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light-emitting element includes: a support substrate; a semiconductor stacked body disposed on the support substrate, the semiconductor stacked body including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer; an insulating film including a first opening disposed above the first semiconductor layer and a plurality of second openings disposed above the second semiconductor layer; a first pad electrode disposed on the insulating film and electrically connected to the first semiconductor layer at the first opening; a second pad electrode disposed on the insulating film and electrically connected to the second semiconductor layer at the plurality of second openings; and a third pad electrode disposed on the insulating film and electrically insulated from the semiconductor stacked body.

## Claims

### Claim 1

A light-emitting element comprising:
a support substrate;
a semiconductor stacked body disposed on the support substrate, the semiconductor stacked body including a first semiconductor layer, a second semiconductor layer, and a light-emitting layer provided between the first semiconductor layer and the second semiconductor layer;
an insulating film including a first opening disposed above the first semiconductor layer and a plurality of second openings disposed above the second semiconductor layer;
a first pad electrode disposed on the insulating film and electrically connected to the first semiconductor layer at the first opening;
a second pad electrode disposed on the insulating film and electrically connected to the second semiconductor layer at the plurality of second openings;
a third pad electrode disposed on the insulating film and electrically insulated from the semiconductor stacked body;
a plurality of first bonding members disposed on the first pad electrode;
a plurality of second bonding members disposed on the second pad electrode; and
a plurality of third bonding members disposed on the third pad electrode and electrically insulated from the semiconductor stacked body; wherein:
in a plan view, the second bonding member is provided between the first bonding member and the third bonding member.

### Claim 2 (depends on 1)

The light-emitting element according to claim 1, wherein:
the plurality of first bonding members is aligned along a first direction parallel to a side of the support substrate;
the plurality of second bonding members is aligned along the first direction;
the plurality of third bonding members is aligned along the first direction; and
in a second direction perpendicular to the first direction, each of the second bonding members is provided between the first bonding member and the third bonding member.

### Claim 3 (depends on 1)

The light-emitting element according to claim 1, wherein, in a plan view, the plurality of second bonding members is disposed on an imaginary line being perpendicular to and halving a side of the support substrate.

### Claim 4 (depends on 2)

The light-emitting element according to claim 2, wherein, in a plan view, the plurality of second bonding members is disposed on an imaginary line being perpendicular to and halving a side of the support substrate.

### Claim 5 (depends on 1)

The light-emitting element according to claim 1, wherein, in a plan view, the plurality of second bonding members is provided between the first pad electrode and the third pad electrode.

### Claim 6 (depends on 2)

The light-emitting element according to claim 2, wherein, in a plan view, the plurality of second bonding members is provided between the first pad electrode and the third pad electrode.

### Claim 7 (depends on 3)

The light-emitting element according to claim 3, wherein, in a plan view, the plurality of second bonding members is provided between the first pad electrode and the third pad electrode.

### Claim 8 (depends on 1)

The light-emitting element according to claim 1, wherein, in a plan view, the plurality of the second openings is provided between the first pad electrode and the third pad electrode.

### Claim 9 (depends on 2)

The light-emitting element according to claim 2, wherein, in a plan view, the plurality of the second openings is provided between the first pad electrode and the third pad electrode.

### Claim 10 (depends on 3)

The light-emitting element according to claim 3, wherein, in a plan view, the plurality of the second openings is provided between the first pad electrode and the third pad electrode.

### Claim 11 (depends on 1)

The light-emitting element according to claim 1, wherein the first pad electrode, the second pad electrode, and the third pad electrode are not overlapped with each other.

### Claim 12 (depends on 2)

The light-emitting element according to claim 2, wherein the first pad electrode, the second pad electrode, and the third pad electrode are not overlapped with each other.

### Claim 13 (depends on 3)

The light-emitting element according to claim 3, wherein the first pad electrode, the second pad electrode, and the third pad electrode are not overlapped with each other.

### Claim 14 (depends on 1)

The light-emitting element according to claim 1, a length of a side of the support substrate is in a range of 500 μm to 1500 μm.

### Claim 15 (depends on 2)

The light-emitting element according to claim 2, a length of a side of the support substrate is in a range of 500 μm to 1500 μm.

### Claim 16 (depends on 3)

The light-emitting element according to claim 3, a length of a side of the support substrate is in a range of 500 μm to 1500 μm.

### Claim 17 (depends on 1)

A light-emitting device comprising:
a substrate;
a first interconnect disposed on the substrate;
a second interconnect disposed on the substrate;
a third interconnect disposed on the substrate; and
the light-emitting element according to claim 1; wherein:
the first bonding member is electrically connected to the first interconnect;
the second bonding member is electrically connected to the second interconnect; and
the third bonding member is electrically connected to the third interconnect.

### Claim 18 (depends on 2)

A light-emitting device comprising:
a substrate;
a first interconnect disposed on the substrate;
a second interconnect disposed on the substrate;
a third interconnect disposed on the substrate; and
the light-emitting element according to claim 2, wherein:
the first bonding member is electrically connected to the first interconnect;
the second bonding member is electrically connected to the second interconnect; and
the third bonding member is electrically connected to the third interconnect.

### Claim 19 (depends on 3)

A light-emitting device comprising:
a substrate;
a first interconnect disposed on the substrate;
a second interconnect disposed on the substrate;
a third interconnect disposed on the substrate; and
the light-emitting element according to claim 3, wherein:
the first bonding member is electrically connected to the first interconnect;
the second bonding member is electrically connected to the second interconnect; and
the third bonding member is electrically connected to the third interconnect.