# US 12,002,916 B2 · Backplane and glass-based circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,916 B2 - Document ID: US12002916B2 - Status: Granted - Kind: B2 - Application number: 17/930,514 - Filed: 2022-09-08 - Published: 2023-01-05 - Granted: 2024-06-04 - Earliest claimed: 2022-09-08 - Assignees: Beijing Boe Display Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Applicants: Beijing Boe Display Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Inventors: Wengang Su; Wei Hao; Haiwei Sun; Lingyun Shi; Feifei Wang; Rui Shi - Web page: https://patentgrep.com/patent/US12002916B2 ## CPC - H10W 72/50: Bond wires - F21S 43/195: {Details of lamp holders, terminals or connectors} - G06F 1/183: Internal mounting support structures, e.g. for supporting printed circuit boards - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H10H 20/856: Reflecting means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/24: comprising multiple light-emitting semiconductor devices - H10H 29/857: {Interconnections (of active-matrix LED displays H10H29/49)} - H10W 72/00: Interconnections or connectors in packages - H10W 90/00: Package configurations - G02F 1/133603: {with LEDs} - G02F 1/133612: {Electrical details} - G02F 1/133613: {characterized by the sequence of light sources} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 1/113: {Via provided in pad; Pad over filled via} - H05K 2201/0179: Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics - H10H 29/856: Reflecting means - H10H 29/942: {Serial electrical configurations of multiple light-emitting semiconductor components or devices} - H10W 72/9445: {Top-view layouts, e.g. mirror arrays} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS ## Abstract A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair. ## Claims ### Claim 1 A backplane, comprising: a base substrate; a plurality of light-emitting units, arranged in an array on the base substrate, wherein each of the plurality of the light-emitting units comprises at least one light-emitting sub-unit; the at least one light-emitting sub-unit comprises a connection line and a plurality of light-emitting diode chips electrically connected with the connection line; the plurality of the light-emitting diode chips are located on a side of the connection line away from the base substrate; in each of the light-emitting sub-units, the connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair, wherein the plurality of the connection sub-portions comprise a first connection sub-portion and a second connection sub-portion, the first connection sub-portion extends along a first direction parallel to the base substrate; the first connection sub-portion comprises a connection region, a part of the first sub-portion where the connection region is located forms a shape of notch, and the electrical contact point of the first connection sub-portion is located on a side of the connection region facing the notch, the second connection sub-portion extends along the second direction parallel to the base substrate and intersecting with the first direction, the electrical contact point of the second connection sub-portion and the electrical contact point of an adjacent first connection sub-portion located in the connection region constitute the electrical contact point pair, in each of the light-emitting sub-units, the first connection portion comprises a first input end; the second connection portion comprises a second input end; and the first connection portion and the second connection portion respectively comprise an electrical contact point, both ends of the third connection portion respectively comprise an electrical contact point; the electrical contact point at one end of the third connection portion and the electrical contact point of the first connection portion constitute an electrical contact point pair; the electrical contact point at the other end of the third connection portion and the electrical contact point of the second connection portion constitute an electrical contact point pair, the light-emitting sub-unit comprises a plurality of first connection sub-portion rows extending along the first direction and arranged in the second direction; each of the first connection sub-portion rows comprises at least one first connection sub-portion; two end portions of the second connection sub-portion are respectively located in notches opposite to each other at end portions of adjacent first connection sub-portion rows, so that the adjacent first connection sub-portion rows are connected with each other by the second connection sub-portion and the light-emitting diode chips, and except the connection regions located at both ends of the first connection sub-portion row, the first connection sub-portion row has a substantially equal size in the second direction at respective positions in the first direction. ### Claim 2 (depends on 1) The backplane according to claim 1, wherein the first connection portion comprises a first protrusion portion; the first protrusion portion is located within the notch at the connection region of the first connection sub-portion row connected with the first protrusion portion by the light-emitting diode chip; the second connection portion comprises a second protrusion portion; and the second protrusion portion is located within the notch at the connection region of the first connection sub-portion row connected with the second protrusion portion by the light-emitting diode chip. ### Claim 3 (depends on 1) The backplane according to claim 1, wherein each of the first connection sub-portion rows comprises a plurality of the first connection sub-portions; and a connection region of one first connection sub-portion of adjacent first connection sub-portions is located in the notch of the other first connection sub-portion of the adjacent first connection sub-portions, so that the adjacent connection regions are electrically connected by the light-emitting diode chip. ### Claim 4 (depends on 3) The backplane according to claim 3, wherein each of the first connection sub-portion rows comprises a first end portion and a second end portion; the first end portions of the plurality of the connection sub-portion rows are aligned in the second direction; the second end portions of the plurality of the first connection sub-portion rows are aligned in the second direction; and the plurality of the first connection sub-portion rows and the second connection sub-portions are integrally connected in a square wave shape. ### Claim 5 A backplane, comprising: a base substrate; a plurality of light-emitting units, arranged in an array on the base substrate, wherein each of the plurality of the light-emitting units comprises at least one light-emitting sub-unit; the at least one light-emitting sub-unit comprises a connection line and a plurality of light-emitting diode chips electrically connected with the connection line; the plurality of the light-emitting diode chips are located on a side of the connection line away from the base substrate; in each of the light-emitting sub-units, the connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair, wherein the plurality of the connection sub-portions comprise a first connection sub-portion and a second connection sub-portion, the first connection sub-portion extends along a first direction parallel to the base substrate; the first connection sub-portion comprises a connection region, a part of the first sub-portion where the connection region is located forms a shape of notch, and the electrical contact point of the first connection sub-portion is located on a side of the connection region facing the notch, the second connection sub-portion extends along the second direction parallel to the base substrate and intersecting with the first direction, the electrical contact point of the second connection sub-portion and the electrical contact point of an adjacent first connection sub-portion located in the connection region constitute the electrical contact point pair, in each of the light-emitting sub-units, the first connection portion comprises a first input end; the second connection portion comprises a second input end; and the first connection portion and the second connection portion respectively comprise an electrical contact point, both ends of the third connection portion respectively comprise an electrical contact point; the electrical contact point at one end of the third connection portion and the electrical contact point of the first connection portion constitute an electrical contact point pair; the electrical contact point at the other end of the third connection portion and the electrical contact point of the second connection portion constitute an electrical contact point pair, the light-emitting sub-unit comprises a plurality of first connection sub-portion rows extending along the first direction and arranged in the second direction; each of the first connection sub-portion rows comprises at least one first connection sub-portion; two end portions of the second connection sub-portion are respectively located in notches opposite to each other at end portions of adjacent first connection sub-portion rows, so that the adjacent first connection sub-portion rows are connected with each other by the second connection sub-portion and the light-emitting diode chips, wherein the second connection sub-portions connected with a same first connection sub-portion row by the light-emitting diode chips are respectively located on both sides of the same first connection sub-portion row in the second direction and are respectively located at both ends of the same first connection sub-portion row in the first direction. ### Claim 6 (depends on 1) The backplane according to claim 1, wherein each of the electrical contact point pairs is respectively connected with an anode and a cathode of one of the plurality of the light-emitting diode chips in one-to-one correspondence. ### Claim 7 (depends on 1) The backplane according to claim 1, wherein the at least one light-emitting sub-unit comprises a plurality of light-emitting sub-units; and the plurality of the light-emitting sub-units of each of the light-emitting units share the first connection portion and the second connection portion, so that the plurality of the light-emitting sub-units are connected in parallel. ### Claim 8 (depends on 1) The backplane according to claim 1, wherein two of the first connection portion, the second connection portion and the third connection portion constituting the electrical contact point pair have a space therebetween, and an orthogonal projection of the light-emitting diode chip on the base substrate at least partially overlaps with an orthogonal projection of the space on the base substrate. ### Claim 9 (depends on 1) The backplane according to claim 1, further comprising: a reflective layer, located between the connection line and the light-emitting diode chip; a plurality of wirings parallel to each other, located on a side of the connection line facing the base substrate, and including a plurality of first wirings and a plurality of second wirings; a first insulation layer between the plurality of the wirings parallel to each other and the connection line, and a second insulation layer between the reflective layer and the connection line, to isolate the reflective layer and the connection line from each other, wherein the first input end of the connection line is connected with the first wiring, and the second input end of the connection line is connected with the second wiring; a thickness of the wiring is greater than a thickness of the connection line, and widths of both of the first connection portion and the second connection portion are greater than a width of the wiring. ### Claim 10 (depends on 1) The backplane according to claim 1, further comprising: a reflective layer, located between the connection line and the light-emitting diode chip; a white glue layer on a side of the reflective layer away from the base substrate, and having openings exposing the light-emitting diode chips; and a transparent layer on a side of the white glue layer away from the base substrate to cover the white glue layer and the light-emitting diode chips. ### Claim 11 (depends on 1) The backplane according to claim 1, wherein a distance between adjacent connection portions is not less than 15 microns. ### Claim 12 A glass-based circuit board, comprising: a glass substrate; and a plurality of connection line units, arranged in an array on the glass substrate; wherein, each of the connection line units comprises at least one connection line sub-unit; the connection line sub-unit comprises a first connection portion, a second connection portion and a third connection portion; in each of the connection line sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair, wherein the plurality of the connection sub-portions comprise a first connection sub-portion and a second connection sub-portion, the first connection sub-portion extends along a first direction parallel to the glass substrate; the first connection sub-portion comprises a connection region, a part of the first sub-portion where the connection region is located forms a shape of notch, and the electrical contact point of the first connection sub-portion is located on a side of the connection region facing the notch, the second connection sub-portion extends along the second direction parallel to the glass substrate and intersecting with the first direction, the electrical contact point of the second connection sub-portion and the electrical contact point of an adjacent first connection sub-portion located in the connection region constitute the electrical contact point pair, in each of the connection line sub-units, the first connection portion comprises a first input end; the second connection portion comprises a second input end; and the first connection portion and the second connection portion respectively comprise an electrical contact point, both ends of the third connection portion respectively comprise an electrical contact point; the electrical contact point at one end of the third connection portion and the electrical contact point of the first connection portion constitute an electrical contact point pair; the electrical contact point at the other end of the third connection portion and the electrical contact point of the second connection portion constitute an electrical contact point pair, the connection line sub-unit comprises a plurality of first connection sub-portion rows extending along the first direction and arranged in the second direction; each of the first connection sub-portion rows comprises at least one first connection sub-portion; two end portions of the second connection sub-portion are respectively located in notches at end portions of adjacent first connection sub-portion rows, so that the electrical contact points at the two end portions of the second connection sub-portion respectively constitute the electrical contact point pair with the electrical contact point of an adjacent first connection sub-portion row, except the connection regions located at both ends of the first connection sub-portion row, the first connection sub-portion row has a substantially equal size in the second direction at respective positions in the first direction, and the electrical contact point pairs in each of the connection line units are evenly distributed.