# US 12,002,915 B2 · Multi-segment monolithic LED chip > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,915 B2 - Document ID: US12002915B2 - Status: Granted - Kind: B2 - Application number: 17/579,856 - Filed: 2022-01-20 - Published: 2022-05-19 - Granted: 2024-06-04 - Earliest claimed: 2011-06-24 - Assignees: CreeLED, Inc. - Applicants: Creeled, Inc. - Inventors: Thomas Place; Kevin Ward Haberern - Web page: https://patentgrep.com/patent/US12002915B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/813: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies - H10H 20/82: Roughened surfaces, e.g. at the interface between epitaxial layers - H10H 20/8312: {extending at least partially through the bodies} - H10H 20/8506: {Containers} - H10H 29/14: comprising multiple light-emitting semiconductor components - H10W 90/00: Package configurations - H10H 20/01: Manufacture or treatment - H10H 20/018: {Bonding of wafers} - H10H 20/032: {of electrodes} - H10H 20/036: {of packages} - H10H 20/819: characterised by their shape, e.g. curved or truncated substrates - H10H 20/835: {Reflective materials} - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10H 20/858: Means for heat extraction or cooling - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H10W 70/652: Cross-sectional shapes - H10W 70/655: Fan-out layouts - H10W 72/0198: {batch processes} - H10W 72/072: {of bump connectors} - H10W 72/07232: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07236: {Soldering or alloying} - H10W 72/227: {Multiple bumps having different sizes} - H10W 72/232: {Plan-view shape, i.e. in top view} - H10W 72/237: {Multiple bump connectors having different shapes} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 72/247: {Dispositions of multiple bumps} - H10W 72/248: {Top-view layouts, e.g. mirror arrays} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/255: {of outermost layers of multilayered bumps, e.g. material of a coating} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/926: {Multiple bond pads having different sizes} - H10W 72/942: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 80/314: {characterized by direct bonding of pads or other interconnections} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract LED chips comprising pluralities of active regions on the same submount are provided. These active regions are individually addressable, such that beams output from the LEDs can be controlled simply by selectively activating the desired active region in the plurality without requiring advanced optics and reflectors comprising complex moving parts. In some embodiments, one or more active regions can surround one or more other active regions. In some embodiments, the various active regions are individually addressable by virtue of each active region comprising its own anode and sharing a common cathode. In some embodiments, the various active regions are individually addressable by virtue of each active region comprising its own cathode and sharing a common anode. In some embodiments, each active region comprises its own anode and its own cathode. ## Claims ### Claim 1 A light emitting diode (LED) chip, comprising: a submount; a plurality of active regions on said submount, wherein at least one active region of said plurality of active regions surrounds an entirety of another active region of said plurality of active regions; and metal connection elements in electrical contact with said plurality of active regions, wherein said metal connection elements are configured such that at least one active region of said plurality of active regions can receive an electrical signal independent from other active regions of said plurality of active regions; wherein at least one of said metal connection elements is an integral interconnect element extending laterally and buried within unitary insulating material of said submount below a top surface of said submount. ### Claim 2 (depends on 1) The LED chip of claim 1, wherein said plurality of active regions comprises at least three active regions with a second active region surrounding an entirety of a first active region, and with a third active region surrounding an entirety of said second active region. ### Claim 3 (depends on 1) The LED chip of claim 1, wherein at least one active region of said plurality of active regions comprises a different shape from another active region of said plurality of active regions, with a first active region of said plurality of active regions comprising a first outer border shape selected from square, circular, triangular, elliptical, hexagonal, rectangular star, and irregular polygonal, and with a second active region of said plurality of active regions comprising a second outer border shape selected from square, circular, triangular, elliptical, hexagonal, rectangular, star, and irregular polygonal, with the second outer border shape differing from the first outer border shape. ### Claim 4 (depends on 1) The LED chip of claim 1, wherein at least one of said metal connection elements comprises a bond pad in electrical contact with an active region of said plurality of active regions. ### Claim 5 (depends on 1) The LED chip of claim 1, wherein each active region of said plurality of active regions electrically contacts a different cathode connection element and a different anode connection element. ### Claim 6 (depends on 1) The LED chip of claim 1, wherein each active region of said plurality of active regions electrically contacts a different cathode connection element and electrically contacts a common anode connection element. ### Claim 7 (depends on 1) The LED chip of claim 1, wherein each active region of said plurality of active regions electrically contacts a common cathode connection element and electrically contacts a different anode connection element. ### Claim 8 (depends on 1) The LED chip of claim 1, wherein the at least one active region comprises a first active region, the another active region comprises a second active region, the first active region comprises a light emitting top side and a first top side bond pad arranged within a perimeter of the first active region, and the second active region comprises a light emitting top side and a second top side bond pad arranged within a perimeter of the second active region. ### Claim 9 A light emitting diode (LED) chip, comprising: a submount comprising a unitary insulating material; a plurality of active regions on said submount; and metal connection elements in electrical contact with said plurality of active regions, wherein said metal connection elements are configured such that at least one active region of said plurality of active regions can receive an electrical signal independent from other active regions of said plurality of active regions, and at least one of said metal connection elements comprises an internal interconnect element including a metal element comprising at least a portion extending laterally and buried within the unitary insulating material and below a top surface of said submount in a direction substantially parallel to the plurality of active regions and surrounded from above and below by the unitary insulating material, wherein a portion of the unitary insulating material is arranged between the metal element and the plurality of active regions; wherein at least one active region of said plurality of active regions surrounds an entirety of another active region of said plurality of active regions. ### Claim 10 (depends on 9) The LED chip of claim 9, wherein said plurality of active regions comprises at least three active regions with a second active region surrounding an entirety of a first active region and a third active region surrounding an entirety of said second active region. ### Claim 11 (depends on 9) The LED chip of claim 9, wherein at least one active region of said plurality of active regions comprises a different shape from another active region of said plurality of active regions, with a first active region of said plurality of active regions comprising a first outer border shape selected from square, circular, triangular, elliptical, hexagonal, rectangular, star, and irregular polygonal, and with a second active region of said plurality of active regions comprising a second outer border shape selected from square, circular, triangular, elliptical, hexagonal, rectangular, star, and irregular polygonal, and with the second outer border shape differing from the first outer border shape. ### Claim 12 (depends on 9) The LED chip of claim 9, wherein at least one of said metal connection elements comprises a bond pad in electrical contact with one active region of said plurality of active regions. ### Claim 13 (depends on 9) The LED chip of claim 9, wherein said metal connection elements comprise a plurality of cathode connection elements and a plurality of anode connection elements, and each active region of said plurality of active regions electrically contacts a different cathode connection element of the plurality of cathode connection elements and a different anode connection element of the plurality of anode connection elements. ### Claim 14 (depends on 13) The LED chip of claim 13, wherein each cathode connection element of the plurality of cathode connection elements comprises an integral interconnect element extending laterally and buried within unitary insulating material of said submount, and each anode connection element of the plurality of anode connection elements comprises an integral interconnect element extending laterally and buried within unitary insulating material of said submount. ### Claim 15 (depends on 13) The LED chip of claim 13, wherein said plurality of cathode connection elements comprises a first plurality of bond pads in electrical contact with said plurality of active regions, and said plurality of anode connection elements comprises a second plurality of bond pads in electrical contact with said plurality of active regions. ### Claim 16 (depends on 9) The LED chip of claim 9, wherein each active region of said plurality of active regions electrically contacts a separate cathode connection element and electrically contacts a common anode connection element. ### Claim 17 (depends on 9) The LED chip of claim 9, wherein each active region of said plurality of active regions electrically contacts a common cathode connection element and electrically contacts a separate anode connection element. ### Claim 18 (depends on 9) The LED chip of claim 9, wherein the at least one active region comprises a first active region, the another active region comprises a second active region, the first active region comprises a light emitting top side and a first top side bond pad arranged within a perimeter of the first active region, and the second active region comprises a light emitting top side and a second top side bond pad arranged within a perimeter of the second active region.