# US 12,002,908 B2 · Light-emitting packaging device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,908 B2 - Document ID: US12002908B2 - Status: Granted - Kind: B2 - Application number: 17/319,757 - Filed: 2021-05-13 - Published: 2021-09-30 - Granted: 2024-06-04 - Earliest claimed: 2018-11-19 - Assignees: Quanzhou Sanan Semiconductor Technology Co., Ltd. - Applicants: Quanzhou Sanan Semiconductor Technology Co., Ltd. - Inventors: Junpeng Shi; Qiuxia Lin; Weng-Tack Wong; Changchin Yu - Web page: https://patentgrep.com/patent/US12002908B2 ## CPC - C09D 127/18: Homopolymers or copolymers of tetrafluoroethene - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - C08F 214/26: Tetrafluoroethene - C08F 216/38: by an acetal or ketal radical - C09D 127/12: containing fluorine atoms - C09D 129/14: Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols - H10H 20/8506: {Containers} - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/856: Reflecting means - H10H 20/0362: {of encapsulations} - H10H 20/0363: {of optical field-shaping means} - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS ## Abstract A light-emitting packaging device includes a substrate, a light-emitting diode (LED) chip, an optical element, and a covering member. The LED chip is disposed on the substrate. The optical element is spacedly disposed on the LED chip opposite to the substrate, and has an upper surface and a lower surface that are respectively distal from and proximal to the LED chip. The covering member is made from a fluorine-containing resin, and is configured to cover the LED chip and at least a portion of the upper surface of the optical element. ## Claims ### Claim 1 A light-emitting packaging device, comprising: a substrate; a light-emitting diode (LED) chip disposed on said substrate; an optical element spacedly disposed on said LED chip opposite to said substrate, and having an upper surface and a lower surface that are respectively distal from and proximal to said LED chip; and a covering member made from a fluorine-containing resin, and being configured to cover said LED chip and at least a portion of said upper surface of said optical element, wherein said substrate is formed with a recess, said recess being defined by a recess-defining wall that has a bottom wall and a surrounding wall extending upwardly from said bottom wall, said covering member being configured to further fill a portion of said recess that is beneath said lower surface of said optical element, wherein said surrounding wall of said recess-defining wall and said upper surface of said optical element cooperatively define a gap, said covering member being configured to further fill said gap, and wherein said light-emitting packaging device further includes a platform unit protruding upwardly from said bottom wall and along said surrounding wall, said optical element being supported by said platform unit. ### Claim 2 (depends on 1) The light-emitting packaging device of claim 1, wherein said optical element further has at least one through hole penetrating from said upper surface to said lower surface, said covering member being configured to further fill said at least one through hole. ### Claim 3 (depends on 1) The light-emitting packaging device of claim 1, wherein said LED chip has an emission peak wavelength that is not greater than 385 nm. ### Claim 4 (depends on 1) The light-emitting packaging device of claim 1, wherein said platform unit is in an annular shape. ### Claim 5 (depends on 1) The light-emitting packaging device of claim 1, wherein only a portion of said optical element is supported by said platform unit, and the remaining portion of said optical element that is free from being supported by said platform unit is in cooperation with said surrounding wall of said recess-defining wall to define said gap, said covering member being configured to further fill said gap. ### Claim 6 (depends on 1) The light-emitting packaging device of claim 1, wherein said platform unit has a height which is greater than that of said LED chip and which is lower than that of said surrounding wall of said recess-defining wall. ### Claim 7 (depends on 2) The light-emitting packaging device of claim 2, wherein said optical element has a plurality of said through holes. ### Claim 8 (depends on 2) The light-emitting packaging device of claim 2, wherein said at least one through hole is located at a position that is above said recess and that is near a peripheral region of said optical element. ### Claim 9 (depends on 2) The light-emitting packaging device of claim 2, wherein said at least one through hole is defined by a hole-defining surface that is roughened and that has a roughness that is not smaller than 0.2 μm. ### Claim 10 (depends on 1) The light-emitting packaging device of claim 1, wherein said optical element includes a base and a lens which extends from said base, and which includes a curved surface serving as said upper surface of said optical element. ### Claim 11 (depends on 10) The light-emitting packaging device of claim 10, wherein said base has a flat surface serving as said lower surface of said optical element, and an imaginary line connecting a geometric center of said optical element to a geometric center of a light-emitting surface of said LED chip is perpendicular to said light-emitting surface of said LED chip. ### Claim 12 (depends on 10) The light-emitting packaging device of claim 10, wherein said optical element further includes a flange which laterally extends from said base, and which is partially supported by said platform unit, and wherein a portion of said flange that is free from being supported by said platform unit is in cooperation with said surrounding wall of said recess-defining wall to define said gap, said covering member being configured to further fill said gap. ### Claim 13 (depends on 12) The light-emitting packaging device of claim 12, wherein a portion of said flange is roughed to have a roughness that is not smaller than 0.2 μm. ### Claim 14 (depends on 1) The light-emitting packaging device of claim 1, wherein said fluorine-containing resin of said covering member is an amorphous fluorine-containing resin having a crystallinity that is not greater than 10%. ### Claim 15 (depends on 1) The light-emitting packaging device of claim 1, wherein said fluorine-containing resin of said covering member includes a copolymer obtained by copolymerization of a perfluorinated oxygen-containing heterocyclic compound and a perfluoroolefin. ### Claim 16 (depends on 1) The light-emitting packaging device of claim 1, wherein said covering member has an imaginary part of complex refractive index that is lower than 0.001 at a wavelength of 300 nm. ### Claim 17 (depends on 1) The light-emitting packaging device of claim 1, wherein said fluorine-containing resin of said covering member is represented by the following formula: wherein a percentage of n to (n+m) ranges from 40% to 60%. ### Claim 18 A light-emitting packaging device, comprising: a substrate; a light-emitting diode (LED) chip disposed on said substrate; an optical element spacedly disposed on said LED chip opposite to said substrate, and having an upper surface and a lower surface that are respectively distal from and proximal to said LED chip; and a covering member made from a fluorine-containing resin, and being configured to cover said LED chip and at least a portion of said upper surface of said optical element, wherein said fluorine-containing resin of said covering member is represented by the following formula: wherein a percentage of n to (n+m) ranges from 40% to 60%. ### Claim 19 (depends on 18) The light-emitting packaging device of claim 18, wherein: said covering member includes a first fluorine-containing layer and a second fluorine-containing layer, said first fluorine-containing layer being disposed on said substrate and covering said LED chip, and said second fluorine-containing layer being disposed on said first fluorine-containing layer opposite to said substrate and covering said at least a portion of said upper surface of said optical element, and said optical element is disposed on said first fluorine-containing layer opposite to said substrate. ### Claim 20 (depends on 18) The light-emitting packaging device of claim 18, wherein said substrate is formed with a recess, said recess being defined by a recess-defining wall that has a bottom wall and a surrounding wall extending upwardly from said bottom wall, said covering member being configured to further fill a portion of said recess that is beneath said lower surface of said optical element. ### Claim 21 (depends on 20) The light-emitting packaging device of claim 20, wherein said surrounding wall of said recess-defining wall and said upper surface of said optical element cooperatively define a gap, said covering member being configured to further fill said gap. ### Claim 22 (depends on 20) The light-emitting packaging device of claim 20, wherein said optical element is disposed on a top end of said surrounding wall opposite to said bottom wall.