# US 12,002,815 B2 · Display device and method of manufacturing the display device

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- Number: US 12,002,815 B2
- Document ID: US12002815B2
- Status: Granted
- Kind: B2
- Application number: 17/339,149
- Filed: 2021-06-04
- Published: 2022-03-24
- Granted: 2024-06-04
- Earliest claimed: 2020-09-21
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Jihyun Kim; Taewook Kang; Byungsoo So; Hyuneok Shin; Wooseok Jeon
- Web page: https://patentgrep.com/patent/US12002815B2

## CPC

- H10W 90/00: Package configurations
- H10D 86/0214: {using temporary substrates}
- H10D 86/411: {characterised by materials, geometry or structure of the substrates}
- H10D 86/423: {comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO}
- H10D 86/441: {Interconnections, e.g. scanning lines}
- H10D 86/60: wherein the TFTs are in active matrices
- H10K 59/1201: {Manufacture or treatment}
- H10K 71/80: using temporary substrates
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- H10K 59/80: Constructional details
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/921: {Structures or relative sizes of bond pads}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 80/334: {Thermocompression bonding}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/794: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A display device including a display area and a non-display area further includes a base layer including a first surface and a second surface opposite to the first surface, the base layer having, in the non-display area, an opening portion penetrating the first surface and the second surface; a pad unit including a terminal on the first surface, the pad unit extending from the first surface to the opening portion; a connection line connected to the terminal on the first surface, the connection line extending from the non-display area to the display area; an insulating layer covering the terminal and the connection line; a thin-film transistor including a semiconductor layer on the insulating layer, the thin-film transistor being connected to the connection line; and a display element connected to the thin-film transistor, the display element being in the display area.

## Claims

### Claim 1

A display device comprising a display area and a non-display area, the display device further comprising:
a base layer comprising a first surface and a second surface opposite to the first surface, the base layer having, in the non-display area, an opening portion penetrating the first surface and the second surface;
a pad unit comprising a terminal on the first surface of the base layer, the terminal extending from the first surface of the base layer to the opening portion, and forming at least one side of the opening portion;
a connection line connected to the terminal on the first surface, the connection line extending from the non-display area to the display area;
an insulating layer covering the terminal and the connection line;
a thin-film transistor comprising a semiconductor layer on the insulating layer, the thin-film transistor being connected to the connection line; and
a display element connected to the thin-film transistor, the display element being in the display area,
wherein the first surface of the base layer faces the display element, and
wherein the insulating layer is located between the connection line and the semiconductor layer, and fills the opening portion.

### Claim 2 (depends on 1)

The display device of claim 1, wherein the thin-film transistor further comprises a gate electrode overlapping the semiconductor layer, a source electrode connected to the semiconductor layer, and a drain electrode connected to the semiconductor layer,
wherein, in the display area, the connection line is connected to at least one of the gate electrode, the source electrode, or the drain electrode.

### Claim 3 (depends on 1)

The display device of claim 1, further comprising a middle connection pattern on the insulating layer,
wherein, in the display area, the middle connection pattern is connected to the connection line through a contact hole in the insulating layer, and
wherein the thin-film transistor is connected to the middle connection pattern.

### Claim 4 (depends on 1)

The display device of claim 1, further comprising a first thin-film transistor comprising polysilicon and a second thin-film transistor comprising an oxide semiconductor,
wherein the thin-film transistor is the first thin-film transistor or the second thin-film transistor.

### Claim 5 (depends on 1)

The display device of claim 1, wherein each of the insulating layer and the base layer comprises a polymer resin.

### Claim 6 (depends on 1)

The display device of claim 1, wherein a first distance from the first surface to the second surface is greater than a second distance from the first surface to a lower surface of the terminal overlapping the opening portion.

### Claim 7 (depends on 6)

The display device of claim 6, further comprising a pattern layer overlapping the opening portion, the pattern layer being on the lower surface of the terminal.

### Claim 8 (depends on 1)

The display device of claim 1, wherein a lower surface of the terminal coincides with the second surface.

### Claim 9 (depends on 1)

The display device of claim 1, further comprising a barrier layer between the insulating layer and the base layer.

### Claim 10 (depends on 1)

The display device of claim 1, further comprising a lower layer on the second surface, the lower layer having a lower opening portion overlapping the opening portion.

### Claim 11 (depends on 1)

The display device of claim 1, further comprising:
a printed circuit board on the second surface; and
a flexible printed circuit film overlapping the opening portion, the flexible printed circuit film connecting the printed circuit board and the pad unit.