# US 12,002,797 B2 · LED device and light emitting apparatus including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,797 B2 - Document ID: US12002797B2 - Status: Granted - Kind: B2 - Application number: 17/946,767 - Filed: 2022-09-16 - Published: 2023-01-19 - Granted: 2024-06-04 - Earliest claimed: 2019-01-15 - Assignees: Quanzhou Sanan Semiconductor Technology Co., Ltd. - Applicants: Quanzhou San'an Semiconductor Technology Co., Ltd. - Inventors: Junpeng Shi; Chen-Ke Hsu; Chang-Chin Yu; Yanqiu Liao; Zhenduan Lin; Zhaowu Huang; Senpeng Huang - Web page: https://patentgrep.com/patent/US12002797B2 ## CPC - H10W 90/00: Package configurations - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H10H 20/0362: {of encapsulations} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly. ## Claims ### Claim 1 An LED device comprising: a plurality of LED chips, each of said LED chips having opposite first and second surfaces, and a side surface that is connected between said first and second surfaces, and including a semiconductor stack having a first-type semiconductor layer, a second-type semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and an electrode assembly disposed on the semiconductor stack and including a first electrode and a second electrode, wherein the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer; an electric circuit layer assembly disposed on said second surfaces of said LED chips, and having opposite first and second surfaces and a side surface that is connected between said first and second surfaces of said electric circuit layer assembly, said first surface of said electric circuit layer assembly being directly and electrically connected to said first and second electrodes of said electrode assembly; an encapsulating layer enclosing said LED chips and said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said encapsulating layer; and a plurality of bond pads that are disposed on said encapsulating layer and that are electrically connected to said electric circuit layer assembly, wherein a total surface area of said bond pads is greater than a total surface area of said first surfaces of said LED chips. ### Claim 2 (depends on 1) The LED device as claimed in claim 1, wherein said first surface of each of said LED chips is exposed from said encapsulating layer. ### Claim 3 (depends on 1) The LED device as claimed in claim 1, wherein an area of said first surface of said electric circuit layer assembly is greater than an area of said second surface of said electric circuit layer assembly. ### Claim 4 (depends on 1) The LED device as claimed in claim 1, wherein said electric circuit layer assembly includes a first electric circuit layer that defines said first surface of said electric circuit layer assembly and that is electrically connected to said first and second electrodes of said electrode assembly of a corresponding one of said LED chips, and a second electric circuit layer that defines said second surface of said electric circuit layer assembly and that is disposed on said first electric circuit layer opposite to the corresponding one of said LED chips. ### Claim 5 (depends on 4) The LED device as claimed in claim 4, wherein said encapsulating layer covers said second electric circuit layer in such a manner that said second surface of said electric circuit layer assembly is exposed from said encapsulating layer. ### Claim 6 (depends on 4) The LED device as claimed in claim 4, wherein an area of a projection of said first electric circuit layer of said electric circuit layer assembly on said encapsulating layer is greater than an area of a projection of said second electric circuit layer of said electric circuit layer assembly on said encapsulating layer. ### Claim 7 (depends on 4) The LED device as claimed in claim 4, wherein a projection of said second electric circuit layer of said electric circuit layer assembly on said encapsulating layer lies within a projection of said first electric circuit layer of said electric circuit layer assembly on said encapsulating layer. ### Claim 8 (depends on 4) The LED device as claimed in claim 4, wherein said first electric circuit layer of said electric circuit layer assembly includes a plurality of first electric circuit sub-layers, and said second electric circuit layer of said electric circuit layer assembly includes a plurality of second electric circuit sub-layers. ### Claim 9 (depends on 8) The LED device as claimed in claim 8, wherein a distance between adjacent two of said second electric circuit sub-layers is greater than a distance between adjacent two of said first electric circuit sub-layers. ### Claim 10 (depends on 8) The LED device as claimed in claim 8, wherein a number of said first electric circuit sub-layers is not less than a number of said second electric circuit sub-layers. ### Claim 11 (depends on 8) The LED device as claimed in claim 8, wherein a number of said first electric circuit sub-layers is less than a number of said first and second electrodes of said electrode assemblies of said LED chips. ### Claim 12 (depends on 8) The LED device as claimed in claim 8, wherein a number of said LED chips is A, a number of said first electric circuit sub-layers is N, a number of said second electric circuit sub-layers is M, and M≤N≤2A. ### Claim 13 (depends on 8) The LED device as claimed in claim 8, wherein one of said first electric circuit sub-layers is electrically connected to said first electrodes of said electrode assemblies of said LED chips, and the remainder of said first electric circuit sub-layers are respectively and electrically connected to said second electrodes of said electrode assemblies of said LED chips. ### Claim 14 (depends on 1) The LED device as claimed in claim 1, wherein said encapsulating layer is opaque. ### Claim 15 (depends on 1) The LED device as claimed in claim 1, further comprising a protective layer that is light-transmissible, and that is disposed on said first surface of each of said LED chips. ### Claim 16 An LED device comprising: a plurality of LED chips, each of said LED chips having opposite first and second surfaces, and a side surface that is connected between said first and second surfaces, and including a semiconductor stack having a first-type semiconductor layer, a second-type semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and an electrode assembly disposed on the semiconductor stack and including a first electrode and a second electrode, wherein the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer; an electric circuit layer assembly disposed on said second surfaces of said LED chips, and having opposite first and second surfaces and a side surface that is connected between said first and second surfaces of said electric circuit layer assembly, said first surface of said electric circuit layer assembly being directly and electrically connected to said first and second electrodes of said electrode assembly; and an encapsulating layer enclosing said LED chips and said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said encapsulating layer, wherein an area of said first surface of said electric circuit layer assembly is greater than an area of said second surfaces of said LED chips. ### Claim 17 An LED device comprising: a plurality of LED chips, each of said LED chips having opposite first and second surfaces, and a side surface that is connected between said first and second surfaces, and including a semiconductor stack having a first-type semiconductor layer, a second-type semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and an electrode assembly disposed on the semiconductor stack and including a first electrode and a second electrode, wherein the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer; an electric circuit layer assembly disposed on said second surfaces of said LED chips, and having opposite first and second surfaces and a side surface that is connected between said first and second surfaces of said electric circuit layer assembly, said first surface of said electric circuit layer assembly being directly and electrically connected to said first and second electrodes of said electrode assembly; and an encapsulating layer enclosing said LED chips and said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said encapsulating layer, wherein said encapsulating layer has opposite upper and lower surfaces, said upper surface of said encapsulating layer being flush with said first surface of each of said LED chips, said lower surface of said encapsulating layer being flush with said second surface of said electric circuit layer assembly. ### Claim 18 An LED device comprising: a plurality of LED chips, each of said LED chips having opposite first and second surfaces, and a side surface that is connected between said first and second surfaces, and including a semiconductor stack having a first-type semiconductor layer, a second-type semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and an electrode assembly disposed on the semiconductor stack and including a first electrode and a second electrode, wherein the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer; an electric circuit layer assembly disposed on said second surfaces of said LED chips, and having opposite first and second surfaces and a side surface that is connected between said first and second surfaces of said electric circuit layer assembly, said first surface of said electric circuit layer assembly being directly and electrically connected to said first and second electrodes of said electrode assembly; and an encapsulating layer enclosing said LED chips and said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said encapsulating layer, wherein said encapsulating layer includes a first encapsulating sub-layer and a second encapsulating sub-layer, said first encapsulating sub-layer covering said LED chips in such a manner that said first surface of each of said LED chips is exposed from said first encapsulating sub-layer, said second encapsulating sub-layer covering said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said second encapsulating sub-layer. ### Claim 19 (depends on 18) The LED device as claimed in claim 18, wherein a height of said second encapsulating sub-layer of said encapsulating layer is equal to a height of said electric circuit layer assembly.