# US 12,002,795 B2 · Pluggable CPU modules with vertical power > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,795 B2 - Document ID: US12002795B2 - Status: Granted - Kind: B2 - Application number: 17/719,857 - Filed: 2022-04-13 - Published: 2023-10-19 - Granted: 2024-06-04 - Earliest claimed: 2022-04-13 - Assignees: Google Inc. - Applicants: Google LLC - Inventors: Houle Gan; Richard Stuart Roy; Yujeong Shim; William F. Edwards, Jr.; Chenhao Nan - Web page: https://patentgrep.com/patent/US12002795B2 ## CPC - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H10W 90/00: Package configurations - H05K 1/0231: {Capacitors or dielectric substances} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/181: associated with surface mounted components - H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components} - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/049: PCB for one component, e.g. for mounting onto mother PCB - H05K 2201/09072: Hole or recess under component or special relationship between hole and component - H05K 2201/10015: Non-printed capacitor - H05K 2201/1003: Non-printed inductor - H05K 2201/10159: Memory - H05K 2201/10166: Transistor - H05K 2201/10325: Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support - H05K 2201/10378: Interposers - H05K 2201/10409: Screws - H05K 2201/1053: Mounted components directly electrically connected to each other, i.e. not via the PCB - H05K 2201/10545: Related components mounted on both sides of the PCB - H05K 2201/10704: Pin grid array [PGA] - H05K 2201/10719: Land grid array [LGA] - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contacts that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board. An assembly includes the pluggable processor module and a printed circuit board assembly (“PCBA”) including a module aperture that is large enough to receive the power board and narrower than the capacitor board. ## Claims ### Claim 1 An assembly comprising: a pluggable processor module comprising: a microprocessor package; a voltage regulator including a capacitor board, a power board, and conductive pillars connecting the capacitor board to the power board; and a contact that includes a first side in contact with the microprocessor package and a second side in contact with the capacitor board; and a printed circuit board assembly (“PCBA”) including a module aperture that is large enough to receive the power board and narrower than the capacitor board. ### Claim 2 (depends on 1) The assembly of claim 1, the contact is monolithic. ### Claim 3 (depends on 1) The assembly of claim 1, wherein the capacitor board is wider than the microprocessor package. ### Claim 4 (depends on 1) The assembly of claim 1, wherein the capacitor board includes an electronic communication interface on a side that faces away from the microprocessor package. ### Claim 5 (depends on 1) The assembly of claim 1, wherein the voltage regulator comprises a power board and conductive pillars electrically connecting the capacitor board to the power board. ### Claim 6 (depends on 1) The assembly of claim 1, wherein the PCBA includes a first electronic communication interface and the voltage regulator includes a second electronic communication interface configured to align with the first electronic communication interface when the power board is received in the module aperture. ### Claim 7 (depends on 1) The assembly of claim 1, wherein the PCBA includes a first bolt hole and the capacitor board includes a second bolt hole located to be alignable with the first bolt hole when the power board is received in the module aperture. ### Claim 8 (depends on 1) The assembly of claim 1, wherein the capacitor board is wider than the microprocessor package. ### Claim 9 (depends on 1) The assembly of claim 1, wherein the module is among a plurality of pluggable processor modules each including a microprocessor package and a voltage regulator that includes a power board receivable in the module aperture. ### Claim 10 (depends on 1) The assembly of claim 1, wherein the module aperture is a first module aperture and the PCBA includes a second module aperture that is large enough to receive the power board and narrower than the capacitor board. ### Claim 11 (depends on 1) The assembly of claim 1, wherein the module aperture is a hole extending through the PCBA from a first side of the PCBA to a second side of the PCBA. ### Claim 12 (depends on 5) The assembly of claim 5, wherein the capacitor board includes a bolt hole and a conductive line extending from the bolt hole to one of the conductive pillars. ### Claim 13 (depends on 5) The assembly of claim 5, wherein the voltage regulator includes inductors extending through the power board and transistors on a side of the power board facing away from the capacitor board. ### Claim 14 (depends on 6) The assembly of claim 6, wherein the first electronic communication interface is adjacent to the module aperture and the second electronic communication interface is on a side of the capacitor board that faces away from the microprocessor package. ### Claim 15 (depends on 6) The assembly of claim 6, wherein the second electronic communication interface is a land grid array or a pin grid array. ### Claim 16 (depends on 6) The assembly of claim 6, wherein the PCBA includes a memory aperture in electronic communication with the first electronic communication interface. ### Claim 17 (depends on 6) The assembly of claim 6, wherein the PCBA is configured to supply power to the first electronic communication interface. ### Claim 18 (depends on 7) The assembly of claim 7, wherein the PCBA is configured to supply voltage to the first bolt hole and the capacitor board includes a conductive line extending from the second bolt hole to one of the conductive pillars. ### Claim 19 A method comprising plugging a pluggable processor module into a module aperture of a PCBA, wherein: the pluggable processor module comprises: a microprocessor package; a voltage regulator including a capacitor board, a power board, and conductive pillars connecting the capacitor board to the power board; and a contact that includes a first side in contact with the microprocessor package and a second side in contact with the capacitor board; and plugging the pluggable processor module into the module aperture includes inserting a portion of the voltage regulator into the module aperture and placing an electronic communication interface of the PCBA in contact with an electronic communication interface of the pluggable processor module.