# US 12,002,792 B2 · Method and system for transferring alignment marks between substrate systems > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,002,792 B2 - Document ID: US12002792B2 - Status: Granted - Kind: B2 - Application number: 17/989,770 - Filed: 2022-11-18 - Published: 2023-05-04 - Granted: 2024-06-04 - Earliest claimed: 2020-05-11 - Assignees: SemiLEDs Corporation; Shin-Etsu Chemical Co., Ltd. - Applicants: SemiLEDs Corporation; Shin-Etsu Chemical Co. Ltd. - Inventors: David Trung Doan; Yoshinori Ogawa; Nobuaki Matsumoto - Web page: https://patentgrep.com/patent/US12002792B2 ## CPC - H10P 72/74: {using temporarily an auxiliary support} - H10W 90/00: Package configurations - H10H 20/018: {Bonding of wafers} - H10P 72/50: for positioning, orientation or alignment - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 72/073: {of die-attach connectors} - H10P 72/7408: {the auxiliary support including alignment aids} - H10P 72/7434: {used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate} - H10W 46/301: {for alignment} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system. ## Claims ### Claim 1 A system for transferring alignment marks between substrate systems comprising: a substrate comprising a plurality of semiconductor devices and a plurality of alignment marks in alignment with the semiconductor devices, the alignment marks comprising physical structures that can be physically transferred between substrate systems; and a first substrate system comprising a temporary substrate having an adhesive layer thereon configured to contact and apply adhesive forces to the semiconductor devices and the alignment marks, the temporary substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks, the adhesive layer configured to maintain the adhesive forces during bonding and separating of the substrate from the temporary substrate. ### Claim 2 (depends on 1) The system of claim 1 further comprising a second substrate system comprising a mass transfer substrate having a second adhesive layer thereon, the mass transfer substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks. ### Claim 3 (depends on 1) The system of claim 1 further comprising a third substrate system comprising a circuitry substrate having a plurality of circuits and a plurality of circuitry alignment marks in alignment with the circuits, the circuitry substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks. ### Claim 4 (depends on 1) The system of claim 1 wherein the substrate comprises a semiconductor substrate having epitaxial structures that form the semiconductor devices and the alignment marks. ### Claim 5 (depends on 1) The system of claim 1 wherein the alignment marks comprise portions of an epitaxial structure, a deposited material, or a combination thereof formed on the substrate as physically transferrable structures. ### Claim 6 (depends on 1) The system of claim 1 wherein the alignment marks comprise stickers. ### Claim 7 (depends on 1) The system of claim 1 wherein the semiconductor devices include contacts co-planar to surfaces of the alignment marks. ### Claim 8 A system for transferring alignment marks between substrates comprising: a first substrate comprising a plurality of semiconductor devices and a plurality of alignment marks in alignment with the semiconductor devices, the alignment marks comprising physical structures; and a second substrate having an adhesive layer thereon configured to contact and apply adhesive forces to the semiconductor devices and the alignment marks, the second substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks, the adhesive layer configured to maintain the adhesive forces during bonding and separating of the substrate from the temporary substrate. ### Claim 9 (depends on 8) The system of claim 8 wherein the first substrate comprises a temporary substrate in a first substrate system. ### Claim 10 (depends on 8) The system of claim 8 further comprising a mass transfer substrate having a second adhesive layer thereon, the mass transfer substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks. ### Claim 11 (depends on 8) The system of claim 8 further comprising a circuitry substrate having a plurality of circuits and a plurality of circuitry alignment marks in alignment with the circuits, the circuitry substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks. ### Claim 12 (depends on 8) The system of claim 8 wherein the substrate comprises a semiconductor substrate having epitaxial structures that form the semiconductor devices and the alignment marks. ### Claim 13 (depends on 8) The system of claim 8 wherein the alignment marks comprise portions of an epitaxial structure, a deposited material, or a combination thereof formed on the substrate as physically transferrable structures. ### Claim 14 (depends on 8) The system of claim 8 wherein the alignment marks comprise stickers. ### Claim 15 (depends on 8) The system of claim 8 wherein the semiconductor devices include contacts co-planar to surfaces of the alignment marks. ### Claim 16 A method for transferring alignment marks between substrates comprising: providing a substrate comprising a plurality of semiconductor devices and a plurality of alignment marks; providing a second substrate having an adhesive layer configured to contact and apply adhesive forces to the semiconductor devices and the alignment marks on the substrate; bonding the semiconductor devices and the alignment marks on the substrate to the adhesive layer on the second substrate; and separating the substrate from the second substrate leaving the semiconductor devices and the alignment marks on the adhesive layer on the second substrate. ### Claim 17 (depends on 16) The method of claim 16 wherein the semiconductor devices comprise epitaxial structures. ### Claim 18 (depends on 16) The method of claim 16 wherein the separating step is performed using a method selected from the group consisting of a thermal method, an optical method, a mechanical method, and an electrical method.